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| Number | Title | Issue Date |
| 7955487 | Device and method for electrolytically treating flat work pieces The invention relates to a device and method for electrolytically treating flat work pieces (1), more especially for electrolytically treating electrically conductive structures S that are electrically insulated against each other on the surfaces of the work ... | 06/07/2011 |
| 7842176 | Method for horizontally electroplating, electro deposition and electroless-plating thin film on substrate A method for horizontally electroplating or electro deposition a thin film on a substrate comprises the steps of transferring and positioning a substrate on a substrate supporter; the substrate being positioned approximately horizontally; moving a plurality of stop ... | 11/30/2010 |
| 7491308 | Method of making rolling electrical contact to wafer front surface Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second ... | 02/17/2009 |
| 7476304 | Apparatus for processing surface of workpiece with small electrodes and surface contacts Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the wor... | 01/13/2009 |
| 7438794 | Method of copper electroplating to improve gapfill A copper electroplating bath composition and a method of copper electroplating to improve gapfill are provided. The method of electroplating includes providing an aqueous electroplating composition, comprising copper, at least one acid, at least one halogen ion, an ... | 10/21/2008 |
| 7381318 | Method of manufacturing biaxially textured metallic layer featured by electroplating on the surface of single-crystalline or quasi-single-crystalline metal surface, and articles therefrom Disclosed herein are a biaxially textured pure metal or alloy layer deposited by electroplating process on the surface of a single-crystalline or quasi-single-crystalline metal substrate, and a method for manufacturing the biaxially textured pure metal or alloy laye... | 06/03/2008 |
| 7349223 | Enhanced compliant probe card systems having improved planarity Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more ... | 03/25/2008 |
| 7335288 | Methods for depositing copper on a noble metal layer of a work piece Methods for electrodeposition of copper on a noble metal layer of a work piece are provided. An exemplary method includes exposing the noble metal layer to an electrodeposition composition. The electrodeposition composition comprises a copper salt, a suppressor, an ... | 02/26/2008 |
| 7332198 | Plating apparatus and plating method There is provided a plating apparatus and method which can control the temperature of a plating solution during plating more uniformly and easily form a uniform plated film on the to-be-plated surface of a workpiece, and which can simplify the device and decrease th... | 02/19/2008 |
| 7309413 | Providing electrical contact to the surface of a semiconductor workpiece during processing Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second ... | 12/18/2007 |
| 7306710 | Apparatus and method for electroplating a metallic film on a rocket engine combustion chamber component A tank is utilized for containing a plating solution. A rotatable support assembly rotatably supports a combustion chamber component relative to the tank for providing partial immersion of the combustion chamber component within the plating solution. An anode is pos... | 12/11/2007 |
| 7294244 | Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with another independent aspect of the present invention, the workpiece processing station is adapted for adjusting the level of the processing... | 11/13/2007 |
| 7288178 | Methods of and apparatus for making high aspect ratio microelectromechanical structures Various embodiments of the invention provide techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks th... | 10/30/2007 |
| 7289296 | Thin-film magnetic head having magnetic gap formed of NiP A gap of a thin-film magnetic head is formed of NiP. The P content of the NiP gap layer is controlled to be within the range of 11 mass percent to 14 mass percent so that the gap layer is nonmagnetic. ... | 10/30/2007 |
| 7285191 | Phosphate film processing method and phosphate film processing device A phosphate coating apparatus for depositing a phosphate coating on a metal material by electrolyzing the metal material in a predetermined electrolysis solution includes a positive electrode and a negative electrode, of which one electrode being disposed in contact... | 10/23/2007 |
| 7278911 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly th... | 10/09/2007 |
| 7270735 | System and method for holding and releasing a workpiece for electrochemical machining A system and method are described for holding and releasing a workpiece for electrochemical machining. In one embodiment, a workpiece holder has a workpiece surface that couples to the workpiece when negative pressure is applied to provide a seal between the workpie... | 09/18/2007 |
| 7247563 | Filling high aspect ratio openings by enhanced electrochemical deposition (ECD) One embodiment of the invention is a method for void-free filling with a metal or an alloy inside openings by electrochemical deposition (ECD), said method including steps of: (a) providing a substrate with at least one opening and a field surrounding the at least o... | 07/24/2007 |
| 7241366 | Continuous coating process A system for coating variable and/or unlimited length parts is provided. The system comprises a process tank, a coating material supply, and an open-ended process tank conveyor is provided. The process tank comprises an entry port, an exit port opposite the entry po... | 07/10/2007 |
| 7229398 | Circular-shaped metal structure and method of fabricating the same A circular-shaped metal structure is fabricated by plastic-working and has a wall thickness in the range of 0.03 mm to 0.09 mm both inclusive. A film composed of one of (a) silicon and fluorocarbon resin and (b) copper is coated on a surface of the circular-shaped m... | 06/12/2007 |
| 7226860 | Method and apparatus for fabricating metal layer A method of electrochemical deposition (ECD) provides a barrier and a seed layer on a substrate. The surfaces of the substrate are pre-treated before a metal layer is electrochemically deposited thereon in an electrochemical plating cell with a physical or a chemica... | 06/05/2007 |
| 7217353 | Method and apparatus for plating substrate After bubbles adsorbed to a substrate are removed by rotating the substrate in a plating solution at a higher speed or after the wettability of the surface of the substrate to be plated is improved before the substrate is immersed in the plating solution, the substr... | 05/15/2007 |
| 7211174 | Method and system to provide electrical contacts for electrotreating processes Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented. ... | 05/01/2007 |
| 7207878 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted t... | 04/24/2007 |
| 7208074 | Substrate processing apparatus and substrate plating apparatus A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a s... | 04/24/2007 |
| 7204917 | Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same The present invention is directed to a top surface of a workpiece surface influencing device and a method of using the same. The top surface of the workpiece surface influencing device is adapted for use in an electrochemical mechanical processing apparatus in which... | 04/17/2007 |
| 7204918 | High efficiency plating apparatus and method An improved apparatus for treating plate-like workpieces with a designated chemical solution, including printed circuit boards, includes: (1) a tray for holding the chemical solution, with the tray having an open top which is configured to receive a horizontally-ori... | 04/17/2007 |
| 7204924 | Method and apparatus to deposit layers with uniform properties The present invention provides a method for forming a conductive film with uniform properties on a wafer surface that has features or cavities. During the process, the workpiece is rotated and laterally moved while an electrodeposition solution is delivered onto the... | 04/17/2007 |
| 7201829 | Mask plate design The present invention includes a mask plate design that includes at least one or a plurality of channels portions on a surface of the mask plate, into which electrolyte solution will accumulate when the mask plate surface is disposed on a surface of wafer, and out o... | 04/10/2007 |
| 7195796 | Polymeric coating formulations and steel substrate composites A process is provided for making a composite work article suitable for fabricating rigid sheet metal can components. A steel sheet having first and second surfaces is pre-treated to enhance reception and retention of a multi-layer polymer coating on the pre-treated ... | 03/27/2007 |
| 7192494 | Method and apparatus for annealing copper films A method and apparatus for annealing copper. The method comprises forming a copper layer by electroplating on a substrate in an integrated processing system and annealing the copper layer in a chamber inside the integrated processing system. ... | 03/20/2007 |
| 7189313 | Substrate support with fluid retention band An apparatus and method for supporting a substrate is provided. In one embodiment, an apparatus for supporting a substrate includes a body having a band extending therefrom. The band is adapted to retain a fluid on the body thereby forming a shallow processing bath ... | 03/13/2007 |
| 7178238 | Method of producing a workpiece having at least one bearing eye A method of producing a workpiece (1) having at least one bearing eye (2) is described, the bearing eye (2) being coated with an anti-friction coating (4), which forms a running surface deviating from a circular cylinder. In order to prov... | 02/20/2007 |
| 7172785 | Process for deposition of metal on a surface The invention relates to a process for depositing a metal on a material. The process comprises the steps of: immersing the material in deposition solution comprising the metal; inducing a material vibration in the deposition solution having a frequency corresponding... | 02/06/2007 |
| 7172684 | Methods of and apparatus for making high aspect ratio microelectromechanical structures Various embodiments of the invention provide techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks th... | 02/06/2007 |
| 7166204 | Plating apparatus and method A plating apparatus and method which smoothly perform contact of a plating liquid with a surface of the substrate and which can prevent air bubbles from remaining on the surface to be plated. The plating apparatus includes a plating bath containing a plating liquid ... | 01/23/2007 |
| 7163614 | Methods of and apparatus for making high aspect ratio microelectromechanical structures Various embodiments of the invention provide techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks th... | 01/16/2007 |
| 7163613 | Method of manufacturing a semiconductor device by forming plating layers having differing thicknesses There is provided a semiconductor device comprising: a first plating layer formed on one surface of an interconnect pattern; a second plating layer formed within through holes in the interconnect pattern; a semiconductor chip electrically connected to the first plat... | 01/16/2007 |
| 7160428 | Plating machine and process for producing film carrier tapes for mounting electronic parts A plating machine for plating a film carrier tape for mounting electronic parts includes a plating tank for plating wiring patterns of a film carrier tape and also has a bubble adhesion prevention means that is position adjustable with respect to the surface of a pl... | 01/09/2007 |
| 7153410 | Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces. One embodiment of an electrochemical processing apparatus in accordance with the invention comprises a workpiece holder configured to receive a microelectronic workpiece... | 12/26/2006 |
