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| Number | Title | Issue Date |
| 7918982 | Production device and production method for conductive nano-wire The object of the disclosure is to provide a nano-scale molecular assembly such as a conductive nano-wire. Specifically, there is provided an electrochemical apparatus for forming a molecular assembly, including two electrodes and an electrochemical cell holding an ... | 04/05/2011 |
| 7301190 | Structures and methods to enhance copper metallization Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary structure includes an inhibiting layer between an insulator and a meta... | 11/27/2007 |
| 7297247 | Electroformed sputtering target A method of fabricating a sputtering target for sputter depositing material onto a substrate in a sputtering chamber is described. In one embodiment of the method, a preform having a surface is formed and a layer of sputtering material is electroplated onto the surf... | 11/20/2007 |
| 7285196 | Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals In recent years, copper wiring has emerged as a promising substitute for the aluminum wiring in integrated circuits, because copper offers lower electrical resistance and better reliability at smaller dimensions than aluminum. However, use of copper typically requir... | 10/23/2007 |
| 7262505 | Selective electroless-plated copper metallization Structures and methods are provided which include a selective electroless copper metallization. The present invention includes a novel methodology for forming copper vias on a substrate, including depositing a thin film seed layer of Palladium (Pd) or Copper (Cu) on... | 08/28/2007 |
| 7262130 | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals Integrated circuits, the key components in thousands of electronic and computer products, include interconnected networks of electrical components. The components are typically wired, or interconnected, together with aluminum wires. In recent years, researchers have... | 08/28/2007 |
| 7253521 | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals Integrated circuits include networks of electrical components that are typically wired, or interconnected, together with aluminum wires. In recent years, researchers have begun using copper in combination with diffusion barriers, rather than aluminum, to form the wi... | 08/07/2007 |
| 7251140 | Display apparatus having heat dissipating structure for driver integrated circuit A display apparatus dissipates heat efficiently from a tape carrier package driver integrated circuit providing an address voltage to a display panel. The display apparatus includes a display panel, a chassis base, a driving circuit, an flexible printed circuit elec... | 07/31/2007 |
| 7243421 | Electrical connection of components A contact of a component is electrically connected to an associated contact of an electrical circuit, typically formed on a substrate, by depositing material between the contacts, the material forming or being processed to form an electrical connection between the c... | 07/17/2007 |
| 7223329 | Active slender tubes and method of making the same A method of making an active slender tube as implemented as a catheter, guide wire, or any other medical or non-medical micro-mechanical or -system or system's active micro-component is disclosed, comprising preparing an actuator made from a shape memory alloy (SMA)... | 05/29/2007 |
| 7220665 | H plasma treatment Electronic devices are constructed by a method that includes forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, forming a core conductive layer on the first conductive layer, subjecting the core conductive l... | 05/22/2007 |
| 7210227 | Decreasing thermal contact resistance at a material interface A heat sink assembly in which the interface material is chemically bonded to both the heat source material and the heat sink material. The chemical bonding can lower the contact resistance that would otherwise exist using conventional adhesives to attach the heat si... | 05/01/2007 |
| 7188417 | Advanced L-channel welded nozzle design A fluid flow nozzle is formed by a plurality of adjacent L-shaped channels forming successive channel pairs. Each channel has a linking member joined to a radial member. Each linking member is welded to an adjacent linking member forming a contiguous surface of link... | 03/13/2007 |
| 7153759 | Method of fabricating microelectromechanical system structures A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stackin... | 12/26/2006 |
| 7148554 | Discrete electronic component arrangement including anchoring, thermally conductive pad An electronic component arrangement includes a discrete electronic component having first and second terminals and a centre-exposed pad. A substrate has a first electrical conductor electrically connected to the first terminal, a second electrical conductor electric... | 12/12/2006 |
| 7120005 | Electromagnetic interference shields and methods of manufacture The invention teaches improved materials and processes for production of structures to shield against ingress or egress of electromagnetic radiation. The structures and processes taught are based on the recognition and use of directly electroplateable resins. The di... | 10/10/2006 |
| 7115182 | Anodic bonding process for ceramics A method of bonding components comprising the following steps. At least a first ceramic component and a second ceramic component are provided. A first conductive layer is formed over the upper surface of the first ceramic component. An intermediate film is formed ov... | 10/03/2006 |
| 7105914 | Integrated circuit and seed layers Structures are provided which improve performance in integrated circuits. The structures include a diffusion barrier and a seed layer in an integrated circuit both formed using a low energy ion implantation followed by a selective deposition of metal lines for the i... | 09/12/2006 |
| 7091611 | Multilevel copper interconnects with low-k dielectrics and air gaps Structures and methods are provided for an improved multilevel wiring interconnect in an integrated circuit assembly. The present invention provides for a multilayer copper wiring structure by electroless, selectively deposited copper in a streamlined process which ... | 08/15/2006 |
| 7084350 | Green ceramic insert, ceramic insert, ceramic green body or green body composite and ceramic laminated composite produced thereby A green ceramic insert having a green ceramic body provided with a recess extending through the ceramic body is provided, the recess being filled with a paste which may be converted into an electrical plated hole. A ceramic insert made from a sintered green ceramic ... | 08/01/2006 |
| 7067421 | Multilevel copper interconnect with double passivation Structures and methods provide multilevel wiring interconnects in an integrated circuit assembly which alleviate problems associated with integrated circuit size and performance and include methods for forming multilevel wiring interconnects in an integrated circuit... | 06/27/2006 |
| 7048840 | Method for metal coating the surface of high temperature superconductors The invention relates to a method for metal coating the surface of high temperature superconductors with a copper-oxygen base structure. The aim of the invention is to achieve a method as above, which requires a low production complexity, serves for the production o... | 05/23/2006 |
| 7029565 | Method of producing optical element forming die A method of producing a die for forming an optical element including; a positioning step to fix temporarily under the state wherein a plurality of members at least one of which has a die transfer surface are positioned with their connection surfaces being put to fac... | 04/18/2006 |
| 7025110 | Method and apparatus for setting odd-shaped precious stones A piece of jewelry such a pendant is first cast in wax to provide a wax replica thereof. A gemstone is heated above the melting temperature of the wax replica and is pressed therein. Alternatively, the gemstone is positioned on the surface of the wax replica and pre... | 04/11/2006 |
| 6995470 | Multilevel copper interconnects with low-k dielectrics and air gaps Structures and methods are provided for an improved multilevel wiring interconnect in an integrated circuit assembly. The present invention provides for a multilayer copper wiring structure by electroless, selectively deposited copper in a streamlined process which ... | 02/07/2006 |
| 6974723 | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials A composition including an amount of at least one vinyl terminated polymer; an amount of at least one cross-linker comprising a terminal Si—H unit; an amount of at least one thermally conductive first filler, and at least one thermally conductive second filler, wh... | 12/13/2005 |
| 6972154 | Anodically bonded device structure We have developed a method of anodic bonding which directs cations to a location within a bonding structure which is away from critical bonding surfaces. This prevents the formation of compounds comprising the cations at the critical bonding surfaces. The anodic bon... | 12/06/2005 |
| 6960370 | Methods of forming medical devices Medical devices that include oxidizable portions can be plated after a two step activation process that includes successive applications of two aqueous solutions of ammonium bifluoride. Once plated, such materials can be soldered using conventional solders and fluxe... | 11/01/2005 |
| 6958548 | Semiconductor device with magnetically permeable heat sink A semiconductor device is attached to a heat sink by glue that is both thermally conductive and magnetically permeable. The glue fills different features in the surface of the semiconductor device so that there is good coupling between the semiconductor device and t... | 10/25/2005 |
| 6933230 | Method for making interconnects and diffusion barriers in integrated circuits The inventor devised methods of forming interconnects that result in conductive structures with fewer voids and thus reduced electrical resistance. One embodiment of the method starts with an insulative layer having holes and trenches, fills the holes using a select... | 08/23/2005 |
| 6907920 | Heat exchanger panel The present invention relates to a heat exchanger panel which has broad utility in high temperature environments. The heat exchanger panel has a first panel, a second panel, and at least one fluid containment device positioned intermediate the first and second panel... | 06/21/2005 |
| 6881369 | Microelectroforming mold using a preformed metal as the substrate and the fabrication method of the same The invention discloses a microelectroforming mold using a preformed metal as the substrate and its fabrication method. Using a preformed metal as the substrate can avoid deformation of the microelectroforming mold due to residual stress in the electroforming metal.... | 04/19/2005 |
| 6823693 | Anodic bonding A controller is used with an anodic bonding system that has a charge flowpath for supplying charge to bond materials together. The controller includes a switch and a circuit. The switch is configured to control a flow of the charge through the charge flowpath. The c... | 11/30/2004 |
| 6825512 | Micromachined sensor with insulating protection of connections An active part of a sensor is formed, for example, by micro-machined silicon wafers bearing electronic elements, electrical conductors, connection pads, and pins. The pads are electrically connected to the pin ends by conductive elements. Then the wafer and the pin ... | 11/30/2004 |
| 6761813 | Heat transfer through covalent bonding of thermal interface material A thermal interface material may be covalently bonded to a bottom surface of a heat dissipating device and/or a backside surface of a heat generating device. The heat dissipating device may be thermally coupled to the heat generating device, the thermal interface ma... | 07/13/2004 |
| 6644537 | Manufacturing method for bonded electroforming metallic mold Manufacturing method for bonded electroforming metallic mold, including steps of: 1. preparation of metallic material 2. preparation of electroforming metallic plate and plastic mold core and electroforming substrate; 3. preparation of power supply; 4. fo... | 11/11/2003 |
| 6364247 | Pneumatic flotation device for continuous web processing and method of making the pneumatic flotation device The present invention provides a pneumatic flotation device for use in a continuous web processing system for continuously processing paper and other flexible materials and a method of making the pneumatic flotation device. The pneumatic floatation device... | 04/02/2002 |
| 6350363 | Electric field directed construction of diodes using free-standing three-dimensional components A process of making an electric current rectifying device using spatially coupled bipolar electrochemical deposition includes (a) placing at least two electrically conductive substrates, which may be a source of electrically conductive material, or a sepa... | 02/26/2002 |
| 6277261 | Method of producing electrolyte units by electrolytic deposition of a catalyst In a method for the manufacture of an electrode-electrolyte unit with a catalytically active layer a metal salt solution is placed layer-like between an electrolyte layer and an electrolyte and the metal in the metal salt solution is precipitated from the... | 08/21/2001 |
| 6212745 | Method for setting stones in the surface of a jewel produced by electroforming A method for setting stones in the surface of a jewel produced by electroforming, comprising the following steps: producing a base having external shapes and dimensions with a thickness close to the gold film forming the wall of the jewel to be produced a... | 04/10/2001 |
