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| Number | Title | Issue Date |
| 7988842 | Continuous copper electroplating method A continuous copper electroplating method wherein copper is continuously plated on a workpiece to be placed in a plating vessel accommodating a copper sulfate plating bath containing organic additives by use of a soluble or insoluble anode and a workpiece as a catho... | 08/02/2011 |
| 7914658 | Electroplating apparatus An apparatus for electroplating a rotogravure cylinder out of a plating solution is disclosed. The apparatus includes a plating tank adapted to support the cylinder and to contain a plating solution so that the cylinder is at least partially disposed into the platin... | 03/29/2011 |
| 7892411 | Electrolytic copper plating process Disclosed herein is an electrolytic copper plating process for electroplating copper on workpieces in a copper sulfate plating bath filled in a plating tank and containing an organic additive while using a soluble anode or insoluble anode as an anode and the workpie... | 02/22/2011 |
| 7431815 | Method to reduce ferric ions in ferrous based plating baths A process for cathodically reducing unwanted Fe+3 ions to needed Fe+2 ions in an acidic ferrous based plating bath without reducing agents is disclosed. An auxiliary potential of 0.1 to 0.3 volts vs. SCE is applied between the working electrode... | 10/07/2008 |
| 7427344 | Methods for determining organic component concentrations in an electrolytic solution The present invention relates to a method and apparatus for determining organic additive concentrations in a sample electrolytic solution, preferably a copper electroplating solution, by measuring the double layer capacitance of a measuring electrode in such sample ... | 09/23/2008 |
| 7371311 | Modified electroplating solution components in a low-acid electrolyte solution An embodiment of the invention provides a method for reducing within die thickness variations by modifying the concentration of components of a low-acid electroplating solution. For one embodiment, the leveler concentration is increased sufficiently to reduce within... | 05/13/2008 |
| 7323096 | Method for treating the surface of object and apparatus thereof A method for treating the surface of an object to be treated includes introducing a surface treatment fluid into a reaction vessel (4) capable of receiving an object, introducing-the surface treatment fluid into a separation vessel (14) after the objec... | 01/29/2008 |
| 7316772 | Defect reduction in electrodeposited copper for semiconductor applications A method for electroplating a copper deposit onto a semiconductor integrated circuit device substrate having submicron-sized features, and a concentrate for forming a corresponding electroplating bath. A substrate is immersed into an electroplating bath formed from ... | 01/08/2008 |
| 7300602 | Selective barrier metal polishing solution The polishing solution is useful for removing barrier materials in the presence of interconnect metals and dielectrics. The polishing solution comprises, by weight percent, 0.1 to 10 hydrogen peroxide, at least one pH adjusting agent selected from the group consisti... | 11/27/2007 |
| 7294040 | Method and apparatus for supporting a microelectronic substrate relative to a planarization pad A method and apparatus for planarizing a microelectronic substrate. In one embodiment, one surface of the microelectronic substrate is engaged with a planarizing pad and the opposite surface of the microelectronic substrate is positioned proximate to a substrate sup... | 11/13/2007 |
| 7288170 | Process for producing a ready-to-use electrolyte A process is intended to allow simple and particularly reliable electrolyte generation and conditioning from metal-containing used electrolytes and/or used process solutions and/or pulverulent metal wastes. For this purpose, waste products containing metal ions from... | 10/30/2007 |
| 7279079 | Plating apparatus, cartridge and copper dissolution tank for use in the plating apparatus, and plating method A plating apparatus provided with: three copper dissolution tanks connected to a plating liquid circulation path for supplying copper ions to a plating liquid; a buffer container for supplying a replacement liquid into some of the copper dissolution tanks not in use... | 10/09/2007 |
| 7276293 | Far-infrared radiator and method for producing method The present invention discloses a far infrared radiator used in various types of heating equipment. This far infrared radiator is comprised of a base material 1 composed of aluminum or aluminum alloy, and an electrolytic colored film 2 formed on this b... | 10/02/2007 |
| 7273537 | Method of production of metal particles through electrolysis A method of producing metal particles through electrolysis. A cathode having a plurality of active zones on a surface thereof is at least partially immersed in a reaction solution. The cathode is spaced from an anode also at least partially immersed in the reaction ... | 09/25/2007 |
| 7273539 | Method for regeneration of an electrolysis bath for the production of a compound I-III-VIin thin layers The invention relates to the regeneration of an electrolysis bath for the production of I-III-VIY compounds in thin layers, where y is approaching 2 and VI is an element including selenium, whereby selenium is regenerated in the form Se(IV) and/or with addi... | 09/25/2007 |
| 7264704 | Electrolysis cell for restoring the concentration of metal ions in electroplating processes It is described an electrolysis cell wherein the anodic dissolution of metals is carried out, in particular of metals characterised by a relatively high oxidation potential, such as copper, or metals with high hydrogen overpotential, for example tin, aimed at restor... | 09/04/2007 |
| 7244677 | Method for filling recessed micro-structures with metallization in the production of a microelectronic device A method for filling recessed micro-structures at a surface of a semiconductor wafer with metallization is set forth. In accordance with the method, a metal layer is deposited into the micro-structures with a process, such as an electroplating process, that generate... | 07/17/2007 |
| 7229543 | Apparatus for controlling and/or measuring additive concentration in an electroplating bath A method for measuring a target constituent of an electroplating solution using an electroanalytical technique is set forth in which the electroplating solution includes one or more constituents whose by-products skew an initial electrical response to an energy inpu... | 06/12/2007 |
| 7226857 | Front-end processing of nickel plated bond pads A front-end method of fabricating nickel plated caps over copper bond pads used in a memory device. The method provides protection of the bond pads from an oxidizing atmosphere without exposing sensitive structures in the memory device to the copper during fabricati... | 06/05/2007 |
| 7211175 | Method and apparatus for potential controlled electroplating of fine patterns on semiconductor wafers Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are provided to mitigate corrosion of a metal seed layer on recessed features du... | 05/01/2007 |
| 7195700 | Method of electroplating copper layers with flat topography A method of electrochemically filling features on a wafer surface to form a substantially planar copper layer is provided. The features to be filled includes a first feature that is an unfilled feature with the smallest width and a second feature having the next lar... | 03/27/2007 |
| 7189313 | Substrate support with fluid retention band An apparatus and method for supporting a substrate is provided. In one embodiment, an apparatus for supporting a substrate includes a body having a band extending therefrom. The band is adapted to retain a fluid on the body thereby forming a shallow processing bath ... | 03/13/2007 |
| 7189146 | Method for reduction of defects in wet processed layers The present invention provides a method and apparatus for wet processing of a conductive layer using a degassed process solution such as a degassed electrochemical deposition solution, a degassed electrochemical polishing solution, a degassed electroless deposition ... | 03/13/2007 |
| 7186326 | Efficient analysis of organic additives in an acid copper plating bath Suppressor and anti-suppressor additives in an acid copper sulfate plating bath are analyzed by the cyclic voltammetric stripping (CVS) method without cleaning or rinsing the cell between the two analyses. The suppressor analysis is performed first and the suppresso... | 03/06/2007 |
| 7179359 | Cup-shaped plating apparatus Provided is a cup-shaped plating apparatus which can plate the whole area of a plating target surface with a uniform film thickness. In a cup-shaped plating apparatus including a placement portion of an object to be plated which is provided at an opening end of a pl... | 02/20/2007 |
| 7172683 | Method of managing a plating liquid used in a plating apparatus The concentration of a leveler in a plating liquid that is used by a plating apparatus for filling metal such as copper in interconnection trenches and holes defined in the surface of a semiconductor substrate or the like is determined based on a peak area (Ar value... | 02/06/2007 |
| 7166203 | Controlled concentration electrolysis system A system for maintaining a concentration range of an electroreducible metal species undergoing electrolysis within a predetermined concentration range comprises a first container containing a body of an electrolyte solution in which a metal is partially dissolved, a... | 01/23/2007 |
| 7163613 | Method of manufacturing a semiconductor device by forming plating layers having differing thicknesses There is provided a semiconductor device comprising: a first plating layer formed on one surface of an interconnect pattern; a second plating layer formed within through holes in the interconnect pattern; a semiconductor chip electrically connected to the first plat... | 01/16/2007 |
| 7156972 | Method for controlling the ferric ion content of a plating bath containing iron A system and method for reducing ferric ion content in a plating solution by exposing hydrogen to an electrode in a plating solution for reducing a ferric ion content in the plating solution. ... | 01/02/2007 |
| 7147827 | Chemical mixing, replenishment, and waste management system A chemical control system for controlling the chemistry of a chemical solution having predetermined chemical constituents in a plating system, such as a NiFe plating system, employs a mix container for containing a plating solution and a hold container for containin... | 12/12/2006 |
| 7144489 | Photochemical reduction of Fe(III) for electroless or electrodeposition of iron alloys A method of photochemically reducing iron(III) species in an iron or iron alloy plating solution by adding an additive to the electroplating solution; contacting the additive with iron(III) species to form an iron(III)-additive species; and irradiating the electropl... | 12/05/2006 |
| 7144805 | Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density Methods for depositing a metal into a micro-recessed structure in the surface of a microelectronic workpiece are disclosed. The methods are suitable for use in connection with additive free as well as additive containing electroplating solutions. In accordance with ... | 12/05/2006 |
| 7138043 | Method for applying a metal layer to a light metal surface A process for applying a metal layer to surfaces of light metals is proposed, in which iron is electrolytically deposited on the surfaces from a deposition bath containing Fe(II) compounds using dimensionally stable anodes insoluble in the deposition bath. The proce... | 11/21/2006 |
| 7128822 | Leveler compounds Compounds that function to provide level or uniform metal deposits are provided. These compounds are particularly useful in providing level copper deposits. Copper plating baths and methods of copper plating using these compounds are also provided. These baths and m... | 10/31/2006 |
| 7128823 | Anolyte for copper plating Embodiments of the invention provide a method for plating copper into features formed on a semiconductor substrate. The method includes positioning the substrate in a plating cell, wherein the plating cell includes a catholyte volume containing a catholyte solution,... | 10/31/2006 |
| 7122105 | Use of siderophores to increase the current efficiency of iron plating solutions A method of electroplating iron or an iron alloy with a solution containing an iron-chelating agent to catalytically cycle the undesirable Fe(III) species back to Fe(II) for electroplating. The iron-chelating agents may be siderophores, specifically, for example, de... | 10/17/2006 |
| 7077945 | Cu—Ni—Fe anode for use in aluminum producing electrolytic cell A method of producing aluminum in an electrolytic cell containing alumina dissolved in an electrolyte, the method comprising the steps of providing a molten salt electrolyte at a temperature of less than 900° C. having alumina dissolved therein in an electrolytic c... | 07/18/2006 |
| 7052599 | Method and apparatus for reuse of abrasive fluid used in the manufacture of semiconductors An apparatus and method recycles the abrasive fluid or slurry effluent used in the polishing step in the manufacture of semiconductors. Agglomerations of abrasive grains built up in the slurry effluent are crushed using a mill, ultrasonic oscillation, or pressurized... | 05/30/2006 |
| 7049204 | High density metal capacitor using via etch stopping layer as field dielectric in dual-damascence interconnect process A metal-insulator-metal (MIM) capacitor is made according to a copper dual-damascene process. A first copper or copper alloy metal layer if formed on a substrate. A portion of the first metal layer is utilized as the lower plate of the MIM capacitor. An etch stop di... | 05/23/2006 |
| 7041595 | Method of forming a barrier seed layer with graded nitrogen composition A barrier layer material and method of forming the same is disclosed. The method includes depositing a graded metal nitride layer in a single deposition chamber, with a high nitrogen content at a lower surface and a high metal content at an upper surface. In the ill... | 05/09/2006 |
