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| Number | Title | Issue Date |
| 7431813 | Multi-chambered substrate processing equipment having sealing structure between chambers thereof, and method of assembling such equipment Sealing structure provided between a transfer chamber and a chamber, such as a process chamber, connected to the transfer chamber includes an insert member, a docking member, and annular seals. The insert member is fixed to the exterior of the transfer chamber and t... | 10/07/2008 |
| 7413639 | Energy and media connection for a coating installation comprising several chambers The invention relates to an energy and media connection module for coating installations. Said module serves for supplying with cooling water, compressed air, process gases, signal, control and cathode power. It can be moved from one coating chamber to another coati... | 08/19/2008 |
| 7381969 | Load lock control A control for pressurizing a load lock. The control initiates pressurization of the loadlock interior by coupling a source of gas to the loadlock interior. A representative load lock includes a pressure sensor and multiple valves to atmosphere where at least one suc... | 06/03/2008 |
| 7363106 | System and method for carrier identification in a pneumatic tube system A system and method provides for the identification and monitoring of carriers within a pneumatic carrier system. Each carrier which is to be employed within the system includes an identification device such as a radio frequency identification (RFID) chip which has ... | 04/22/2008 |
| 7300557 | Device for targeted application of deposition material to a substrate The invention relates to a device for the targeted application of deposition material onto a substrate, especially for focusing the sputter flux onto a narrow angular range in a PVD-system. The invention is characterized in that the deposition material is directed t... | 11/27/2007 |
| 7285916 | Multi chamber plasma process system A multi-chamber plasma process system includes a plurality of process chambers, each of which has an inductively coupled plasma generator. The inductively coupled plasma generator is electrically connected to a main power supply through a first impedance matcher. Th... | 10/23/2007 |
| 7277774 | Transportation state notification system and method, and information storage medium A server includes a communication section which receives event information from an event detection device which detects a plurality of types of events occurring in a plurality of temporary storage devices provided at different locations, and transmits transportation... | 10/02/2007 |
| 7264741 | Coater having substrate cleaning device and coating deposition methods employing such coater A coater having a substrate cleaning device is disclosed. Also disclosed are methods of processing substrates in a coater equipped with a substrate cleaning device. The substrate cleaning device comprises an ion gun (i.e., an ion source) that is positioned beneath a... | 09/04/2007 |
| 7214274 | Method and apparatus for thermally insulating adjacent temperature controlled processing chambers A dual chamber apparatus including a first chamber and a second chamber which is configured to be coupled to the first chamber at an interface. Each of the first chamber and the second chamber has a transfer opening located at the interface. An insulating plate is l... | 05/08/2007 |
| 7151980 | Transport management system and method thereof A system and method for carrier transport traffic management. A host computer connects to a fabrication tool, configured to acquire an available number of a resource type for the fabrication tool upon detecting a fabrication tool loadport of the fabrication tool is ... | 12/19/2006 |
| 7141120 | Manufacturing apparatus of semiconductor device having introducing section and withdrawing section A manufacturing apparatus of a semiconductor device includes an introducing section, a process section, and a withdrawing section. The introducing section introduces a transfer box therein. The process section takes in the semiconductor substrate put in the introduc... | 11/28/2006 |
| 7039501 | Method for determining a position of a robot Generally, a method of determining a position of a robot is provided. In one embodiment, a method of determining a position of a robot comprises acquiring a first set of positional metrics, acquiring a second set of positional metrics and resolving the position of t... | 05/02/2006 |
| 7032614 | Facilities connection box for pre-facilitation of wafer fabrication equipment A facilities connection box is provided to accommodate pre-plumbing of facilities lines required in connection with an installation of semiconductor device manufacturing equipment. The facilities connection box accommodates termination of double-containment faciliti... | 04/25/2006 |
| 6887358 | Installation for processing wafers An installation for processing wafers with a plurality of fabrication units and a plurality of measurement units as well as a transport system for transporting the wafers, is described. A transport control unit, which detects a capacity utilization of the installati... | 05/03/2005 |
| 6858085 | Two-compartment chamber for sequential processing An apparatus for sequential and isolated processing of a workpiece comprises a two compartment chamber and a mechanism to transfer the workpiece from one compartment to the other compartment. The transfer mechanism comprises two doors that seal the pathway between t... | 02/22/2005 |
| 6858119 | Mobile plating system and method An exemplary mobile plating system is provided for performing a plating process using virtually any known or available deposition technology for coating or plating as substrate. The mobile plating system may include a vacuum chamber positioned in a mobile storage vo... | 02/22/2005 |
| 6852194 | Processing apparatus, transferring apparatus and transferring method Processing apparatus is disclosed, that comprises substrate container holding table that can hold substrate container that contains plurality of target substrates, first transferring chamber, disposed adjacent to the substrate container holding table, that maintains... | 02/08/2005 |
| 6846380 | Substrate processing apparatus and related systems and methods An apparatus and method for processing a microelectronic substrate comprises a main chamber and a movable boundary. The main chamber comprises a main chamber wall enclosing a main chamber interior. The movable boundary is disposed within the main chamber interior, a... | 01/25/2005 |
| 6843883 | Vacuum processing apparatus and method for producing an object to be processed A vacuum processing apparatus 50 is provided with a bypass line 52 for causing a vacuum transfer chamber 4 and a load-lock chamber 12 to communicate with each other, and a bypass opening and shutting valve 54 for opening and shutti... | 01/18/2005 |
| 6827789 | Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry An apparatus for the treatment of semiconductor wafers, comprising a supportive frame and a process table arranged on the supportive frame. The process table comprises a stationary upper platen and a stationary lower plate. An intermediate indexing plate is rotative... | 12/07/2004 |
| 6827788 | Substrate processing device and through-chamber A substrate 9 is carried by a carry system in sequence, via a direction-altering chamber 8 to which a plurality of vacuum chambers comprising processing chambers 21 to 24 are hermetically-connected in the perimeter, to the plurality of pr... | 12/07/2004 |
| 6824617 | Input/output valve switching apparatus of semiconductor manufacturing system An input/output valve switching apparatus of a semiconductor manufacturing system minimizes a vibration set up while operating an input/output valve for opening and closing a wafer-transfer passage that connects chambers of the system. The switching apparatus includ... | 11/30/2004 |
| 6818068 | Conveyor for treating hollow bodies comprising an advanced pressure distribution circuit Aconveyer for treating hollow bodies, comprising several identical treatment stations (12, 13) that process at least one hollow body, whereby the respective treatment station for a given treatment stage communicates with a pressure source via distribution mea... | 11/16/2004 |
| 6818108 | Chamber for the transport of workpieces in a vacuum atmosphere, a chamber combination and a method for transporting a workpiece A vacuum chamber for transporting at least one workpiece has two or more openings defining respective opening areas for treating or handling the at least one workpiece. A transport device is arranged relative to the openings and includes a drive shaft rotatable arou... | 11/16/2004 |
| 6808592 | High throughput plasma treatment system A system for the plasma treatment of parts. The system includes a chamber base sealingly engageable with a reaction chamber to form a treatment chamber and a lifting device operable to lift the reaction chamber from the chamber base. A transfer mechanism is operable... | 10/26/2004 |
| 6800172 | INTERFACIAL STRUCTURE FOR SEMICONDUCTOR SUBSTRATE PROCESSING CHAMBERS AND SUBSTRATE TRANSFER CHAMBERS AND FOR SEMICONDUCTOR SUBSTRATE PROCESSING CHAMBERS AND ACCESSORY ATTACHMENTS, AND SEMICONDUCTOR SUBSTRATE PROCESSOR A semiconductor substrate processor includes a substrate transfer chamber and a plurality of substrate processing chambers connected therewith. An interfacial structure is received between at least one of the processing chambers and the transfer chamber. The interfa... | 10/05/2004 |
| 6793735 | Integrated cobalt silicide process for semiconductor devices A method and apparatus are provided for forming a silicide on a semiconductor substrate by integrating under a constant vacuum the processes of removing an oxide from a surface of a semiconductor substrate and depositing a metal on the cleaned surface without exposi... | 09/21/2004 |
| 6793766 | Apparatus having platforms positioned for precise centering of semiconductor wafers during processing Apparatus for processing multiple semiconductor wafers, includes a transfer chamber, a first processing chamber mounted in fixed relation to the transfer chamber and having a first wafer-holding platform with a center, a second processing chamber mounted in adjustab... | 09/21/2004 |
| 6790286 | Substrate processing apparatus Substrate processing parts are stacked and arranged in a multistage manner around a transport robot arranged at the center of a processing area. Rotary application units are arranged on a second layer through an indexer and the transport robot. Rotary developing uni... | 09/14/2004 |
| 6767439 | High throughput thin film deposition and substrate handling method and apparatus for optical disk processing The disclosure herein relates to a high throughput system for thin film deposition on substrates which can be used in applications such as optical disks, and in particular DVD disks, chip-scale packaging, and plastic based display, for example. An apparatus useful i... | 07/27/2004 |
| 6740195 | Detection of nontransient processing anomalies in vacuum manufacturing process A sensor, such as a mass spectrometer, capable of detecting the presence of materials in a sampled gas is interconnected with a processing chamber of a vacuum manufacturing tool. The sensor includes a timing circuit which is activated only if certain levels of speci... | 05/25/2004 |
| 6688375 | Vacuum processing system having improved substrate heating and cooling The invention is directed a vacuum processing system having improved substrate heating and cooling facilities. An evacuable chamber of the system includes a first section in which a temperature of a substrate to be processed may be increased and a second ... | 02/10/2004 |
| 6627039 | Plasma processing methods and apparatus To move an article in and out of plasma during plasma processing, the article is rotated by a first drive around a first axis, and the first drive is itself rotated by a second drive. As a result, the article enters the plasma at different angles for diff... | 09/30/2003 |
| 6620288 | Substrate treatment apparatus In the substrate treatment apparatus including substrate treatment chambers (301 and 303) and a buffer chamber (302) having an exhaust system (306b) independent of the substrate treatment chambers, connection tubes (304a and 304b) are provided between the... | 09/16/2003 |
| 6558506 | Etching system and etching chamber The present invention provides an etching system having a plurality of etching chambers (16, 18, 20) disposed about a transfer chamber (14), wherein the etching chambers are adapted to be selectively mounted at different positions with respect to the tran... | 05/06/2003 |
| 6549825 | Alignment apparatus An alignment apparatus which obtains an amount of correction for centering a semiconductor wafer from four points of a wafer edge detected by noncontact proprioceptors in a wafer delivery position P1 where the semiconductor wafer is passed to a... | 04/15/2003 |
| 6517692 | Apparatus for flow-line treatment of articles in an artificial medium An apparatus for flow-line treatment of articles has two chambers. The first chamber is a vacuum working chamber to treat articles in an artificial atmosphere. First transport means transport articles through the first chamber and at least one lock at the... | 02/11/2003 |
| 6517691 | Substrate processing system A substrate processing system includes a primary processing assembly and secondary processing assembly. The secondary processing assembly has one or more interconnected modules and includes one or more process stations. The primary and secondary processin... | 02/11/2003 |
| 6503379 | Mobile plating system and method An exemplary mobile plating system and method are provided for performing a plating process using virtually any known or available deposition technology for coating or plating. The mobile plating system may include a vacuum chamber positioned in a mobile ... | 01/07/2003 |
| 6471920 | Apparatus and method for treatment of electrically conductive continuous material An apparatus for treatment of electrically conductive continuous material, like wire material, copper wire in particular, is proposed, wherein the treatment is effected during the movement of the continuous material in its direction of extension through t... | 10/29/2002 |
