A method for inducing cats to exercise consists of directing a beam of invisible light produced by a hand-held laser apparatus onto the floor or wall.
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| Number | Title | Issue Date |
| 8083910 | Insulating spacer for plating inner surface and auxiliary anode unit An insulating spacer 30 comprises a plurality of unit spacers 40, and a flexible coupling portion 41 for coupling the unit spacers 40 along the axial direction thereof, wherein the unit spacer 40 comprises a plurality of annular pl... | 12/27/2011 |
| 8002956 | Plating stand-off A stand-off for maintaining the separation between an electrode and an object during a flow-through electroplating process is disclosed. The stand-off comprises a substantially streamlined shape that mitigates the effects of shadowing during deposition. ... | 08/23/2011 |
| 7976687 | Roll unit dipped in surface treatment liquid Provided is a roll unit to be dipped in a surface treatment liquid of a copper foil, wherein a bearing box for housing a roil shaft is configured from two bearing boxes that are divisible, one of the bearing boxes is configured from a roll-side bearing box arranged ... | 07/12/2011 |
| 7918974 | Micro-structured insulating frame for electrolysis cell The invention relates to an insulating frame of an electrolysis cell having a microstructured internal section allowing the penetration of the electrolyte even if the structured section is partly or completely overlapped by the membrane, and to an electrolysis cell ... | 04/05/2011 |
| 7897024 | Conducting belt for use with anode holder and anode holder A conducting belt is used with an anode holder for supplying an electric current to an anode for plating a surface of a substrate such as a semiconductor wafer. The anode and the substrate are vertically disposed so as to face each other in a plating tank of a plati... | 03/01/2011 |
| 7824527 | Frame for electrolyser module and electrolyser module and electrolyser incorporating same The present invention is directed to a frame for an electrolyser module as well as to an electrolyser module and an electrolyser incorporating such frames. The frames include a variety body having at least one electrolyser chamber opening and at least one degassing ... | 11/02/2010 |
| 7780823 | Compact service module for use in electrolytic aluminum production plants A tending module (7) for a series of electrolytic cells (2) to be used for the production of aluminum by fused bath electrolysis including a frame (8) that can be fixed to a trolley (6) and a turret (9) fitted on the frame (8 | 08/24/2010 |
| 7727365 | Suction pad and substrate treatment apparatus A suction pad used for use in a substrate treatment apparatus which treats a substrate by immersing the substrate in a solution while the pad attaches to the substrate, including: a main face for attaching to the substrate; an outer face disposed along the outer per... | 06/01/2010 |
| 7520968 | Conductive pad design modification for better wafer-pad contact An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coat... | 04/21/2009 |
| 7504009 | Method for the formation of a good contact surface on an aluminium support bar and a support bar The invention relates to a method for achieving a good contact surface on an aluminium electrode support bar used in electrolysis. In the method the support bar is fabricated as a continuous bar and a highly electroconductive layer is formed on its end. The highly e... | 03/17/2009 |
| 7479209 | Cathode guidance and perimeter deposition control assembly in electro-metallurgy cathodes Production of pure metals through electro-winning and electro-deposition is accomplished by electrolytic deposition of metal over a reusable stainless-steel plate (cathode). Metal is deposited on both faces of the cathode, as well as on its edges, creating problems ... | 01/20/2009 |
| 7427340 | Conductive pad A method and apparatus for a processing pad assembly for polishing a substrate is disclosed. The processing pad assembly has a conductive processing pad having a plurality of raised features made of a conductive composite disposed on a conductive carrier. The raised... | 09/23/2008 |
| 7425257 | Method for the formation of a good contact surface on a cathode support bar and support bar The disclosure relates to a method of obtaining a good current contact on the support bar of a cathode used in electrolysis. In this method a highly electroconductive layer is formed on the contact piece on the end of the support bar of the cathode, especially at th... | 09/16/2008 |
| 7396442 | Electrochemical oxygen generator module assembly An ionically conductive ceramic element includes a central unit (703). The central unit (703) is composed of a plurality of integrated manifold and tube modules (IMAT) (22) joined end to end along a central axis (A). Each IMAT module (22)... | 07/08/2008 |
| 7387713 | Resistored anode construction A sacrificial anode assembly operative to inhibit corrosion in the metal tank portion of a water heater includes a cylindrical metal anode member having an end retained within a tubular, electrically non-conductive plastic insulating sleeve which, in turn, is captiv... | 06/17/2008 |
| 7378004 | Pad designs and structures for a versatile materials processing apparatus An apparatus capable of assisting in controlling an electrolyte flow and an electric field distribution used for processing a substrate is provided. It includes a rigid member having a top surface of a predetermined shape and a bottom surface. The rigid member conta... | 05/27/2008 |
| 7374645 | Electrolysis cell assembly A compression sealable electrolysis cell that is easily and reliably manufactured, maintained and repaired comprises two insulating end pieces which can position and seal two electrode tubes with electrical contacts separated by a ceramic membrane tube where fluid c... | 05/20/2008 |
| 7371426 | Method for repairing components using environmental bond coatings and resultant repaired components According to an embodiment of the invention, a repaired component is disclosed. The repaired component comprises an engine run component having a base metal substrate, a portion of the base metal substrate between about 1-3 mils in thickness and an overlying bond co... | 05/13/2008 |
| 7363110 | Gasket with curved configuration at peripheral edge A gasket having the form of a frame is provided with a curved portion at an inner or outer periphery thereof. When used in combination with a similarly configured gasket, the two gaskets may together, upon compression, form a pinch seal. The curved portion may be pr... | 04/22/2008 |
| 7344625 | Element for handling connectors for electrolytic cells which are used for the production of aluminum The present invention relates to a handling device for an anode connector provided with at least two side trunnions and a tightening screw. The connector is generally capable of cooperating with attachment hooks of an aluminum production cell used in fused bath elec... | 03/18/2008 |
| RE40035 | Modular ceramic oxygen generator A ceramic oxygen generator is described which is capable of modular construction to permit the oxygen generation capacity to be expanded. An ionically conducted ceramic electrolyte is formed into a series of rows and columns of tubes on a tube support member and lik... | 01/29/2008 |
| 7309847 | Ceramic oxygen generating oven An over (10) for a gas generating system (C) of the type that includes an interior chamber (22), heating elements (12), at least one gas generating module (14) mounted within the interior chamber (22), an air inlet (26) prov... | 12/18/2007 |
| 7306706 | Method and apparatus for stripping electrodeposited metal sheets from permanent cathodes A method and apparatus for stripping electro-deposited metal sheets from a cathode blank. The blank has opposite faces, upstream and downstream ends. At least one sheet is provided on at least one blank face to define upstream and downstream edges. The apparatus com... | 12/11/2007 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7297239 | Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad a... | 11/20/2007 |
| 7285193 | Encapsulated cathode hanger bar and method of manufacturing A cathode for use in the refining or winning of metals, typically used in the electro-refining or winning of copper, comprising a substantially flat deposition plate fixedly attached along an upper edge thereof to an elongate hanger bar thereby defining a connection... | 10/23/2007 |
| 7282125 | Contact element holder A contact element holder, in particular a brush holder for commutator or wiper ring machines, has a carrier that can be secured to the machine housing and at least one quiver, held on the carrier and pointing toward the rotor, for displaceably receiving a contact el... | 10/16/2007 |
| 7282124 | Device providing electrical contact to the surface of a semiconductor workpiece during processing Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second ... | 10/16/2007 |
| 7252750 | Dual contact ring and method for metal ECP process A dual contact ring for contacting a patterned surface of a wafer and electrochemical plating of a metal on the patterned central region of the wafer and removing the metal from the outer, edge region of the wafer. The dual contact ring has an outer voltage ring in ... | 08/07/2007 |
| 7226670 | Work piece with a hard film of AlCr-containing material, and process for its production A work piece or structural component is coated with a system of film layers at least one of which is composed of (AlyCr1-y) X, where X=N, C, B, CN, BN, CBN, NO, CO, BO, CNO, BNO or CBNO and 0.2≦y | 06/05/2007 |
| 7223324 | Capping board with separating walls Disclosed in a capping board for use to support hanging legs of anodes and cathodes within adjacent electrolytic cells. This capping board has a main body having a bottom surface shaped to fit onto upper edges of the adjacent cells, and a top surface. A first set of... | 05/29/2007 |
| 7217345 | Cathode guidance and perimeter deposition control assembly in electro-metallurgy cathodes Production of pure metals through electro-winning and electro-deposition is accomplished by electrolytic deposition of metal over a reusable stainless-steel plate (cathode). Metal is deposited on both faces of the cathode, as well as on its edges, creating problems ... | 05/15/2007 |
| 7217472 | Electrolyte support member for high differential pressure electrochemical cell A support member is useful for supporting membranes such as solid polymer electrolyte ion exchange membranes such as those used in electrochemical cell applications. The support member has a first lattice pattern on a first side of a single piece of material. A seco... | 05/15/2007 |
| 7214297 | Substrate support element for an electrochemical plating cell A contact ring for an electrochemical plating system is provided. The contact ring includes an annular substrate supporting member, a plurality of radially positioned conductive substrate contact pins extending from the substrate supporting member, an annular conduc... | 05/08/2007 |
| 7211175 | Method and apparatus for potential controlled electroplating of fine patterns on semiconductor wafers Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are provided to mitigate corrosion of a metal seed layer on recessed features du... | 05/01/2007 |
| 7204920 | Contact ring design for reducing bubble and electrolyte effects during electrochemical plating in manufacturing A contact ring for use in electroplating of a substrate material is constructed such that fluid (e.g., electrolyte) is allowed to flow radially away from the axis of a toroidal support ring, thus preventing the trapping of fluids between the substrate and the toroid... | 04/17/2007 |
| 7204919 | Capping board with at least one sheet of electrically conductive material embedded therein Disclosed is a capping board for use to support anodes and cathodes within adjacent electrolytic cells, which has a plurality of individual seats positioned in spaced apart relationship all along its length to receive and support hanging legs projecting from these a... | 04/17/2007 |
| 7204918 | High efficiency plating apparatus and method An improved apparatus for treating plate-like workpieces with a designated chemical solution, including printed circuit boards, includes: (1) a tray for holding the chemical solution, with the tray having an open top which is configured to receive a horizontally-ori... | 04/17/2007 |
| 7204917 | Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same The present invention is directed to a top surface of a workpiece surface influencing device and a method of using the same. The top surface of the workpiece surface influencing device is adapted for use in an electrochemical mechanical processing apparatus in which... | 04/17/2007 |
| 7201828 | Planar plating apparatus An apparatus for performing an electrochemical process on a surface of a workpiece comprises a platen assembly comprising a support platen, an electrolyte distribution plate, and a first conductive layer intermediate the support platen and distribution plate and con... | 04/10/2007 |