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| Number | Title | Issue Date |
| 8182655 | Plating systems and methods Embodiments of the invention relate to plating systems configured to strip plate a selected portion of a workpiece (e.g., a lead frame) and methods of plating. In one embodiment, a plating system is configured to plate a selected portion of a workpiece and at least ... | 05/22/2012 |
| 8110076 | Apparatus and foam electroplating process An improved apparatus and method of producing metal foam is provided which involves optimizing the natural convection of electrolyte through a foam being electroplated by inclining the foam during plating. A diagonal flow of electrolyte though the foam enhances elec... | 02/07/2012 |
| 7837839 | Conductive coating of surfaces The invention relates to an apparatus for galvanically depositing an electrically conductive layer onto a carrier on which, at least in some regions, a starter layer suitable for electroplating is disposed. The apparatus has an electroplating bath in which an electr... | 11/23/2010 |
| 7678242 | System and method for manufacturing flexible copper clad laminate film Disclosed is a system and a method for manufacturing flexible copper clad laminate film capable of efficiently electroplating both surfaces of a polyimide-based film to form copper plating layers thereon while making it easy to repair and maintain the apparatus or c... | 03/16/2010 |
| 7655117 | Continuous plating system and method with mask registration A continuous plating system with mask registration is disclosed herein that uses drums and rollers with protruding pins which engage with guide holes in a masking belt and a lead frame. Through engagement with the pins the masking belt is keyed to the lead frame as ... | 02/02/2010 |
| 7544274 | Plating device and plating method There is provided a plating method and device having a fixed drum (20) in which an anode (21) is exposed on the external peripheral surface; a rotating drum provided on the external periphery of the fixed drum, onto which a workpiece W transported in t... | 06/09/2009 |
| 7488404 | Process for hydrogenating carbon dioxide, treating apparatus, and basic material for hydrogenation A process for hydrogenating carbon dioxide to generate methanol. In the process, a strip of copper base plate is transported by the groups of rotating drive rollers to deposit porous metallic zinc on the copper base plate. Hydrogen is generated from the porous metal... | 02/10/2009 |
| 7351321 | Method for electrochemical fabrication An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substra... | 04/01/2008 |
| 7303064 | Feeder belt for strip-shaped parts A feeder belt for strip-shaped parts used to feed the strip-shaped parts in various processes such as plating, deflashing, or other processes for manufacturing semiconductors or other articles at industrial scale. By improving the structure of a finger for a feeder ... | 12/04/2007 |
| 7285200 | Process for electrocoating metal blanks and coiled metal substrates Processes for forming a coating on electroconductive flat blanks having two major surfaces and sheared edges are provided. Also provided is a process for forming a multi- composite coating on a pre-sheared, electroconductive, flat blank having two major surfaces and... | 10/23/2007 |
| 7285201 | Process for electrocoating metal blanks and coiled metal substrates Processes for forming a coating on electroconductive flat blanks having two major surfaces and sheared edges are provided. Also provided is a process for forming a multi-composite coating on a pre-sheared, electroconductive, flat blank having two major surfaces and ... | 10/23/2007 |
| 7259640 | Miniature RF and microwave components and methods for fabricating such components RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, ant... | 08/21/2007 |
| 7238264 | Galvanizing device A galvanizing device has at least one jet cell with a contact zone located after the jet cell in the direction of transportation of a work piece through the jet cell. At least one partition separates the jet cell from the contact zone. A seal surrounds the workpiece... | 07/03/2007 |
| 7186559 | Apparatus and method for electroporation of biological samples The present invention relates to methods and apparatus for the encapsulation of biologically-active substances in various cell populations. More particularly, the present invention relates to a method and apparatus for the encapsulation of biologically-active substa... | 03/06/2007 |
| 7169286 | Process control methods of electropolishing for metal substrate preparation in producing YBCO coated conductors Disclosed is a reel-to-reel substrate tape polishing and cleaning system including precleaning, electropolishing section and post cleaning sections and which is suitable for polishing and cleaning long lengths of metal substrate tape used in the manufacture of HTS-c... | 01/30/2007 |
| 7160428 | Plating machine and process for producing film carrier tapes for mounting electronic parts A plating machine for plating a film carrier tape for mounting electronic parts includes a plating tank for plating wiring patterns of a film carrier tape and also has a bubble adhesion prevention means that is position adjustable with respect to the surface of a pl... | 01/09/2007 |
| 7141425 | Apparatus and method for electroporation of biological samples The present invention relates to methods and apparatus for the encapsulation of biologically-active substances in various cell populations. More particularly, the present invention relates to a method and apparatus for the encapsulation of biologically-active substa... | 11/28/2006 |
| 7128817 | Feed belt for strip-shaped elements A feed belt for strip-shaped elements includes a belt body and a plurality of fingers, the fingers being previously fabricated and coupled to the belt body at constant pitches. The belt body includes fitting openings and slits formed at one side of the fitting openi... | 10/31/2006 |
| 7112264 | Plating apparatus and method A plating apparatus includes a plating vessel for holding a plating bath containing at least metal ions, a conveying device for conveying a long conductive substrate and immersing the long conductive substrate in the plating bath, a facing electrode disposed in the ... | 09/26/2006 |
| 7097755 | Electrochemical mechanical processing with advancible sweeper The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution, a belt workpiece surface in... | 08/29/2006 |
| 7056384 | Strip brush bowling lane dressing application mechanism A bowling lane conditioning machine has dressing application mechanism that includes an elongated, non-rotating strip brush which transfers dressing from a dispensing means to another surface, such as a bristle-type, lane-engaging applicator roll, a metal transfer r... | 06/06/2006 |
| 7045053 | Process and apparatus for the superficial electrolytic treatment of metal strips An apparatus for the superficial electrolytic treatment of metal strips, comprising several separate and non-communicating tanks, or containers, located along the path of metal strip (13). A series of electrodes in pairs (14′, 15′, 14″, 15″, 14′â... | 05/16/2006 |
| 7045043 | Method of reducing a band mark of an electroplating steel sheet The present invention relates to a method of reducing a band mark on an electroplating steel sheet, which can also reduce plating defects and damages to the materials caused by the differences in the physical characteristics of composition materials of a conductor r... | 05/16/2006 |
| 7033468 | Elastic contact element For manufacturing printed circuit boards and films 7 with little variations in the layer thickness of the circuit structures without damaging the surfaces of the boards and films, a rotatory element 9, 10, more specifically a contact roll, is used for ... | 04/25/2006 |
| 7029916 | Apparatus and method for flow electroporation of biological samples The present invention relates to methods and apparatus for the encapsulation of biologically-active substances in various cell populations. More particularly, the present invention relates to a method and apparatus for the encapsulation of biologically-active substa... | 04/18/2006 |
| 6991717 | Web processing method and apparatus The present invention relates to a web handling apparatus and process ideally suited for applications involving wet chemistry. The invention involves the horizontal processing of webs in processing containers. The web is redirected into the processing container by i... | 01/31/2006 |
| 6979391 | Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method For electrolytic treatment of electrically mutually insulated, electrically conductive structures 4 on surfaces of electrically insulating foil material (Fo), is unloaded from a store 15′, 15″, transported on a conveying line through a treatment un... | 12/27/2005 |
| 6968619 | Method for manufacturing endodontic instruments A method of manufacturing endodontic files involves a chemical milling process to yield endodontic files having a desired taper. The process involves the steps of (a) providing a metallic rod having a cutting portion with a polygonal cross section; (b) torsioning th... | 11/29/2005 |
| 6969672 | Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operation A method of controlling a conductive layer deposition process includes depositing a conductive layer onto a semiconductor wafer based upon a deposition recipe, measuring a thickness of the conductive layer deposited on the semiconductor wafer, determining whether th... | 11/29/2005 |
| 6951770 | Method of manufacturing a photovoltaic foil The invention pertains to a method of manufacturing a photovoltaic foil comprising a TCO layer, a photovoltaic layer, and a back electrode, which method comprises the following steps: providing a conductive temporary substrate; applying a TCO layer on the temporary ... | 10/04/2005 |
| 6949171 | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method This invention is a method of providing conductive tracks on a printed circuit including coating a substrate carrying printed tracks with an electro-plating solution with a tool which provides a first electrode of an electro-plating circuit and a second electrode pr... | 09/27/2005 |
| 6936134 | Substrate processing apparatus and substrate processing method A substrate processing apparatus comprises a heating process chamber in which a heating process is performed for a wafer, a load lock chamber, connected to the heating process chamber, for controlling at least oxygen concentration and pressure, a transferring arm tr... | 08/30/2005 |
| 6929734 | Apparatus and method for feeding wire in treatment liquid The apparatus is provided with a wire guiding means disposed in a liquid bath for turning the direction of a wire to feed the wire into and out of the bath contained by the liquid. The wire guiding means includes a tubular conduit having a first open end disposed in... | 08/16/2005 |
| 6911137 | Method and device for the electrolytic coating of a metal strip Method for the electrolytic coating of a metal strip, in which the strip forms a cathode and is moved in its longitudinal direction relative to an anode, an electrolyte flowing at least between the strip and the anode, characterized in that the flow of the electroly... | 06/28/2005 |
| 6908534 | Substrate plating method and apparatus A method and apparatus for plating a substrate is provided, wherein fine pits formed in the substrate, such as fine channels for wiring, are filled with a copper, copper alloy, or other material with low electrical resistance. The method is performed on a wafer W ha... | 06/21/2005 |
| 6905589 | Circuitized substrate and method of making same A method of making a circuitized substrate in which a commoning layer is used to form multiple, substantially vertically aligned conductive openings in a multilayered component such as a laminate interposer for coupling a chip to a printed circuit board or the like.... | 06/14/2005 |
| 6905588 | Packaging deposition methods The present invention relates to a method for fabricating high performance chip interconnects and packages by providing methods for depositing a conductive material in cavities of a substrate in a more efficient and time saving manner. This is accomplished by select... | 06/14/2005 |
| 6837973 | Apparatus for electrically coating a hot-rolled steel substrate A process and apparatus are provided for producing an electrolytically coated, hot-rolled steel strip without any intervening strips. The apparatus includes a chemical pickling section being combined in one line with an electrolytic coating section containing electr... | 01/04/2005 |
| 6752915 | Web conveying apparatus, and apparatus and method for electrodeposition using web conveying apparatus The present invention provides a web conveying apparatus for conveying a web while holding the web and applying tension to the web, wherein the conveying apparatus has a plurality of rollers with which the web contacts to be conveyed, and at least one roller of the ... | 06/22/2004 |
| 6740164 | Plating apparatus and method of manufacturing semiconductor device Plating apparatus and plating method that can plate more uniformly on a processing surface of a workpiece are provided. The plating apparatus is comprised of a plating solution bathe which is provided with a first electrode held in a state soaked in a plating soluti... | 05/25/2004 |
