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Class 204/202 - Endless


Subclass of Class 204 - Chemistry: electrical and wave energy
Definition: Apparatus in which the conveyor is of the endless type.
No. of patents: 109
Last issue date: 03/06/2012


1      
NumberTitleIssue Date
8128790Plating apparatus and plating method
An apparatus that performs an electrolytic plating on a plating surface of a belt substrate is provided. The apparatus includes a plating tank, a conveyor device configured to carry a belt substrate through an interior of the plating tank, an immersed cathode power-...
03/06/2012
8038851Device for the treatment, particularly galvanization, of substrates
A contacting device for a galvanization apparatus comprises contacting rollers with a continuous rigid external face, which is joined to a jacket section. The jacket section is provided with an inner opening that is wider than a rotating shaft on which the contactin...
10/18/2011
7744732Continuous plating system and method with mask registration
A continuous plating system with mask registration is disclosed herein that uses drums and rollers with protruding pins which engage with guide holes in a masking belt and a lead frame. Through engagement with the pins the masking belt is keyed to the lead frame as ...
06/29/2010
7641775Apparatus for manufacturing electrolytic metal foil
Disclosed is an apparatus for manufacturing an electrolytic metal foil, which includes an electrolytic cell containing electrolyte; an upper drum installed in an upper portion of the electrolytic cell to be rotatable and to which a negative potential is applied; a l...
01/05/2010
7501048Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate
The invention provides a method for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, comprising the steps of immersing the substrate with the pattern present thereon in an e...
03/10/2009
7425250Electrochemical mechanical processing apparatus
A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer to polish the conductive surface. Application of a potential differe...
09/16/2008
7303064Feeder belt for strip-shaped parts
A feeder belt for strip-shaped parts used to feed the strip-shaped parts in various processes such as plating, deflashing, or other processes for manufacturing semiconductors or other articles at industrial scale. By improving the structure of a finger for a feeder ...
12/04/2007
7293642Methods and apparatus for transporting substrate carriers
According to a first aspect, a first conveyor system is provided that is adapted to deliver substrate carriers within a semiconductor device manufacturing facility. The first conveyor system includes a ribbon that forms a closed loop along at least a portion of the ...
11/13/2007
7285201Process for electrocoating metal blanks and coiled metal substrates
Processes for forming a coating on electroconductive flat blanks having two major surfaces and sheared edges are provided. Also provided is a process for forming a multi-composite coating on a pre-sheared, electroconductive, flat blank having two major surfaces and ...
10/23/2007
7285200Process for electrocoating metal blanks and coiled metal substrates
Processes for forming a coating on electroconductive flat blanks having two major surfaces and sheared edges are provided. Also provided is a process for forming a multi- composite coating on a pre-sheared, electroconductive, flat blank having two major surfaces and...
10/23/2007
7241366Continuous coating process
A system for coating variable and/or unlimited length parts is provided. The system comprises a process tank, a coating material supply, and an open-ended process tank conveyor is provided. The process tank comprises an entry port, an exit port opposite the entry po...
07/10/2007
7204918High efficiency plating apparatus and method
An improved apparatus for treating plate-like workpieces with a designated chemical solution, including printed circuit boards, includes: (1) a tray for holding the chemical solution, with the tray having an open top which is configured to receive a horizontally-ori...
04/17/2007
7195701Electrochemical depositions applied to nanotechnology composites
A method of improving the material properties of a composite by electrodepositing various polymers, organic compounds or inorganic compounds onto each individual carbon (graphite) fiber strand, whether individual fiber or as a fabric to form an homogeneous chemicall...
03/27/2007
7186923Printed wiring boards and methods for making them
A printed wiring board comprising conductive layers separated by nonconductive material and having through holes or other nonconductive surfaces on which an electrically conductive carbon coating is formed. The conductive carbon coating includes electrically conduct...
03/06/2007
7128817Feed belt for strip-shaped elements
A feed belt for strip-shaped elements includes a belt body and a plurality of fingers, the fingers being previously fabricated and coupled to the belt body at constant pitches. The belt body includes fitting openings and slits formed at one side of the fitting openi...
10/31/2006
7097747Continuous process electrorefiner
A new device is provided for the electrorefining of uranium in spent metallic nuclear fuels by the separation of unreacted zirconium, noble metal fission products, transuranic elements, and uranium from spent fuel rods. The process comprises an electrorefiner cell. ...
08/29/2006
7074315Copper bath and methods of depositing a matt copper coating
In the production of printed circuit boards it is required that organic protective coatings adhere tightly on the copper surfaces. Accordingly, matt layers of copper are to be preferred over lustrous coatings. The bath in accordance with the invention serves to depo...
07/11/2006
7052740Frame assembly and method for coating a strand of workpieces
The subject invention includes a plating apparatus (10) having an electrically conductive rack (12) and a frame assembly (14). The frame assembly (14) includes a rod (24) and series of support structures (26). A number of re...
05/30/2006
7033468Elastic contact element
For manufacturing printed circuit boards and films 7 with little variations in the layer thickness of the circuit structures without damaging the surfaces of the boards and films, a rotatory element 9, 10, more specifically a contact roll, is used for ...
04/25/2006
6991717Web processing method and apparatus
The present invention relates to a web handling apparatus and process ideally suited for applications involving wet chemistry. The invention involves the horizontal processing of webs in processing containers. The web is redirected into the processing container by i...
01/31/2006
6979391Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method
For electrolytic treatment of electrically mutually insulated, electrically conductive structures 4 on surfaces of electrically insulating foil material (Fo), is unloaded from a store 15′, 15″, transported on a conveying line through a treatment un...
12/27/2005
6960282Apparatus for cleaning residual material from an article
An apparatus in which opposed nozzle assemblies are utilized to clean residual material, such as a metallic paste, from an article, such as a screening mask. Each of the nozzle assemblies has a first set of nozzles for spraying a cleaning agent onto the article in a...
11/01/2005
6955197Substrate carrier having door latching and substrate clamping mechanisms
In a first aspect, an automatic door opener is provided that includes (1) a platform adapted to support a substrate carrier; (2) a door opening mechanism adapted to open a door of the substrate carrier while the substrate carrier is supported by the platform; and (3...
10/18/2005
6936153Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face
A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrodes which ha...
08/30/2005
6929723Electroplating apparatus using a non-dissolvable anode and ultrasonic energy
An apparatus for electroplating a rotogravure cylinder out of a plating solution is disclosed. The apparatus includes a plating tank adapted to support the cylinder and to contain a plating solution so that the cylinder is at least partially disposed into the platin...
08/16/2005
6899797Apparatus for continuous processing of semiconductor wafers
An electrochemical reaction assembly of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly achieves a highly uniform thickness and composition of deposition material or uniform etching or polishing on th...
05/31/2005
6752915Web conveying apparatus, and apparatus and method for electrodeposition using web conveying apparatus
The present invention provides a web conveying apparatus for conveying a web while holding the web and applying tension to the web, wherein the conveying apparatus has a plurality of rollers with which the web contacts to be conveyed, and at least one roller of the ...
06/22/2004
6746720Conveyance apparatus and conveyance method
A plurality of baths for dipping and the like is arranged in series so that these baths contact one another, and a conveyor 2 is linearly arranged above the dipping bath in one plane. A workpiece 1 is tact-conveyed on the conveyor 2 in a floor c...
06/08/2004
6514392Conducting roller for an electroplating apparatus
A conducting roller is used in an electroplating apparatus, and includes a conductive roller body, which has two diameter-reduced end portions that are journalled within two stationary conductive sleeve units. A conductive liquid is filled within two seal...
02/04/2003
6508926Method and device for partial electrochemical treatment of bar-shaped objects
In a device, rod-shaped objects 10 (rods of various length and diameter) are electrochemically partially processed in dip plants (galvanized, pickled). Stationary tubular electrodes 30, into which the rods 10 are centrically entered, are provided in the p...
01/21/2003
6485620Device for electroplating on translating metal sheets, especially for printed circuits, by closure of an electric circuit between the sheets and a liquid reactant product
Device (60) having one or more operative units (55) for electroplating a film by chemical reaction with a specially made liquid product (29) and application of direct current, on sheets (50) for printed circuits continuously translating between one or mor...
11/26/2002
6432295Process and device for electrolytic polishing of surgical needles
In a process for the electrolytic polishing of surgical needles, a plurality of unfinished needles, which are arranged side by side and are secured to at least one web (6, 7) in their end-regions lying opposite the needle tips, are moved with the help of ...
08/13/2002
6406542Equipment for treatment of workpieces
In equipment for powder-coating, workpieces such as escalator steps are subjected to a current treatment in an anodizing unit. A conveying means advancing carriers for the workpieces is lowered over a tank so that the workpieces in transit are immersed in...
06/18/2002
6395163Process for the electrolytic processing especially of flat items and arrangement for implementing the process
A process for electrolytically processing a flat perforated item, comprising the steps of: moving the item in a transport direction to a treatment station where the item is contacted with an electrolyte, continuously mechanically wiping, in the presence o...
05/28/2002
6309518Surface-treatment plant
A surface-treatment plant, particularly for galvanic treatments, includes at least one tank (3) for holding a bath (B) for treating pieces (P) to be treated by immersion therein, and a continuous conveyor device (5) having an active pass at least a portio...
10/30/2001
6294060Conveyorized electroplating device
A conveyorized electroplating device having an anode positioned proximate to a plurality of absorptive applicator assemblies that apply a plating solution to a substrate and a conveyor device that grips the substrate thereby isolating the electrical conta...
09/25/2001
6238529Device for electrolytic treatment of printed circuit boards and conductive films
The apparatus for electrolytically treating printed circuit boards 3, through which apparatus the printed circuit boards are continuously guidable in a plane of conveyance in a substantially horizontal direction of conveyance, has the following features: ...
05/29/2001
6132570Method and apparatus for continuous processing of semiconductor wafers
An electrochemical reaction assembly and methods of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly and method achieve a highly uniform thickness and composition of deposition material or u...
10/17/2000
6129827Process and apparatus for forming fluorescent layer on a substrate for display panel
A process for forming a fluorescent layer on an electrode disposed on a substrate for display panel includes the steps of: placing an opening of a housing section for housing a fluorescent paste opposite to the electrode on the substrate; and applying a v...
10/10/2000
6077411Apparatus and process for forming zinc oxide film and process for producing photo-electricity generating device using the film
An apparatus for forming a zinc oxide film on a sheet substrate including a tank containing an aqueous electrolytic solution containing at least nitrate ions and zinc ions, conveyer means for continuously feeding and conveying an elongated electroconducti...
06/20/2000
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