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| Number | Title | Issue Date |
| 8003900 | Mesh sheet and housing for electronic devices A mesh sheet of the present invention is a mesh sheet in which a metal mesh comprising fine bands is laminated on a surface of a base substrate, the mesh sheet being used and adhered along a surface of an arbitrary member having a curved surface portion. The metal m... | 08/23/2011 |
| 7352060 | Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate A multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring structure is disclosed. The multilayer wiring substrate includes a dielectric layer including a resin material mixed with an inorganic filler, wherein the inorganic filler i... | 04/01/2008 |
| 7309622 | Integrated circuit package system with heat sink An integrated circuit package system includes providing a substrate. An integrated circuit is attached to the substrate. A plurality of support bars is formed on the substrate. A plurality of adhesive structures is formed. A heat sink is attached to the plurality of... | 12/18/2007 |
| 7276800 | Carrying structure of electronic components A carrying structure of electronic components is proposed. The carrying structure includes at least one supporting board with at least one cavity disposed thereon, at least one adhesive layer formed on the supporting board, and at least one electronic component havi... | 10/02/2007 |
| 7241678 | Integrated die bumping process An integrated die bumping process includes providing a load board, defining a plurality of die regions on a surface of the load board for placing dice of a plurality of die specifications, affixing a plurality of dice respectively on the die regions according to the... | 07/10/2007 |
| 7205175 | Method for encapsulating a chip and/or other article Method for encapsulating a chip with encapsulant, one portion of the surface of which chip must remain free of encapsulant, comprising the following steps: fixing the chip on a carrier with a suitable conductor structure, placing carrier and chip in one part of a mo... | 04/17/2007 |
| 7161094 | Modifying the electro-mechanical behavior of devices A MEMS device is packaged with a control material that is included in the package to affect an operation of a moveable element of the device. The control material may affect operational characteristics including actuation and release voltages and currents, mechanica... | 01/09/2007 |
| 7138301 | Diode housing A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two ele... | 11/21/2006 |
| 6674002 | Device for accomodating electronic components A device for accomodating at least one, preferably electrical or electronic, component, comprising a housing forming an interior defined by an inner wall surface, in which interior the at least one component is arranged, the at least one component occupyi... | 01/06/2004 |
| 6667439 | Integrated circuit package including opening exposing portion of an IC An IC package preferably includes an IC and encapsulating material surrounding the IC, with the encapsulating material having an opening therein to define an exposed portion of the IC. Vestigial portions of encapsulating material may be left on the expose... | 12/23/2003 |
| 6665192 | Synthetic resin capping layer on a printed circuit A printed circuit is provided with a synthetic resin capping layer that exhibits a continuous variation of mechanical properties in a direction at right angles to its surface. The printed circuit can be in a mobile telephone or other portable device, and ... | 12/16/2003 |
| 6628526 | Electronic device manufacturing method, electronic device and resin filling method The present invention provides an electronic device manufacturing method and an electronic device which make it possible to reduce the waste of materials and the number of manufacturing steps required. Electronic devices are manufactured via a process inc... | 09/30/2003 |
| 4853491 | Chip carrier A chip carrier and a process of assembling a chip carrier are disclosed. The carrier used for mounting a chip comprises a copper or copper base alloy component having a thin refractory oxide layer on a surface thereof. The surface and the oxide layer have... | 08/01/1989 |
| 4847557 | Hermetically sealed magnetic sensor A hermetically sealed magnetic sensor for detecting variations in a magnetic field has a sensor element with an output terminal for detecting variations in the magnetic field and generating a signal. An output wire is connected with one end to the termina... | 07/11/1989 |
| 4835067 | Corrosion resistant electroplating process, and plated article To simplify manufacture of plated metal parts with high corrosion resistance especially suitable for use as sealing lids or cover elements for semiconductor packages, a substrate of Kovar, or Alloy 42, which are nickel-containing iron alloys, are electrop... | 05/30/1989 |
| 4812896 | Metal electronic package sealed with thermoplastic having a grafted metal deactivator and antioxidant A package and process of assembling a package adapted for housing an electronic component. The package includes metallic base, lid and leadframe components sealed together with a thermoplastic material. The thermoplastic has an additive consisting essenti... | 03/14/1989 |
| 4806704 | Metal matrix composite and structure using metal matrix composites for electronic applications The invention relates to a metal matrix composite used to support and/or enclose discrete electronic semiconductor devices, monolithic integrated circuits, hybrid circuits, and multi-layer printed wiring boards. The matrices herein disclosed employ alumin... | 02/21/1989 |
| 4804805 | Protected solder connection and method Solder in a connection is kept from melting when applying an outer protective layer of high melting point plastic by first applying an inner layer of low melting point plastic.... | 02/14/1989 |
| 4781969 | Flexible printed circuit board A printed circuit board is provided wherein a composite metal layer is affixed to at least one surface of a flexible dielectric substrate, the composite metal layer comprising an inner aluminum layer and an outer copper layer. Owing to the relatively high... | 11/01/1988 |
| 4780572 | Device for mounting semiconductors A device containing a semiconductor element having a substrate a cap over the substrate with a glass layer formed between the cap and the substrate providing a seal therebetween. Electrically conducting terminal members extend through the glass layer and ... | 10/25/1988 |
| 4772761 | Sealed electrical components and method of making same An electrical component (20) comprises electrical circuit means (22) and housing member (50) disposed over a first portion (24) of the electrical circuit means (22). The circuit means (22) has a second portion (30) extending outwardly from the housing mem... | 09/20/1988 |
| 4769345 | Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor The present invention is directed to a process of forming a package for enclosing an electrical device wherein the enclosure contains a very low amount of oxygen and water vapor. The package includes a base and lid components bonded together by a sealing ... | 09/06/1988 |
| 4763223 | Non-soldered lead apparatus An apparatus including terminals for electronic devices such as display units or the like. The terminals are hermetically sealed into the structure of the electronic device during the assembly thereof. The terminal includes a bent, resilient end portion a... | 08/09/1988 |
| 4761518 | Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs A semiconductor casing is formed of a ceramic-glass-metal composite material with a leadframe embedded in a base component. The leadframe may include holes therethrough to mechanically interlock with the composite material. Also, a process comprises formi... | 08/02/1988 |
| 4746381 | Method of making an end cap connection for a fluid-resistance electrical device An end cap connection provides a strong mechanical bond as well as a fluid resistant seal between an electrically insulative tubular member and a conductive end piece or cap. The cap is provided with a generally U-shaped channel, and a quantity of synthet... | 05/24/1988 |
| 4743299 | Cermet substrate with spinel adhesion component The present invention is directed to a cermet material comprising a matrix of aluminum alloy with ceramic particles distributed therein. The cermet is adapted for use as a semiconductor substrate and is manufactured using powder technology procedures. The... | 05/10/1988 |
| 4742182 | Flatpack for hermetic encapsulation of piezoelectric components A flatpack package for hermetic encapsulation of piezoelectronic components, which flatpack is suitable for use in efficient and automated surface mounting (SMT). The flatpack package consists of a base plate, a cover plate and a mounting unit of two supp... | 05/03/1988 |
| 4739449 | Circuit package with thermal expansion relief chimney A circuit package (2) includes a housing (10) having a chimney (20) extending downwardly through an upper epoxy coating material (16) into a lower thermally expansible soft silicon coating material (14) which covers heat generating electrical components (... | 04/19/1988 |
| 4722137 | High frequency hermetically sealed package for solid-state components A package for discrete components is hermetically sealed, has very low parasitic inductance and capacitance, small size, 50 ohm input and output leads and is suitable for surface mount applications. The package comprises a ceramic base and a ceramic lid, ... | 02/02/1988 |
| 4721543 | Hermetic sealing device A method and apparatus for effecting a hermetic seal between an electronic component package and a package cover is disclosed. The method includes the steps of bonding a heater layer of conductive material to a sealing area of the package. A sealing mater... | 01/26/1988 |
| 4713729 | Device for avoiding local overheating on measuring transducers In order to avoid local overheating on the surface of an intrinsically safe measuring transducer provided with current limiting resistors and embedded in a sealing composition, a body of a good heat conducting material is arranged within the sealing compo... | 12/15/1987 |
| 4709122 | Nickel/indium alloy for use in the manufacture of a hermetically sealed container for semiconductor and other electronic devices This invention relates to a new and improved hermetically sealed container for semiconductor and other electronic devices, to a novel sealing cover for use in fabricating the above-referenced hermetically sealed container, and to novel processes for manuf... | 11/24/1987 |
| 4694119 | Heat shielded memory unit for an aircraft flight data recorder Solid state memory devices employed in crash survivable flight data recorders must be thermally insulated to prevent loss of stored data if the aircraft burns. To provide adequate thermal isolation at minimal size, the solid state electronic memory device... | 09/15/1987 |
| 4680543 | Pickup having encapsulated electrical and magnetic elements An electromagnetic pickup includes an insulating body that mounts a coil of wire surrounding a spool portion at one end of the body. A magnetic element is disposed within an axial passage through the body, including its spool portion. A sleeve-like molded... | 07/14/1987 |
| 4675472 | Integrated circuit package and seal therefor An integrated circuit package having a substrate of ceramic material having a cavity therein, a resilient seal rim connected to the substrate, a lid that may be inserted within said rim and a band of shape-memory alloy surrounding the rim to compress the ... | 06/23/1987 |
| 4673772 | Electronic circuit device and method of producing the same In connecting an electronic circuit part such as a semiconductor or other part to a substrate for mounting the part with solder, the solder is composed of a high-melting-point solder portion which is subjected to working such as rolling and heat treatment... | 06/16/1987 |
| 4666796 | Plated parts and their production Plated metal parts, such as sealing lids for semiconductor packages, in which an iron-based alloy layer is electroplated with a first layer of nickel, a first layer of gold is electroplated on the first nickel layer, a second layer of nickel is electropla... | 05/19/1987 |
| 4656499 | Hermetically sealed semiconductor casing An improved hermetically sealed semiconductor casing and a process for producing the casing are disclosed. This casing includes a lead frame having an electrical device affixed thereto. A base member is glass bonded to a matching surface of the lead frame... | 04/07/1987 |
| 4650922 | Thermally matched mounting substrate A mounting substrate (10) is formed from a platelet of graphite (22) conformally coated with a layer of silicon carbide (24). A layer of silicon dioxide (25) is disposed thereon and a chip (16) mounted onto the substrate (10). The silicon carbide has a th... | 03/17/1987 |
| 4649229 | All metal flat package for microcircuitry A flat package for electric microcircuits has an iron-nickel-cobalt alloy frame which is brazed to a molybdenum bottom at a temperature below about 400° C. The molybdenum bottom has successive layers of copper, nickel and gold plating.... | 03/10/1987 |
