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"That the automobile has practically reached the limit of its development is suggested by the fact that during the past year no improvements of a radical nature have been introduced."
Scientific American ; Jan. 2 edition, 1909
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| Number | Title | Issue Date |
| 7394029 | Module, method of manufacturing module, and electronic apparatus using module A module includes a circuit board, a first terminal on a lower surface of the circuit board, a first electronic component on an upper surface of the circuit board, a first cover made of metal covering the first electronic component, a second electronic component on ... | 07/01/2008 |
| 6612890 | Method and system for manufacturing electronic packaging units A method and system for fabricating electronic packaging units which include a molded body and a plurality of electrically conductive leads protruding therefrom. The packaging units are made by overlaying lead frames having leads and then depositing moldi... | 09/02/2003 |
| 6610923 | Multi-chip module utilizing leadframe A multi-chip module includes metal frame segments including a plurality of die-bonding pads and a plurality of terminals, a plurality of electronic components mounted on the die-bonding pads in electrical connection to the terminals, and a resin package f... | 08/26/2003 |
| 6239366 | Face-to-face multi-chip package A face-to-face multi-chip package comprises a lead frame comprising at least a die pad and a plurality of leads, wherein the leads further comprise a plurality of inner leads and a plurality of outer leads. The package further comprises at least three chi... | 05/29/2001 |
| 4855869 | Chip carrier A chip carrier including a substrate having a plurality of pads formed on the upper and lower surfaces thereof and wirings to connect the pads. The chip carrier also includes an integrated circuit chip having a plurality of leads connected to correspondin... | 08/08/1989 |
| 4820658 | Method of making a packaged IC chip A lead frame for use with an integrated circuit chip comprises a plurality of lead frame segments, each segment comprising a plurality of leads the inner ends of which converge towards a pad area for the chip encircled by the segments.... | 04/11/1989 |
| 4797787 | Lead frame and electronic device A lead frame and an electronic device incorporating the lead frame wherein the lead frame includes a chip support and a plurality of leads arranged around the chip support with each of the plurality of leads having one end disposed proximate to the chip s... | 01/10/1989 |
| 4796078 | Peripheral/area wire bonding technique An electronic assembly having a semiconductor device back bonded to a first lead frame. An adhesive insulative tape is placed on the first lead frame and the device. A second lead frame is mounted on the adhesive tape. Electrical contacts by wire bonds ar... | 01/03/1989 |
| 4761518 | Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs A semiconductor casing is formed of a ceramic-glass-metal composite material with a leadframe embedded in a base component. The leadframe may include holes therethrough to mechanically interlock with the composite material. Also, a process comprises formi... | 08/02/1988 |
| 4682207 | Semiconductor device including leadless packages and a base plate for mounting the leadless packages A semiconductor device includes a plurality of leadless packages and a base plate for mounting the leadless packages. The leadless packages include a semiconductor chip housed therein and a plurality of electrodes formed on the surface thereof. The base p... | 07/21/1987 |
| 4680617 | Encapsulated electronic circuit device, and method and apparatus for making same Encapsulated electronic circuit devices as well as methods and molding apparatus for making same are disclosed. For example, an integrated circuit "die" (or "chip") and the lead frame (or frames) to which it is physically affixed and electrically connecte... | 07/14/1987 |
| 4677526 | Plastic pin grid array chip carrier A low cost injection-molded plastic pin grid array chip carrier is provided as an alternative to a ceramic pin grid array chip carrier, in which an electrically superior package is fabricated by supporting nested lead frames in the mold cavity at the cent... | 06/30/1987 |
| 4380042 | Printed circuit lead carrier tape A printed circuit lead frame is provided as a carrier for integrated circuits. The conventional frame comprises a foil pattern that is provided with a plurality of fragile delicate lead fingers which are often bent and displaced laterally or vertically be... | 04/12/1983 |
| 4252864 | Lead frame having integral terminal tabs A continuous strip of stamped and formed lead frames for a semi-conductor chip comprises spaced apart parallel carrier strips with the lead frames connected to one of the carrier strips at regularly spaced intervals. Each lead frame comprises a chip suppo... | 02/24/1981 |
| 4195193 | Lead frame and chip carrier housing A lead frame and chip carrier housing are disclosed which can be used in packaging integrated circuit chips of a range of sizes and requiring varying numbers of leads in the lead frame. The lead frame comprises a centrally located square support portion h... | 03/25/1980 |
