Quotables
"What, sir, would you make a ship sail against the wind and currents by lighting a bonfire under her deck? I pray you, excuse me, I have not the time to listen to such nonsense."
Napoleon Bonaparte ; When told of the Robert Fulton steamboat
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7820920 | Casing and mounting device The present application discloses a casing and a corresponding mounting device, for protecting pins of an element from melting during a process flow in which the element is soldered on a circuit board, while saving an area required for soldering the element on the c... | 10/26/2010 |
| 7511232 | Substrate for mounting electronic part and electronic part The present invention is characterized by a structure having a substrate 1, and metallization layers 2 formed on the substrate 1, on which a Sn solder film 3 and an Ag film 4 are formed. The Ag film 4 is a metal free from ox... | 03/31/2009 |
| 7439452 | Multi-chip module packaging with thermal expansion coefficiencies In a transfer-mold configuration of an automotive electronic control unit, the thermal expansion coefficient of the circuit board is made apparently equal to that of the base member to suppress excessive stresses between them. The circuit board and the base member a... | 10/21/2008 |
| 7417198 | Radiofrequency power semiconductor module with cavity housing, and method for producing it The invention relates to a radiofrequency power semiconductor module having a cavity housing constructed from three modules, a 1st module, which has an upwardly and downwardly open housing frame with horizontally arranged flat conductors, a 2nd module, which has the... | 08/26/2008 |
| 7365981 | Fluid-cooled electronic system A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and... | 04/29/2008 |
| 7336500 | Method and apparatus for encapsulating a printed circuit board A demonstration tool for a programmable logic device is provided. The demonstration tool includes a circuit board partially disposed within a transparent block. A collar having an opening defined therein is disposed between the transparent clock and a base of the de... | 02/26/2008 |
| 7326594 | Connecting a plurality of bond pads and/or inner leads with a single bond wire An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least tw... | 02/05/2008 |
| 7301225 | Multi-row lead frame A lead frame (10) for a semiconductor device includes a first row of terminals (12) surrounding a die receiving area (14) and a second row of terminals (16) spaced from and surrounding the first row of terminals (12). The first and... | 11/27/2007 |
| 7266888 | Method for fabricating a warpage-preventive circuit board A and method for fabricating a warpage-preventive circuit board is provided, wherein a plurality of conductive traces are formed on a surface of an electrically-insulative core layer, and a plurality of discontinuous dummy circuit regions are disposed on the surface... | 09/11/2007 |
| 7244141 | Electric connector box In a heat radiator plate, a mounting bracket extending from a peripheral edge portion of the heat radiator plate, an auxiliary heat radiator plate portion extending along the mounting bracket and positioned between the mounting bracket 39 and a body through a... | 07/17/2007 |
| 7209360 | Leak-tight system for boxes containing electrical and electronic components The system consists of fixing the printed circuit board (3) to the bottom (1) of the body of the box with the cooperation of a perimetral and spacing flap (6) which creates a chamber (7) under the board (3), in which the components... | 04/24/2007 |
| 7183485 | Microelectronic component assemblies having lead frames adapted to reduce package bow The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-... | 02/27/2007 |
| 7166807 | Current sensor An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proxim... | 01/23/2007 |
| 7148430 | Electronic component mounting structure onto board A rotary electronic component is secured to a board by snap-in engagement of engagement portions provided on mounting portions of the electronic component with respective board engagement portions provided on the board. Terminal plates projecting from a side of the ... | 12/12/2006 |
| 6696669 | Circuit and method for heating an adhesive to package or rework a semiconductor die System for attaching a die to the die pad of a lead frame incorporating a resistive heating circuit into the die pad which heats up to cure an epoxy adhesive between the die and the pad and thereby attach the die to the pad. The heating circuit also heats... | 02/24/2004 |
| 6684496 | Method of making an integrated circuit package A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to ... | 02/03/2004 |
| 6667547 | High current capacity semiconductor device package and lead frame with large area connection posts and modified outline A lead frame for a high power semiconductor device die has three external lead conductors, the outer two of which are reentrantly bent outwardly from the center of the lead frame. When the lead frame is overmolded, the outer conductors are spaced from a c... | 12/23/2003 |
| 4862246 | Semiconductor device lead frame with etched through holes Those portions (i.e., the inner lead portions) of the leads of a semiconductor device, which are sealed by a package, are formed with a plurality of depression in at least the surfaces and backs thereof such that the depressions have a smaller diameter at... | 08/29/1989 |
| 4845313 | Metallic core wiring substrate A metallic core printed circuit board having a number of lead terminals such as IC or LSI lead terminals provided on at least one edge of an electrically conductive substrate which forms a core by etching or other process. The respective terminals are ele... | 07/04/1989 |
| 4843188 | Integrated circuit chip mounting and packaging assembly An integrated circuit chip mounting and packaging assembly is described. The assembly comprises a spreader having one or more chips centrally mounted thereon. A plurality of leads are disposed outward of the integrated circuit chip on the same side of the... | 06/27/1989 |
| 4835120 | Method of making a multilayer molded plastic IC package A multi-layered molded plastic package for encapsulating an integrated circuit is described. The package includes a carrier having a double-layered metal plate which are separated by an adhesive coated insulation tape. A second insulating tape layer is us... | 05/30/1989 |
| 4821148 | Resin packaged semiconductor device having a protective layer made of a metal-organic matter compound A silver electrode (4) on a lead frame (2) is bonded to an aluminum electrode (5) on a silicon chip (1) with a copper wire (3). The resulting semiconductor device was immersed in a solution of benzotriazole in ethyl alcohol. An Ag-benzotriazole film (6) w... | 04/11/1989 |
| 4818960 | Composite part and method of manufacturing same A composite part and a method of manufacturing the same, comprising a plurality of pairs of terminal members formed in punched regions of a lead frame opposite to each other and shaped by cutting at predetermined positions a plurality of pairs of projecti... | 04/04/1989 |
| 4818821 | Brazed leaded package A brazed leaded package is provided having buried brazed areas thereby eliminating the need of subsequent protective plating of the brazed areas. The package has a heat conductive support which supports a plurality of leads. The distal end of the leads te... | 04/04/1989 |
| 4809135 | Chip carrier and method of fabrication A ceramic chip carrier comprising a ceramic substrate and a copper lead frame directly bonded to the substrate, the lead frame being formed to provide leads in fringe regions beyond the edges of the substrate which are connected together by a removable ri... | 02/28/1989 |
| 4809054 | Semiconductor lead frame A semiconductor lead frame suitable for making electronic components from semiconductor chips. The lead frame is of one-piece construction and is provided with a pair of spaced outer side strips and a plurality of spaced cross strips integral with and spa... | 02/28/1989 |
| 4806106 | Interconnect lead frame for thermal ink jet printhead and methods of manufacture Disclosed herein is a method and apparatus for interconnecting a flexible (flex) circuit, printed circuit or the like to an ink jet printhead or other similar electronic device. This approach includes providing a flexible lead frame member between the fle... | 02/21/1989 |
| 4801997 | High packing density lead frame and integrated circuit Lead frame for mounting a semiconductor chip and improving the packing density of devices such as a plastic chip carrier type IC is disclosed. A portion of inner leads, located parallel to the chip stage and the edge of a molded case is made as thin as po... | 01/31/1989 |
| 4796239 | Circuit unit for timepiece and process for fabricating the same A circuit unit including a plurality of lead frames which are made of a metal sheet and one of which is used for die-bonding an integrated circuit. The die-bonding lead member is formed to have at least a generally H-shaped portion constructed of a pair o... | 01/03/1989 |
| 4788765 | Method of making circuit assembly with hardened direct bond lead frame In an electric circuit assembly (2) having conductive lead frames (8-10) directly bonded to an insulating substrate (6) by a eutectic, the lead frames are further subjected to a work hardening step (32, 34) to stiffen the lead frames and enable push-on fa... | 12/06/1988 |
| 4785533 | Hybrid integrated circuit device, and method of and lead frame for use in manufacturing same The present invention resides in a hybrid integrated circuit device comprising; a plurality of electronic parts; a wiring board mounting the plurality of electronic parts on the primary front surface thereof; and a plurality of leads secured to the edge o... | 11/22/1988 |
| 4780572 | Device for mounting semiconductors A device containing a semiconductor element having a substrate a cap over the substrate with a glass layer formed between the cap and the substrate providing a seal therebetween. Electrically conducting terminal members extend through the glass layer and ... | 10/25/1988 |
| 4772761 | Sealed electrical components and method of making same An electrical component (20) comprises electrical circuit means (22) and housing member (50) disposed over a first portion (24) of the electrical circuit means (22). The circuit means (22) has a second portion (30) extending outwardly from the housing mem... | 09/20/1988 |
| 4769690 | Metallizing paste for silicon carbide sintered body and a semiconductor device including the same The metal powder composition for the metallizing paste is composed of not less than 90 wt % gold, 0.03-3.0 wt % cadmium, 0.1-2.0 wt % bismuth, 0.01-1.0 wt % copper, 0.01-2.0 wt % germanium and 0.01-1.0 wt % silicon. The metallized paste bonds both the silicon ... | 09/06/1988 |
| 4769345 | Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor The present invention is directed to a process of forming a package for enclosing an electrical device wherein the enclosure contains a very low amount of oxygen and water vapor. The package includes a base and lid components bonded together by a sealing ... | 09/06/1988 |
| 4763188 | Packaging system for multiple semiconductor devices An improved high density packaging system for interconnecting integrated circuit devices includes a tin alloy lead frame sandwiched between two multi-layer glass/epoxy substrates encapsulated in an injection molded plastic/epoxy package. Integrated circui... | 08/09/1988 |
| 4761518 | Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs A semiconductor casing is formed of a ceramic-glass-metal composite material with a leadframe embedded in a base component. The leadframe may include holes therethrough to mechanically interlock with the composite material. Also, a process comprises formi... | 08/02/1988 |
| 4751611 | Semiconductor package structure A semiconductor package comprising a pair of flat moldings made from a thermoplastic resin, one of the flat moldings having in the cavity a projection which is welded to a rear side of a tab of lead frame mounting a semiconductor thereon by melt heating, ... | 06/14/1988 |
| 4751199 | Process of forming a compliant lead frame for array-type semiconductor packages A lead frame that is suited for use on array types of integrated circuit packages to provide a high degree of compliance for absorbing mechanical stress induced by thermal changes includes a series of individual terminal elements that are connected in a s... | 06/14/1988 |
| 4750031 | Hermetically sealable package for hybrid solid-state electronic devices and the like A small component package employing a ring frame 11 of a mouldable polyamide-imide thermoplastic directly moulded onto a heat conducting base plate 10 with integral moulded anchoring pins of the thermoplastic material engaging corresponding bores 21 and 2... | 06/07/1988 |
