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| Number | Title | Issue Date |
| 7781683 | Assembly for a microstimulator An electrode assembly includes an electrode electrically connected to a capacitor with a wire. An assembly carrier may be used to hold and secure at least the wire and capacitor during assembly. A method of assembly for attaching a wire to a capacitor and an electro... | 08/24/2010 |
| 7347106 | Torque sensor with inverted sensing element and integral shaft housing Torque sensing methods and systems are disclosed. In general, a sensing element and a sensor housing can be provided for maintaining the sensing element. A plurality of wirebond posts can be assembled perpendicular to a plane of the sensing element. The sensing elem... | 03/25/2008 |
| 7265991 | Housing cage for holding built-in modules A housing cage (1) comprising walls (2) defining sides of the housing cage and having wall sections (3). A plurality of contact surfaces (4), each of which is connected to one of said wall sections, are arranged so as to support built-in ... | 09/04/2007 |
| 6239366 | Face-to-face multi-chip package A face-to-face multi-chip package comprises a lead frame comprising at least a die pad and a plurality of leads, wherein the leads further comprise a plurality of inner leads and a plurality of outer leads. The package further comprises at least three chi... | 05/29/2001 |
| 6239367 | Multi-chip chip scale package A multi-chip chip scale package. The package has a film carrier whereby two chips with different sizes can be disposed on the same film carrier. A flip chip technique is used to arrange each chip on each side of the film carrier face to face. A bump is fo... | 05/29/2001 |
| 4870224 | Integrated circuit package for surface mount technology The present invention provides for an apparatus and a method for housing an integrated circuit device. The integrated circuit device is coupled to a ceramic substrate wherein contacts of the integrated circuit device mate with contacts on the substrate su... | 09/26/1989 |
| 4864079 | Electrical components and assemblies A surface-mounted electrical component has rectangular section leads that project outwardly from the edges of the component body. The leads are bent down towards the surface of the substrate and are twisted through 90 degrees about their length to make th... | 09/05/1989 |
| 4829669 | Method of manufacturing a chip carrier A method of manufacturing a chip carrier having the J-shaped leads extending from the lateral sides of the enclosure of the chip carrier with the end facing the bottom of the enclosure is disclosed. The leads first extending laterally is made to have a ci... | 05/16/1989 |
| 4821151 | Hermetically sealed package A hermetically sealed package adapted to house a plurality of semiconductor devices. The package include a multi-layer circuit device formed of a plurality of ceramic substrates and conductive circuit patterns disposed therebetween. A ceramic cover having... | 04/11/1989 |
| 4801765 | Electronic component package using multi-level lead frames Disclosed is a semiconductor package with a high pin count. External contacts to the chip are provided by interdigitated leads formed from an upper and lower lead frame. The lower lead frame includes a paddle for mounting the chip. The upper lead frame in... | 01/31/1989 |
| 4724280 | Package for integrated circuit PLCC (Plastic Leaded Chip Carrier) for a LSI having protuberances on the bottom along its lateral side, is provided with interconnectors between leg portions of adjacent protuberances. Each interconnector is a swelling from the bottom surface of the main ... | 02/09/1988 |
| 4698660 | Resin-molded semiconductor device A resin-molded semiconductor package device includes a plurality of grooves which are spaced a predetermined distance from each other in the edge portions defined by the main surface and the side surfaces of the main body of a resin-molded package, which ... | 10/06/1987 |
| 4611092 | Surface mount package for toroids A surface mount package for toroids or the like inductive elements has the element sandwiched between two non-conductive plates. Spring clips hold the sandwich together, and the element leads are connected to the clips. The assembly is potted, leaving onl... | 09/09/1986 |
| 4549247 | Carrier element for IC-modules A carrier element for IC modules, whereby several leads are arranged on a carrier film, which leads are each connected at one end with a terminal of the module and run into a contact surface at the other end. Whereas the contact surfaces are arranged on t... | 10/22/1985 |
| 4331831 | Package for semiconductor integrated circuits A plastic encapsulation of the chip carrier type for a semiconductor integrated circuit is described. The package includes a lead frame member formed from a continuous metal tape which permits reel-to-reel automatic processing. The lead frame member provi... | 05/25/1982 |
| 4195193 | Lead frame and chip carrier housing A lead frame and chip carrier housing are disclosed which can be used in packaging integrated circuit chips of a range of sizes and requiring varying numbers of leads in the lead frame. The lead frame comprises a centrally located square support portion h... | 03/25/1980 |
| 4141029 | Integrated circuit device An improved integrated circuit device includes a lead frame having a pad and having a plurality of lead members extending away from a location adjacent to the pad. The lead frame is blanked from a metal laminate which is formed by pressure bonding a layer... | 02/20/1979 |
| 4139726 | Packaged microcircuit and method for assembly thereof A packaged microcircuit includes a housing of insulating material having a plurality of apertures which extend from the interior of the housing to the outside. A metallized lead connection surface is formed on a wall of each aperture. A microcircuit havin... | 02/13/1979 |
| 4028722 | Contact bonded packaged integrated circuit Wire bonding is eliminated in the assembly of microelectronic devices, by a process involving the direct bonding of circuit electrodes to a metallic sheet-frame member having a plurality of inwardly extending leads. A single-step bonding technique is empl... | 06/07/1977 |
