Famous Patents
3M employee and church chorister Art Fry needed something to temporarily mark pages in his hymnal. He was in luck because his colleague, Spencer Silver, accidentally developed a glue that was too weak for other purposes. After initially discouraging consumer response, Post-it Notes became a hit in 1979.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8157415 | Light emitting diode lighting module and method for making the same A method for making a light emitting diode lighting module includes steps of: (a) packaging a plurality of light emitting diode dies respectively on a plurality of die-mounting parts of a metal lead frame to form a plurality of light emitting diodes, respectively; a... | 04/17/2012 |
| 7968807 | Package having a plurality of mounting orientations A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to per... | 06/28/2011 |
| 7439452 | Multi-chip module packaging with thermal expansion coefficiencies In a transfer-mold configuration of an automotive electronic control unit, the thermal expansion coefficient of the circuit board is made apparently equal to that of the base member to suppress excessive stresses between them. The circuit board and the base member a... | 10/21/2008 |
| 7319598 | Electronic component with a housing package The invention relates to an electronic component with a housing package comprising a number of layers of plastic with at least one buried interconnect layer and with at least one semiconductor chip, which has pointed-conical external contacts distributed on an outer... | 01/15/2008 |
| 7309648 | Low profile, chip-scale package and method of fabrication Disclosed is a semiconductor device that includes an electrically insulating, sheet-like substrate with first and second surfaces, at least one opening, and a certain thickness. On the first surface are a plurality of electrically conductive routing strips and a plu... | 12/18/2007 |
| 7268351 | Gas sensor module for the spectroscopic measurement of a gas concentration A gas sensor module for the spectroscopic measurement of at least one gas concentration, including at least: a spectroscopic gas sensor having a sensor chip which has a micropatterned measuring structure, and having an IR-transparent cap chip covering the measuring ... | 09/11/2007 |
| 7196506 | Surface-mounted integrated current sensor Described herein is a surface-mounted integrated current sensor for use in a printed circuit having a track along which there flows, in use, the electric current to be measured. The current sensor comprises a package having a bottom face facing, in use, the printed ... | 03/27/2007 |
| 6684496 | Method of making an integrated circuit package A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to ... | 02/03/2004 |
| 6677746 | Wheel speed sensor for a vehicle which has a function of preventing a coil open circuit Disclosed is a wheel speed sensor for a vehicle which has a function of detecting revolution of the wheel in order to provide a uniform braking power when a vehicle brakes. The wheel speed sensor is installed at a position adjacent to a sensor rotor of a ... | 01/13/2004 |
| 6239366 | Face-to-face multi-chip package A face-to-face multi-chip package comprises a lead frame comprising at least a die pad and a plurality of leads, wherein the leads further comprise a plurality of inner leads and a plurality of outer leads. The package further comprises at least three chi... | 05/29/2001 |
| 4870224 | Integrated circuit package for surface mount technology The present invention provides for an apparatus and a method for housing an integrated circuit device. The integrated circuit device is coupled to a ceramic substrate wherein contacts of the integrated circuit device mate with contacts on the substrate su... | 09/26/1989 |
| 4843695 | Method of assembling tab bonded semiconductor chip package A package for housing fabricated semiconductor chips is disclosed. The package has ceramic base with a raised outer shelf extending around its periphery. The outer shelf defines a space in the package where the chip is seated. A lead frame with a number o... | 07/04/1989 |
| 4845313 | Metallic core wiring substrate A metallic core printed circuit board having a number of lead terminals such as IC or LSI lead terminals provided on at least one edge of an electrically conductive substrate which forms a core by etching or other process. The respective terminals are ele... | 07/04/1989 |
| 4832996 | Semiconductor die for plastic encapsulation having an adhesion promoter A semiconductor die for plastic encapsulation having an adhesion promoter selectively disposed on an outer surface enabling better adhesion between the semiconductor die and a plastic encapsulation. The improved adhesion allows for less relative motion be... | 05/23/1989 |
| 4821148 | Resin packaged semiconductor device having a protective layer made of a metal-organic matter compound A silver electrode (4) on a lead frame (2) is bonded to an aluminum electrode (5) on a silicon chip (1) with a copper wire (3). The resulting semiconductor device was immersed in a solution of benzotriazole in ethyl alcohol. An Ag-benzotriazole film (6) w... | 04/11/1989 |
| 4812896 | Metal electronic package sealed with thermoplastic having a grafted metal deactivator and antioxidant A package and process of assembling a package adapted for housing an electronic component. The package includes metallic base, lid and leadframe components sealed together with a thermoplastic material. The thermoplastic has an additive consisting essenti... | 03/14/1989 |
| 4806106 | Interconnect lead frame for thermal ink jet printhead and methods of manufacture Disclosed herein is a method and apparatus for interconnecting a flexible (flex) circuit, printed circuit or the like to an ink jet printhead or other similar electronic device. This approach includes providing a flexible lead frame member between the fle... | 02/21/1989 |
| 4797787 | Lead frame and electronic device A lead frame and an electronic device incorporating the lead frame wherein the lead frame includes a chip support and a plurality of leads arranged around the chip support with each of the plurality of leads having one end disposed proximate to the chip s... | 01/10/1989 |
| 4792880 | Terminal module A terminal module provides for attaching components to terminals of a terminal frame. The terminal module utilizes an integral printed circuit board having a component assembly potted within a rectangular plastic shell with the remaining portion of the pr... | 12/20/1988 |
| 4785533 | Hybrid integrated circuit device, and method of and lead frame for use in manufacturing same The present invention resides in a hybrid integrated circuit device comprising; a plurality of electronic parts; a wiring board mounting the plurality of electronic parts on the primary front surface thereof; and a plurality of leads secured to the edge o... | 11/22/1988 |
| 4769344 | Method of resin encapsulating a semiconductor device A semiconductor device and a method for manufacturing a semiconductor device of a type having a resin package and a window in the package such as a quartz glass window transparent to ultraviolet rays. A semiconductor chip is bonded onto a surface of a die... | 09/06/1988 |
| 4769690 | Metallizing paste for silicon carbide sintered body and a semiconductor device including the same The metal powder composition for the metallizing paste is composed of not less than 90 wt % gold, 0.03-3.0 wt % cadmium, 0.1-2.0 wt % bismuth, 0.01-1.0 wt % copper, 0.01-2.0 wt % germanium and 0.01-1.0 wt % silicon. The metallized paste bonds both the silicon ... | 09/06/1988 |
| 4766095 | Method of manufacturing eprom device A method of manufacturing an EPROM IC device encapsulated in a plastic-molded package having a window for passing ultraviolet rays therethrough. An EPROM IC chip is fixed to a chip mounting region of a lead frame. The EPROM IC chip is placed in a hollow c... | 08/23/1988 |
| 4763188 | Packaging system for multiple semiconductor devices An improved high density packaging system for interconnecting integrated circuit devices includes a tin alloy lead frame sandwiched between two multi-layer glass/epoxy substrates encapsulated in an injection molded plastic/epoxy package. Integrated circui... | 08/09/1988 |
| 4761518 | Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs A semiconductor casing is formed of a ceramic-glass-metal composite material with a leadframe embedded in a base component. The leadframe may include holes therethrough to mechanically interlock with the composite material. Also, a process comprises formi... | 08/02/1988 |
| 4756080 | Metal foil semiconductor interconnection method A single layer copper foil tape is provided having a center core and connected lead beams. Etched apertures are formed to separate adjacent lead beams and to form relatively high strength foil straps connecting edge portions of the foil tape and the cente... | 07/12/1988 |
| 4747017 | Surface mountable integrated circuit package equipped with sockets A surface mount package formed by nesting an encapsulated tape automated bonding integrated circuit module in between two plastic rings snapped together, the inner surface of the outer ring contains recessed sockets for receiving socket pins upstanding on... | 05/24/1988 |
| 4701999 | Method of making sealed housings containing delicate structures A method of making an integrated circuit package comprising an integrated "chip" within an hermetically sealed housing with external electrical leads extending from the chip terminals, and the product formed by such method. The method involves injection m... | 10/27/1987 |
| 4697203 | Semiconductor device and manufacturing method therefor A semiconductor device and a method for manufacturing a semiconductor device of a type having a resin package and a window in the package such as a quartz glass window transparent to ultraviolet rays. A semiconductor chip is bonded onto a surface of a die... | 09/29/1987 |
| 4677526 | Plastic pin grid array chip carrier A low cost injection-molded plastic pin grid array chip carrier is provided as an alternative to a ceramic pin grid array chip carrier, in which an electrically superior package is fabricated by supporting nested lead frames in the mold cavity at the cent... | 06/30/1987 |
| 4656499 | Hermetically sealed semiconductor casing An improved hermetically sealed semiconductor casing and a process for producing the casing are disclosed. This casing includes a lead frame having an electrical device affixed thereto. A base member is glass bonded to a matching surface of the lead frame... | 04/07/1987 |
| 4630170 | Decoupling capacitor and method of manufacture thereof A decoupling capacitor and method of manufacture thereof are presented wherein the decoupling capacitor is formed from a lead frame which contains the four leads of the capacitor (two of which are electrically inactive) on a single plane. The use of a lea... | 12/16/1986 |
| 4616412 | Method for bonding electrical leads to electronic devices A preformed metallic tape for thermocompression bonding to electronic component chips and a method and apparatus for the use thereof. The tape has etched thereinto a chip bonding site which includes a central, pull-tab region surrounded by a frame region.... | 10/14/1986 |
| 4592131 | Method for manufacturing resin-sealed semiconductor device A method for manufacturing a resin-sealed semiconductor device wherein after a semiconductor pellet is sealed to a leadframe with a resin, outer leads projected from the leadframe and adhered with burrs are collapsed by their upper or upper and lower corn... | 06/03/1986 |
| 4582556 | Adhesion primers for encapsulating epoxies A copper plastic laminate is provided having a high bond strength. The copper is selected from the group consisting of copper and copper alloys and has on its surface a uniform glassy-like, substantially pore-free coating of copper phosphate. A plastic en... | 04/15/1986 |
| 4567545 | Integrated circuit module and method of making same An integrated circuit module adapted to connect an integrated circuit to an electrical connector. A lead frame (20) with lengthened leads (22), compared to the lead frame of a conventional DIP packaged IC, is laminated to a nonconductive substrate (46). T... | 01/28/1986 |
| 4556896 | Lead frame structure A novel lead frame structure is provided which contains an integral arrangement of leads for connection to a semiconductor device and a molded housing is then molded around the semiconductor device and the lead frame. The lead elements of the frame are th... | 12/03/1985 |
| 4554404 | Support for lead frame for IC chip carrier A support for a lead frame for use with an integrated circuit chip is made of electrically insulative material, preferably a thermoplastic. There is a pad area at the center of the support in which an IC chip can be disposed. Proximate the periphery of th... | 11/19/1985 |
| 4546412 | Electronic device for automobile An electronic device for an automobile is roughly divided into individual parts and control circuit elements which are mounted in a casing divided into two compartments, according to the present invention. The individual parts are arranged in one compartm... | 10/08/1985 |
| 4514750 | Integrated circuit package having interconnected leads adjacent the package ends A package for an integrated circuit is provided with interconnected leads within accessable recesses in the enclosure of the package. The interconnections of the leads is severed to isolate each leads from all other leads.... | 04/30/1985 |
