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| Number | Title | Issue Date |
| 7935899 | Circuit device and method of manufacturing the same Provided is a circuit device in which an electronic circuit to be incorporated therein operates stably. A hybrid integrated circuit device includes multiple circuit boards which are disposed on approximately the same plane. An electronic circuit including a conducti... | 05/03/2011 |
| 7622684 | Electronic component package An electronic component package comprises: an electronic component where device elements are mounted inside cavities formed between a component substrate and a component cover that covers the component substrate; and a mounting substrate. The component cover is plac... | 11/24/2009 |
| 7439452 | Multi-chip module packaging with thermal expansion coefficiencies In a transfer-mold configuration of an automotive electronic control unit, the thermal expansion coefficient of the circuit board is made apparently equal to that of the base member to suppress excessive stresses between them. The circuit board and the base member a... | 10/21/2008 |
| 7421781 | Method of forming a module component having a plurality of penetration holes According to the invention, the method of manufacturing a module component comprises an inserting step of inserting a chip component in a first molding die; a primary molding step of filling the first molding die with resin with a first end electrode of the chip com... | 09/09/2008 |
| 7361880 | Digital camera module for detachably mounting with flex printed circuit board A digital camera module (100) includes a holder, an image sensor chip package (30), a number of conductive elements (24) and a circuit board (40). The holder defines a receiving portion. The holder is mounted on the image sensor chip pack... | 04/22/2008 |
| 7279784 | Semiconductor package A semiconductor package mainly includes a semiconductor chip and a plurality of L-shaped leads arranged at the periphery of the semiconductor chip. Each of the L-shaped leads has an inner lead portion exposed out of the lower surface of the semiconductor package and... | 10/09/2007 |
| 7256979 | Ion generator, and electric apparatus and air conditioning apparatus incorporating the same A booster coil is stored in a coil storing room provided in the bottom section of a common case having an opening on one side, and is insulation-molded with a filler. A circuit substrate is inserted into the common case and supported by a supporting edge which is pr... | 08/14/2007 |
| 7205574 | Optical semiconductor device An integral-detem-type optical semiconductor device employing lead frame(s) 11, shield case region(s) 111 created by bending portion(s) of lead frame(s) 11 extending to the exterior being disposed between light-emitting lens portion(s) 19... | 04/17/2007 |
| 7145230 | Semiconductor device with a solder creep-up prevention zone The present invention provides a semiconductor device which includes a U-shaped metal package base, and a semiconductor chip having at least surface electrodes and being mounted on the inner bottom portion of the U-shaped metal package base, wherein the metal packag... | 12/05/2006 |
| 6657137 | Connection structure and connection method of for connecting two circuit boards In a connection structure for both first and second circuit boards, plural first terminals are arranged on the first circuit board in an arrangement direction, and plural second terminal are arranged on the second circuit board in the arrangement directio... | 12/02/2003 |
| 6653564 | Conductor strip arrangement for a molded electronic component and process for molding At least one semiconductor element is located on an electrically conducting conductor strip. Around the conductor strip and the at least one semiconductor element, a housing made of a molding material is arranged such that there are still frame sections o... | 11/25/2003 |
| 6649834 | Injection molded image sensor and a method for manufacturing the same An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a... | 11/18/2003 |
| 6632997 | Personalized circuit module package and method for packaging circuit modules A personalized circuit module package and method for packaging circuit modules provides graphical packaging for memory modules and other circuit modules. A removable housing is attached to a circuit module containing one or more integrated circuits bonded... | 10/14/2003 |
| 6239366 | Face-to-face multi-chip package A face-to-face multi-chip package comprises a lead frame comprising at least a die pad and a plurality of leads, wherein the leads further comprise a plurality of inner leads and a plurality of outer leads. The package further comprises at least three chi... | 05/29/2001 |
| 4859631 | Fitting process for packaging a semiconductor component in a plastic box The invention relates to the encapsulation of a seminconductor component in a plastic box. The fitting assembly comprises a radiator plate, a ceramic plate, a copper counter-electrode, a semiconductor pellet, a connecting pin with its end bent back and we... | 08/22/1989 |
| 4791608 | Memory card having shutter protected terminals A memory card adapted to be removably loaded into electronic equipment comprises a printed circuit board having a memory element mounted thereon and a contact pattern for making an electrical connection with the electronic equipment, a case for accommodat... | 12/13/1988 |
| 4674820 | Reusable junction box electrical terminal cap A reusable cap encapsulates an electrical terminal in a junction box which routes communication lines such as phone wires. The cap includes a tubular body having a self tearing slot which receives a phone wire radially extending from a stud of a terminal.... | 06/23/1987 |
| 4629824 | IC package sealing technique An IC package with an improved seal includes a sealant penetrator in the form of a projection on each lead for penetrating the provided seal. In a preferred embodiment the penetrator is a semi-circular projection formed on the lead which penetrates the se... | 12/16/1986 |
| 4628146 | Casing for electrical components, component assemblies or integrated circuits A casing for electrical components, component assemblies or integrated circuits, and particularly for electrical surface-wave filters, is disclosed as well as a method of production therefor where the electrically active element rests on a base strip from... | 12/09/1986 |
| 4506108 | Copper body power hybrid package and method of manufacture A hybrid microcircuit package especially for high power microcircuits comprises a hard copper base with integral packaged sidewalls, a sealing frame of Kovar or stainless steel is electron beam welded or laser welded to the top surface of said sidewalls, ... | 03/19/1985 |
| 4453033 | Lead grounding A microcircuit package in which one or more leads can be grounded to the package by a simple procedure which is performed on a package of usual construction. A braze preform is placed over a lead to be grounded, a metal washer is disposed over the lead an... | 06/05/1984 |
| 4443655 | Extruded semiconductor package and fabrication method A high power semiconductor package having an extruded metal housing which includes electrical terminals integrally formed with the housing and which, after assembly and encapsulation of the package, are electrically isolated by selected removal of interme... | 04/17/1984 |
| 4412093 | Microcircuit flat pack with integral shell A microcircuit flat package which remains hermetically sealed even under conditions of high stress. The package comprises an integral rectangular metal tubular shell having an opening in one of the broad walls, and elongated integral insulators sealed in ... | 10/25/1983 |
| 4266089 | All metal flat package having excellent heat transfer characteristics An all-metal flat package for microcircuits is described which has a copper bottom and a stainless steel frame. Beryllia substrates carrying power chips can readily be soldered into the package which has good heat transfer characteristics.... | 05/05/1981 |
| 4262165 | Packaging structure for semiconductor IC chip A packaging structure for a semiconductor IC chip, in which lead electrodes connected with the chip are extended out through a binding agent filled in a sealing gap, characterized in that in the vicinity of the lead electrodes the outer surface of the bin... | 04/14/1981 |
| 4229403 | Method of assembling a fault limiter by molding a rigid housing about a non-rigid subassembly A helical fusible element is supported by an element support member which is disposed between two terminal assemblies, which terminal assemblies are of larger diameter than the diameter of the combination of the fusible element and the element support mem... | 10/21/1980 |
| 4205365 | Boxed capacitor with bimetallic terminals and method of making A rolled metallized film capacitor is terminated with bimetallic terminals. A method of manufacture of this terminated capacitor contemplates inserting a capacitor blank with heat fusible end electrodes in a plastic box to position the electrodes between ... | 05/27/1980 |
| 4167647 | Hybrid microelectronic circuit package An electronic package including a single substrate for supporting a semiconductor device or die, an integrated circuit chip, or other electronic components on each side thereof. The substrate is configured with a plurality of cavities which are spaced aro... | 09/11/1979 |
| 4132856 | Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby A process of packaging an electronic integrated circuit which comprises a film carrier having metallized connector leads formed thereon to provide the connector leads for the integrated circuit (a hermetically sealed bumped die); gang-bonding the die to s... | 01/02/1979 |
| 4115838 | Packaging of a semiconductor A solid state electrical component is packaged within a housing and after connection to a terminal board is potted by an encapsulating medium. The solid state electrical component includes a chip area and a plurality of terminals connected to the chip. Th... | 09/19/1978 |
| 4012579 | Encapsulated microcircuit package and method for assembly thereof A microcircuit deposited on a substrate is encapsulated within a housing having bottom and top cover portions. The substrate initially is adhesively secured to the bottom cover portion. The bottom and top cover portions then are placed into engagement, th... | 03/15/1977 |
| 4011398 | Electrical connection to a circuit potted within a housing and method of same An electrically conductive terminal having a connecting end and a mating end is affixed to a terminal assembly, the resultant subassembly placed within a housing containing a circuit board. The subassembly is located to effect electrical connection betwee... | 03/08/1977 |
