Bizarre Patents
Mountable Printable Placard With Headband
A resilient headband in a shape for being mounted on the head of the user. The headband is equipped with a longitudinal slotted member for holding a placard.
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| Number | Title | Issue Date |
| 8053685 | Metal wiring plate A metal wiring plate includes a soldering portion to which an electronic device is soldered and a wiring portion extending from the soldering portion and configured to electrically connect the electronic device to other device. The wiring portion includes a narrow p... | 11/08/2011 |
| 7781682 | Methods of fabricating multichip packages and structures formed thereby Methods and associated structures of forming a discontinuous sealant on a substrate, wherein an opening is formed at an integrated heat spreader gap region, wherein the substrate comprises a portion of a multi chip microelectronic package. A thermal interface materi... | 08/24/2010 |
| 7495183 | Electronic circuit apparatus An electronic circuit apparatus has a casing, a circuit board at which electronic members and power transistors are mounted, and a connector for connecting the circuit board with an external electrical circuit. The casing is insertion-molded by a resin, with the cir... | 02/24/2009 |
| 7352585 | Flip chip heat sink package and method An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first... | 04/01/2008 |
| 7309838 | Multi-layered circuit board assembly with improved thermal dissipation A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature dissipation resin, which is of insulating material and is arranged so as to d... | 12/18/2007 |
| 7256494 | Chip package A chip package including a heat spreader, a circuit substrate, locating structures, a chip, wires, and an encapsulating compound is provided. The heat spreader has a bonding surface, and the circuit substrate is disposed on the bonding surface of the heat spreader. ... | 08/14/2007 |
| 4868349 | Plastic molded pin-grid-array power package A molded pin-grid-array package includes a heat sink available at the face opposite to the pins. The heat sink is secured to a printed wiring board that has plated through holes therein that form the desired pin-grip-array and wires are secured in the hol... | 09/19/1989 |
| 4832996 | Semiconductor die for plastic encapsulation having an adhesion promoter A semiconductor die for plastic encapsulation having an adhesion promoter selectively disposed on an outer surface enabling better adhesion between the semiconductor die and a plastic encapsulation. The improved adhesion allows for less relative motion be... | 05/23/1989 |
| 4686324 | Cold-seal package for withstanding high temperatures A cold-seal package affording resistance to high temperatures, comprising a base and a cover provided with an annular flange and so designed as to be brought into contact with each other in such a manner as to permit cold-sealing and encapsulation of an e... | 08/11/1987 |
| 4436951 | Semiconductor power module Semiconductor power module, including a substantially prismatic plastic housing with a lower surface having a recess with a shoulder-like step formed in the periphery thereof, a ceramic plate being inserted into the step and having an outer flat surface e... | 03/13/1984 |
| 4396936 | Integrated circuit chip package with improved cooling means An integrated circuit package in which an integrated circuit chip having flexible beam leads, the inner lead bonding sites of which are bonded to input and output terminals on the active face of the chip, is mounted active face down on the top surface of ... | 08/02/1983 |
| 4195193 | Lead frame and chip carrier housing A lead frame and chip carrier housing are disclosed which can be used in packaging integrated circuit chips of a range of sizes and requiring varying numbers of leads in the lead frame. The lead frame comprises a centrally located square support portion h... | 03/25/1980 |
| 4147889 | Chip carrier An improved chip carrier of thin dieletric deformed into a dish configuration provided with flexible mounting flanges on which are plated or bonded solderable conductive traces and paths together with plated or bonded heat sinks which may be referenced to... | 04/03/1979 |
| 4132856 | Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby A process of packaging an electronic integrated circuit which comprises a film carrier having metallized connector leads formed thereon to provide the connector leads for the integrated circuit (a hermetically sealed bumped die); gang-bonding the die to s... | 01/02/1979 |
| 4066839 | Molded body incorporating heat dissipator A heat-dissipating metal bar to be imbedded in a molded body of plastic material, together with a punched metal foil forming an array of conductor strips to be soldered to a silicon chip, has a large exposed surface and is provided on its opposite surface... | 01/03/1978 |
| 4032706 | Resin-encased microelectronic module A metal plate carrying a semiconductive chip is encased in a prismatic resinous body having five tongues projecting from one side thereof, the central tongue being grounded to the plate while the other four are attached to various terminals of the chip. T... | 06/28/1977 |
