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| Number | Title | Issue Date |
| 8110755 | Package for an optical device A device includes: a package having a bottom and a side wall surrounding the bottom; an element adhered to the bottom of the package; an internal contact formed inside the package; a resin encapsulation material with which a space between the package and the element... | 02/07/2012 |
| 8097816 | Electronic device and method of producing the same A method of producing an electronic device includes a holding of a circuit board and a decoration sheet in a cavity of a mold, and a filling and solidifying of thermosetting resin in the cavity. A casing is molded by the solidified thermosetting resin so as to seal ... | 01/17/2012 |
| 8071895 | Waterproof USB drives and method of making A data storage device and methods of manufacture are provided which tend to protect the device against moisture and shock. The device includes a circuit board, a coating, a housing, and preferably a sealant. The circuit board is in electrical communication with an e... | 12/06/2011 |
| 7829798 | Electronic control unit and process of producing the same An electronic control unit includes a printed wiring board (50), electronic components (51 to 53) mounted on the printed wiring board (50), and a synthetic resin coating (57) formed by injection molding to cover the printed wiring ... | 11/09/2010 |
| 7812264 | Functional element-mounted module and a method for producing the same A functional element-mounted module can be decreased in size and requires no costly and special members for a light transition member. A substrate is used, on which an optical functional element having an optical function part and bonding pads therearound is mounted... | 10/12/2010 |
| 7807934 | Printed circuit board having protection means and a method of use thereof A printed circuit board is provided with protection means for protecting one or more components of the printed circuit board (PCB). The protection means includes a sleeve member located on the PCB around at least one component of the PCB. The protection means furthe... | 10/05/2010 |
| 7608789 | Component arrangement provided with a carrier substrate A component arrangement includes a carrier substrate having at least one component arranged thereon. The carrier substrate contains at least one layer of glass film and an intermediate layer, which is mounted on at least one side of the glass film. The component is ... | 10/27/2009 |
| 7586048 | Electronic component The invention relates to a surface mount type electronic component to be mounted on a printed circuit board or a hybrid IC (HIC) and provides a low-cost electronic component which is reliable in terms of heat resistance and pressure resistance. An inductor as the el... | 09/08/2009 |
| 7563990 | Electronic product, a body and a method of manufacturing The electronic product comprises a body with a three-dimensional shape that is derived from the product. The body is provided with a pattern of conductors including contact pads and at least one electric element, in which the conductors are mechanically anchored in ... | 07/21/2009 |
| 7531757 | IC card and semiconductor integrated circuit device package An IC card includes a semiconductor integrated circuit device package having one surface and another surface opposite to the one surface, card terminals on the one surface of the package, and a base card which includes a concave portion attached to the other surface... | 05/12/2009 |
| 7488904 | Resin molded component fitted with a metal plate and molding method therefor A sensor unit (1) has a metal plate (10), a resin molded portion (20) and an oil temperature sensor (2). Busbars (4) made of a metal are arranged in the resin molded portion (20). Since the busbars (4) are insert-mold... | 02/10/2009 |
| 7459642 | RIM slot filler module and method of manufacturing the same A slot filler module is presented. The slot filler module includes a RIM molded encapsulant, an insert disposed in a predetermined location within the encapsulant and a connector disposed proximate a first end of the RIM molded encapsulant. ... | 12/02/2008 |
| 7443693 | Electromagnetic interference shielding for a printed circuit board The present invention provides shielded printed circuit boards and electronic devices. The printed circuit board may comprise an internal network of grounded conductive elements that are coupleable to an EMI shield that is mounted on the printed circuit board. The n... | 10/28/2008 |
| 7439452 | Multi-chip module packaging with thermal expansion coefficiencies In a transfer-mold configuration of an automotive electronic control unit, the thermal expansion coefficient of the circuit board is made apparently equal to that of the base member to suppress excessive stresses between them. The circuit board and the base member a... | 10/21/2008 |
| 7421781 | Method of forming a module component having a plurality of penetration holes According to the invention, the method of manufacturing a module component comprises an inserting step of inserting a chip component in a first molding die; a primary molding step of filling the first molding die with resin with a first end electrode of the chip com... | 09/09/2008 |
| 7397001 | Multi-strand substrate for ball-grid array assemblies and method A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M columns (16) to form an N by M array. N and M... | 07/08/2008 |
| 7390978 | Overmolded electronic assembly and overmoldable interface component An overmolded electronic assembly (900, 1000, 1200) is fabricated from one or more overmoldable interface components (300, 400, 500, 1220, 1750) that may be electrical contacts or electronic components that have physical interfaces, such as speakers or... | 06/24/2008 |
| 7372136 | Chip card retaining mechanism A chip card retaining mechanism for retaining a chip card mounted in an electronic device. The electronic device includes a housing (10). The housing has a battery compartment (12) defined therein. The chip card retaining mechanism includes a receiving... | 05/13/2008 |
| 7365427 | Stackable semiconductor package The present invention relates to a stackable semiconductor package, comprising a first substrate, a chip, a second substrate, a plurality of second wires, a plurality of supporting elements and a molding compound. The chip is disposed on and electrically connected t... | 04/29/2008 |
| 7358106 | Hermetic MEMS package and method of manufacture A swage hermetic sealing of a MEMS or microdevice or nanodevice package using high force. A cutting and flowing edge 430 is formed on a package cover which is pressed into a mating , integral gasket 425 on a package base. A material extension of the pa... | 04/15/2008 |
| 7358482 | Packaging structure of a light-sensing element and fabrication method thereof The present invention discloses a packaging structure of a light-sensing element and a fabrication method thereof, wherein the light-sensing chip is installed on the substrate, and then a cleaning step is undertaken; next, a light transparent cover with a cavity is ... | 04/15/2008 |
| 7355547 | Vehicle-mounted millimeter wave radar device, millimeter wave radar module, and manufacturing method thereof An object of the present invention is to provide a millimeter wave radar device and module that provides a hollow structure while assuring adequate moisture resistance. A multilayer substrate on which at least one millimeter wave MMIC is mounted and a cap for... | 04/08/2008 |
| 7351920 | IC card and semiconductor integrated circuit device package An IC card includes a semiconductor integrated circuit device package having one surface and another surface opposite to the one surface, card terminals on the one surface of the package, and a base card which includes a concave portion attached to the other surface... | 04/01/2008 |
| 7349227 | Electronic control device An electronic control device includes a circuit substrate consisting of four rigid portions and intervening flexible portions which are serially connected to each other. This circuit substrate is accommodated in a casing in such a manner that respective flexible por... | 03/25/2008 |
| 7342807 | Modules for a measuring device and measuring device The invention relates to a module for a measuring device and to a measuring device. The inventive module for a measuring device is provided with a plug-in contact element for the electrical contact of the plug-and-socket plate of the measuring device which is used f... | 03/11/2008 |
| 7335993 | Multi chip package A multi chip package includes a first semiconductor chip, a second semiconductor chip and a spacer. The spacer is formed between the first semiconductor chip and the second semiconductor chip. The second semiconductor chip is fixed on the first semiconductor chip by... | 02/26/2008 |
| 7336500 | Method and apparatus for encapsulating a printed circuit board A demonstration tool for a programmable logic device is provided. The demonstration tool includes a circuit board partially disposed within a transparent block. A collar having an opening defined therein is disposed between the transparent clock and a base of the de... | 02/26/2008 |
| 7332821 | Compressible films surrounding solder connectors Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a carrier (the lead-free connectors electrically connect the device to t... | 02/19/2008 |
| 7327038 | Semiconductor device package Provided is a semiconductor device package in which instability of a bonding wire that may occur when a plurality of semiconductor chips are stacked is prevented and which obtains a light, thin and small structure. The semiconductor device package includes a substra... | 02/05/2008 |
| 7320817 | Holding structure and a molding with the same A holding structure includes a held member located in a case, and a guiding space defined between the held member and a predetermined inner surface of the case. A primary molding resin is guided into the guiding space upon injection of the primary molding resin such... | 01/22/2008 |
| 7320738 | Method for encapsulation of a chip card and module obtained thus Method for conditioning of an electronic microcircuit designed for the production of an electronic module which can be glued by means of a simple glue or by soldering. For this purpose the microchip has a geometric shape compatible with a recess in a card provided t... | 01/22/2008 |
| 7319051 | Thermally enhanced metal capped BGA package A thermally enhanced wirebond BGA package having a laminate substrate, an IC device mounted on the substrate, and a metal cap defining a cavity inside the package between the IC device and the metal cap. A substantial portion of the cavity is filled with a thermally... | 01/15/2008 |
| 7319191 | Signal adapter A signal adapter comprising an explosion proof housing, a circuit member disposed on an inside of the explosion proof housing, a signal input connector electrically connected to the circuit member, a signal output connector electrically connected to the circuit memb... | 01/15/2008 |
| 7312406 | Sensor having metallic housing and resin connector, and method of manufacturing the same A sensor includes a metallic housing having a hollow portion, a metallic terminal pin, a part of which is inserted into the hollow portion of the housing, a sensing element connected to the terminal pin, and a resin casing. The terminal pin and the resin casing prov... | 12/25/2007 |
| 7309838 | Multi-layered circuit board assembly with improved thermal dissipation A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature dissipation resin, which is of insulating material and is arranged so as to d... | 12/18/2007 |
| 7296299 | Tamper-evident and/or tamper-resistant electronic components A tamper-evident and/or tamper-resistant electronic module comprising an electronic component embedded in an encapsulant material and at least one thin sheet of frangible material contacting and overlying said encapsulant material and overlying said component, said ... | 11/13/2007 |
| 7291903 | Memory card This invention is to provide an ultra-miniaturized, thin-sized memory card provided with a mechanism for preventing a wrong insertion to a memory card slot. A multi-function memory card is composed of a card body and a cap for housing the card body. The card body is... | 11/06/2007 |
| 7288728 | Electronic package and packaging method A first substrate includes a coil assembly and an integrated circuit mounted thereon. A second substrate includes capacitors 16 and resistors mounted thereon. The first substrate and the second substrate are interconnected by an encapsulating medium. A conductive vi... | 10/30/2007 |
| 7286729 | Optical device cavity structure, optical device, and method for manufacturing an optical device cavity structure An optical device cavity structure includes: insulator layers and metal layers alternately layered on one another; a first terminal section which is formed on a mounting surface to be mounted on a wiring substrate and which is electrically connected to the wiring su... | 10/23/2007 |
| 7282788 | Image sensing chip package structure In an image sensing chip package structure, plated through vias penetrate a substrate to electrically connect metallization traces disposed on the upper and lower surfaces of the substrate. The plated through vias can be opened from the center of the substrate inste... | 10/16/2007 |
