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| Number | Title | Issue Date |
| 8124886 | Membrane circuit board The invention discloses a membrane circuit board including a substrate, a plurality of first signal pins and a second signal pin. The first signal pins and the second signal pin are disposed on the substrate. The substrate has a first edge. Each of the first signal ... | 02/28/2012 |
| 7435914 | Tape substrate, tape package and flat panel display using same A tape substrate having hole(s) formed discontinuously along a bent portion thereof and configured to dissipate stress applied to the bent portion. A tape package using the tape substrate may be connected to a panel and a printed circuit board using an ACF. The tape... | 10/14/2008 |
| 7408119 | Electrical interconnection for high-frequency devices Wire bonds connect current-carrying edges of high-frequency planar conductors to other electrical devices. In one embodiment, planar transmission lines are interconnected using two wire bonds. One bond wire extends from an edge of a first center conductor to a corre... | 08/05/2008 |
| 7385829 | Assembly retention latch having concave release structure In one non-limiting aspect thereof this invention provides a structure having a generally planar quadrilateral shape that includes a bottom portion defining a mounting section; a vertical wall portion that extends upwards from the bottom portion and a top-most porti... | 06/10/2008 |
| 7371975 | Electronic packages and components thereof formed by substrate-imprinting A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on one or more layers. Conductor features of different geometries may b... | 05/13/2008 |
| 7365436 | Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same A disclosed substrate includes a base member having a through-hole, and a conductive metal filling in the through-hole so as to form a penetrating via. The penetrating via contains a conductive core member that is substantially at the central axis of the through-hol... | 04/29/2008 |
| 7342178 | Flexible printed circuit film A flexible printed circuit film that is capable of preventing a bonded pad from being separated or opened because of a force applied to a bonded part when the flexible printed circuit film is engaged to a printed circuit board. In the film, a first pad is provided a... | 03/11/2008 |
| 7336139 | Flexible interconnect cable with grounded coplanar waveguide A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission l... | 02/26/2008 |
| 7336499 | Flexible printed wiring board An object of the present invention is to provide a flexible printed wiring board which relaxes stress concentration in the flexible printed wiring board during production steps, thereby preventing wire breakage in inner lead portions and cracking in solder resist wh... | 02/26/2008 |
| 7333682 | Photoelectric composite interconnection assembly and electronics device using same A photoelectric composite interconnection assembly having: a flexible substrate having an electric interconnection; and an electrical interface provided at both ends of the electric interconnection. A part of the electric interconnection is replaced by an optical tr... | 02/19/2008 |
| 7324352 | High capacity thin module system and method Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers, are arranged in two ranks in two fields on each side of a flexible c... | 01/29/2008 |
| 7323642 | Thin printed circuit board for manufacturing chip scale package Provided is a thin printed circuit board (PCB) for manufacturing a chip scale package (CSP). The thin printed circuit board includes a plurality of unit printed circuit boards, each of which is comprised of a circuit pattern, to which a semiconductor chip is adhered... | 01/29/2008 |
| 7316509 | Apparatus for electrical and optical interconnection An optical-electronic interface may include a circuit substrate, an electrical component mounted on the substrate, an optical component mounted off the substrate, and a flexible interconnect having a first end electrically connected to the optical component and seco... | 01/08/2008 |
| 7311240 | Electrical circuits with button plated contacts and assembly methods Exemplary methods for making a solder joint between two articles are disclosed. The method includes the steps of positioning a first article and a second article to be soldered together. At least one of the first article and the second article has at least one butto... | 12/25/2007 |
| 7307293 | Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages susp... | 12/11/2007 |
| 7292449 | Virtual ground return for reduction of radiated emissions A digital apparatus having a cable comprising a plurality of high-speed and low-speed signal carrying conductors, the conductors carrying the low-speed signals are bypassed to a signal ground with selected values of capacitance so as to become virtual signal ground ... | 11/06/2007 |
| 7285729 | Printed circuit board A printed circuit board includes circuit lines having different transmission characteristics. In the printed circuit board, mounted components are connected to each other at a plurality of points by an anisotropic conductive film (ACF) adhesion by using a flexible c... | 10/23/2007 |
| 7256345 | Cable and manufacturing method therefor A cable 1 is configured of connecting portions 12 on both ends for connecting to external connecting terminals and an intermediate portion 13. Each connecting portion 12 has electroconductive portions 14 for connecting with externa... | 08/14/2007 |
| 7210930 | Apparatus and method for curing materials with radiation A hand held dental instrument for curing light-curable compounds comprises a housing and an array of solid state, light emitting junctions or dies for generating light having wavelengths within a narrow band of wavelengths (e.g. 400–500 nm). Preferably, a peak wav... | 05/01/2007 |
| 7179520 | Circuit substrate, electro-optic device and electronic equipment A circuit substrate is described where the circuit substrate has a first wiring group extending in a first direction and a second wiring group extending in a second direction substantially orthogonal to the first direction. The first wiring group of the circuit subs... | 02/20/2007 |
| 7164229 | Organic light dash emitting display An organic light-emitting display is provided. The organic light-emitting display has a power line divided into multiple sets with a voltage terminal attached to the center of each power line set. Furthermore, all the voltage terminals are coupled to a power supply ... | 01/16/2007 |
| 7152313 | Package substrate for integrated circuit and method of making the substrate In some embodiments, an article of manufacture includes a metal layer and a first dielectric layer in contact with a first face of the metal layer. The article of manufacture also includes a second dielectric layer in contact with a second face of the metal layer. T... | 12/26/2006 |
| 7155172 | RFID receiver apparatus and method An RFID backscatter interrogator for transmitting data to an RFID tag, generating a carrier for the tag, and receiving data from the tag modulated onto the carrier, the interrogator including a single grounded-coplanar wave-guide circuit board and at least one surfa... | 12/26/2006 |
| 7108515 | Wiring board with bending section A wiring substrate to be used in a variety of electronic apparatuses, and an input device, such as an optically transparent touch panel, using the same wiring substrate, and a method of manufacturing the same input device are disclosed. The invention simplifies a co... | 09/19/2006 |
| 7101194 | Woven multiple-contact connector A multiple-contact woven connector including a weave arranged to provide a plurality of tensioned fibers and a conductor woven with the plurality of tensioned fibers so as to form a plurality of peaks and valleys along a length of the conductor. The conductor has a ... | 09/05/2006 |
| 7094064 | Multiple-contact woven electrical switches The present disclosure is directed to electrical switches that utilize conductors that are woven onto loading fibers and a mating conductor that has a contact mating surface. Each conductor has at least one contact point. The loading fibers are capable of delivering... | 08/22/2006 |
| 7083427 | Woven multiple-contact connectors A multiple-contact woven connector comprising at least one conductor woven onto a plurality of loading fibers. Each conductor has at least one contact point. The loading fibers are capable of delivering a contact force at the contact points of the conductors. The co... | 08/01/2006 |
| 7077927 | Method of applying an edge electrode pattern to a touch screen A method of applying an edge electrode pattern to a touch screen. The method includes depositing, on a first surface of a decal strip, conductive material in the form of an edge electrode pattern, placing the first surface of the decal strip on one edge of a touch s... | 07/18/2006 |
| 7069650 | Method for reducing the number of layers in a multilayer signal routing device A technique for reducing the number of layers in a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing the number of layers in a multilayer signal routing device having a plura... | 07/04/2006 |
| 7066733 | Apparatus and method for curing materials with light radiation An instrument and method for curing light-curable compounds in the mouth of a patient, the instrument comprising a housing and a plurality of solid state, light-emitting elements on a substrate supported by the housing. The elements form a collective array on the su... | 06/27/2006 |
| 7058365 | Business card with integrated paper cell phone A disposable cellular telephone and business card combination. The cellular telephone circuit is printed on a paper substrate with a conductive ink. A paper microphone diaphragm is attached to one end of the business card and a paper speaker diaphragm is attached to... | 06/06/2006 |
| 7049229 | Method of fabricating semiconductor device and semiconductor device An insulating film having openings larger than viaholes, formed as being aligned with the viaholes, is coated on the back surface of a silicon semiconductor substrate so that the viaholes fall within the openings, a conductive film is then formed so as to fill the v... | 05/23/2006 |
| 7015570 | Electronic substrate with inboard terminal array, perimeter terminal array and exterior terminal array on a second surface and module and system including the substrate A multi-connect substrate, module including the substrate and an Integrated Circuit (IC) chip packaged in the module. The multi-connect substrate includes a multilayered substrate with at least one edge terminal array and one inboard terminal array on one face. An e... | 03/21/2006 |
| 6999330 | Power converter and system using the same A second wiring layer 362 of a multilayer wiring board constituting a power converter is provided with a first positive side direct current wiring 311p and a second positive side direct current wiring 312p constituting a direct cur... | 02/14/2006 |
| 6977347 | Flexible printed circuit board A flexible printed circuit board. The board includes a first circuit layer, a second circuit layer, a first adhesive layer, a second adhesive layer and an intermediate layer. The second circuit layer face the first circuit layer, and the first adhesive layer is disp... | 12/20/2005 |
| 6921980 | Integrated semiconductor circuit including electronic component connected between different component connection portions An integrated semiconductor circuit includes a semiconductor chip on which surface a plurality of connection electrodes are formed, a lower insulating layer covering the surface of the semiconductor chip such that the connection electrodes are exposed, a plurality o... | 07/26/2005 |
| 6914196 | Reel-deployed printed circuit board A reel-deployed printed circuit board for chip-on-board (COB) packages and a method for manufacturing COB packages using the reel printed circuit board are disclosed. The novel circuit board comprises an elongated, flexible base board and a plurality of unit boards ... | 07/05/2005 |
| 6885549 | System and method for flexible circuits A flexible printed circuit improves data transfer rates by disposing ground wires in a ground plane proximate to signal wires disposed in a signal channel plane. One or more ground wires is associated with each signal wire pair or each signal wire for imaging of the... | 04/26/2005 |
| 6797891 | Flexible interconnect cable with high frequency electrical transmission line A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission l... | 09/28/2004 |
| 6756663 | Semiconductor device including wiring board with three dimensional wiring pattern A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A high operating speed and smaller size are made possible by employing a laminated structure of semiconductor... | 06/29/2004 |
