Celebrity Inventors
Mark Twain (Samuel L. Clemens) received Patent No. 121,992 for "An Improvement in Adjustable and Detachable Straps for Garments." He later received two more patents: one for a self-pasting scrapbook and one for a game to help players remember important historical dates.
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| Number | Title | Issue Date |
| 8158892 | High-speed router with backplane using muli-diameter drilled thru-holes and vias A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. Thru-holes are used to connect the differential signal pairs to external components. T... | 04/17/2012 |
| 8148647 | Printed circuit board and method of manufacturing the same An object of the invention is to provide a printed circuit board that has an excellent heat dissipation performance and excellent reliability, and its manufacturing method. The printed circuit board includes: prepregs (2a) and (2b) being ... | 04/03/2012 |
| 8115114 | Ceramic substrate manufacturing method and ceramic substrate A method for manufacturing a ceramic substrate having a via hole(s) and a surface wiring pattern electrically connected to the via hole(s). The method includes: preparing a sintered ceramic substrate having a via hole(s); forming over the sintered ceramic substrate ... | 02/14/2012 |
| 8097815 | Printed circuit board and its designing method, and designing method of IC package terminal and its connecting method The invention provides a printed circuit board capable of mounting BGA or other IC package of narrow terminal interval by using through-holes of conventional size. On one principal surface of printed circuit board (1), soldering lands (2a), (... | 01/17/2012 |
| 8044306 | Wiring board and method of manufacturing the same A wiring board has a base substrate, a conductive pattern formed on the base substrate, an insulation layer formed on the conductive pattern and the base substrate and including a resin-impregnated inorganic cloth, a conductive pattern formed on the insulating layer... | 10/25/2011 |
| 8035038 | Method for fabricating a printed circuit board having a coaxial via A method of fabricating a printed circuit board having a coaxial via is disclosed. The method includes assembling a plurality of layers configured in a stack so that the plurality of layers has a top signal layer and a bottom signal layer; forming a hollow via throu... | 10/11/2011 |
| 7834277 | Printed circuit board manufacturing method and printed circuit board The present invention provides a method of manufacturing printed a circuit board capable of formation of via holes having a low aspect ratio and formation of fine lines, and a printed circuit board manufactured by the method. The method of manufacturing a printed ci... | 11/16/2010 |
| 7759583 | Circuit board A circuit board, having improved adhesion between its via conductor and insulating layer, is provided. The circuit board includes a first wiring layer, a second wiring layer, the insulating layer, a filler, and the via conductor. The first wiring layer and the secon... | 07/20/2010 |
| 7754980 | Substrate with multilayer plated through hole and method for forming the multilayer plated through hole A structure with a multilayer plated through hole is disclosed. At least one dielectric layer formed by deposition and a conductive layer are formed in an original plated through hole (PTH). The dielectric layer partially covers wiring layers of the substrate to ele... | 07/13/2010 |
| 7737368 | Circuit board and method of manufacturing circuit board A circuit board includes: a plurality of wiring layers; an insulating layer which insulates the plurality of wiring layers, the insulating layer containing a fibrous filler and a resin; and a conductor part formed on a sidewall of a via piercing through the insulati... | 06/15/2010 |
| 7586047 | Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It is to provide a patterned porous molded product or nonwoven fabric, ... | 09/08/2009 |
| 7491897 | Electronic equipment provided with wiring board into which press-fit terminals are press-fitted In order to suppress the occurrence of damage on a press-fit joining wiring board, a peak value of stress generated on the board in the case of a press-fitting a press-fit terminal into a through-hole is reduced so that it can not exceed the design standard value of... | 02/17/2009 |
| 7420131 | Wiring substrate A wiring substrate, in which a wiring stacked portion including a conductor layer and a resin layer is stacked on a principal face of a core substrate including a substantially cylindrical through hole conductor in a through hole extending therethrough and a filling... | 09/02/2008 |
| 7408120 | Printed circuit board having axially parallel via holes Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole. ... | 08/05/2008 |
| 7404250 | Method for fabricating a printed circuit board having a coaxial via A method of fabricating a printed circuit board having a coaxial via, includes. The method includes assembling a plurality of layers configured in a stack so that the plurality of layers has a top signal layer and a bottom signal layer; forming a hollow via through ... | 07/29/2008 |
| 7378601 | Signal transmission structure and circuit substrate thereof A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the via land. The conductive wall covers only a portion of the inner wall ... | 05/27/2008 |
| 7375288 | Apparatuses and methods for improving ball-grid-array solder joint reliability In some embodiments, apparatuses and methods for improving ball-grid-array solder joint reliability in printed circuit boards. Such apparatuses may comprise, in an exemplary embodiment, a stiffened printed circuit board defining one or more cavities therein and incl... | 05/20/2008 |
| 7375290 | Printed circuit board via with radio frequency absorber A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers interspersed between the non-conductive layers, vias extending through... | 05/20/2008 |
| 7371974 | Multilayer printed wiring board A multilayered printed circuit board includes a substrate and, as serially built up thereon, a conductor circuit and an interlaminar resin insulating layer in an alternate fashion and in repetition. The conductor circuits between which the interlaminar resin insulat... | 05/13/2008 |
| 7368667 | Using rows/columns of micro-vias to create PCB routing channels in BGA interconnect grid (micro-via channels) A printed circuit board having micro-vias used to connect a portion of the contacts in a selected row or column to the first internal layer of the board, thereby creating routing channels on the second and subsequent internal layers of the board between selected row... | 05/06/2008 |
| 7368320 | Method of fabricating a two die semiconductor assembly A semiconductor die assembly includes a substantially planar lead frame including a die paddle and a plurality of lead fingers, a first semiconductor die secured by an active surface thereof to the die paddle, a second semiconductor die secured by a backside thereof... | 05/06/2008 |
| 7365006 | Semiconductor package and substrate having multi-level vias fabrication method A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ... | 04/29/2008 |
| 7366629 | High frequency module board device The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose m... | 04/29/2008 |
| 7359693 | Enclosure and substrate structure for a tuner module A tuner module comprising a tuner and a tuner enclosure. The tuner includes a substrate containing filter coils and the tuner enclosure includes at least one partition plate placed between filter coils of the tuner to improve the isolation between the filter coils. ... | 04/15/2008 |
| 7350296 | Method of fabricating a printed circuit board including an embedded passive component Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating l... | 04/01/2008 |
| 7342802 | Multilayer wiring board for an electronic device To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an interlayer insulating film allows for interlayer connection between plural wiring films insulated from one another with plural interlayer insulating layers.... | 03/11/2008 |
| 7339118 | Printed wiring board and method for manufacturing the same In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive ... | 03/04/2008 |
| 7336502 | High-speed router with backplane using tuned-impedance thru-holes and vias A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. To reduce routing complexity, at least some of the differential signal pairs route thr... | 02/26/2008 |
| 7336499 | Flexible printed wiring board An object of the present invention is to provide a flexible printed wiring board which relaxes stress concentration in the flexible printed wiring board during production steps, thereby preventing wire breakage in inner lead portions and cracking in solder resist wh... | 02/26/2008 |
| 7332816 | Method of fabricating crossing wiring pattern on a printed circuit board A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added,... | 02/19/2008 |
| 7326859 | Printed circuit boards having pads for solder balls and methods for the implementation thereof A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after... | 02/05/2008 |
| 7326594 | Connecting a plurality of bond pads and/or inner leads with a single bond wire An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least tw... | 02/05/2008 |
| 7310239 | IC packaging interposer having controlled impedance or optical interconnections and an integral heat spreader Disclosed are embodiments of an integrated circuit die interconnection interposer suited to controlled high performance transmission of electronic or optical signals or combinations thereof. The various embodiments are designed to provide direct path interconnection... | 12/18/2007 |
| 7304247 | Circuit board with at least one electronic component A circuit board having, between the circuit board and a component arranged thereon, an electrical and mechanical connection of high mechanical-load-bearing ability. The circuit board includes at least one internally situated conductor path, a first insulating layer ... | 12/04/2007 |
| 7304860 | Printed circuit board with thin film switches for a keyboard A printed circuit board with thin film switches for a keyboard including an upper board having multiple circuit lines, an insulating separation defining multiple through holes, a lower board having multiple circuit lines and multiple thin film switches mounted on th... | 12/04/2007 |
| 7301105 | Printed wiring boards possessing regions with different coefficients of thermal expansion Printed wiring boards are disclosed that include regions having different coefficients of thermal expansion. In one aspect of the invention, the regions can be matched to the coefficients of thermal expansion of devices mounted on the printed wiring board. In one em... | 11/27/2007 |
| 7301103 | Printed-wiring board, printed-circuit board and electronic apparatus A printed-wiring board having a multiplayer structure including a plurality of insulating layers and a plurality of conducting layers includes a signal pattern provided in at least one of outermost layers of the conducting layers which includes a plurality of pad po... | 11/27/2007 |
| 7297877 | Substrate with micro-via structures by laser technique A substrate to which a laser technique is applied includes a signal layer, a micro via structure, and a differential signal pair. The micro via structure is divided into a first conductive column and a second conductive column after a laser-cutting step. The first c... | 11/20/2007 |
| 7290326 | Method and apparatus for forming multi-layered circuits using liquid crystalline polymers A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline poly... | 11/06/2007 |
| 7284221 | High-frequency, high-signal-density, surface-mount technology footprint definitions Methods for designing SMT connector footprints are disclosed. A circuit board may have disposed thereon an arrangement of SMT pads and corresponding vias. The arrangement of vias may differ from the arrangement of SMT pads. The arrangement of SMT pads may differ fro... | 10/16/2007 |
