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Microwave Oven With Removable Storage Cassette in Dashboard of Motor Vehicle
A microwave oven adapted for use within a motor vehicle dashboard area. The microwave oven has a removable storage cassette, and slidable platforms for securing and serving containers of beverages and foods.
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| Number | Title | Issue Date |
| 8124885 | Anisotropically conductive connector and anisotropically conductive connector device An anisotropically conductive connector and an anisotropically conductive connector device. The anisotropically conductive connector includes a supporting member, a plurality of through-holes each extending in a thickness-wise direction of the supporting member, and... | 02/28/2012 |
| 7851709 | Multi-layer circuit board having ground shielding walls A circuit board includes a plurality of signal lines and a plurality of shielding walls. The shield walls are disposed between the signal lines. Each shield wall includes an upper surface, a lower surface, a rectangular groove, a first metal layer and a second metal... | 12/14/2010 |
| 7456364 | Using a thru-hole via to improve circuit density in a PCB A printed circuit board includes multiple layers on which electrically conductive traces reside, where at least two of the electrically conductive traces each has a first portion formed on one layer of the printed circuit board and a second portion formed on another... | 11/25/2008 |
| 7420126 | Circuit board and circuit apparatus using the same A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a requirement as to heat radiation capability. The circuit apparatus has th... | 09/02/2008 |
| 7408120 | Printed circuit board having axially parallel via holes Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole. ... | 08/05/2008 |
| 7402760 | Multi-layer printed wiring board and manufacturing method thereof A multi-layer printed wiring board has a core substrate, a throughhole structure, a first interlayer insulation layer, a first via, a second interlayer insulation layer and a second via. The core substrate has a throughhole opening, and the throughhole structure is ... | 07/22/2008 |
| 7399930 | Method and device for repair of a contact pad of a printed circuit board Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surfa... | 07/15/2008 |
| 7378601 | Signal transmission structure and circuit substrate thereof A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the via land. The conductive wall covers only a portion of the inner wall ... | 05/27/2008 |
| 7365272 | Circuit board with identifiable information and method for fabricating the same A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of th... | 04/29/2008 |
| 7365436 | Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same A disclosed substrate includes a base member having a through-hole, and a conductive metal filling in the through-hole so as to form a penetrating via. The penetrating via contains a conductive core member that is substantially at the central axis of the through-hol... | 04/29/2008 |
| 7342802 | Multilayer wiring board for an electronic device To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an interlayer insulating film allows for interlayer connection between plural wiring films insulated from one another with plural interlayer insulating layers.... | 03/11/2008 |
| 7342470 | Circuit board microwave filters A microwave filter has resonator comprised of a cylindrical structure having conductive walls filled with a dielectric material where the cylindrical structure is recessed inside a multi-layered substrate. First and second conductive coupling arms are disposed on a ... | 03/11/2008 |
| 7339118 | Printed wiring board and method for manufacturing the same In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive ... | 03/04/2008 |
| 7337537 | Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board A method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board are described herein. In the preferred embodiment, the printed circuit board includes a via extending through a plurality of stacked layers. Th... | 03/04/2008 |
| 7334324 | Method of manufacturing multilayer wiring board A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polya... | 02/26/2008 |
| 7322863 | Robust modular electronic device without direct electrical connections for inter-module communication or control A modular electronic device where (predominantly) sealed modules are aligned and attached/connected in pre-determined sequences, forming a robust block-like structure with extendable function: Control and/or inter-module communication are implemented without direct ... | 01/29/2008 |
| 7320173 | Method for interconnecting multi-layer printed circuit board A method for fabricating a multi-layer printed circuit board can include forming an etching resist layer on a first metal layer having plating grooves that selectively expose the first metal layer, forming a plated layer at the surface of the first metal layer expos... | 01/22/2008 |
| 7310239 | IC packaging interposer having controlled impedance or optical interconnections and an integral heat spreader Disclosed are embodiments of an integrated circuit die interconnection interposer suited to controlled high performance transmission of electronic or optical signals or combinations thereof. The various embodiments are designed to provide direct path interconnection... | 12/18/2007 |
| 7294790 | Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer Apparatus is provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used ... | 11/13/2007 |
| 7293995 | Electrical contact and connector system An electrical contact formed from a compliant folded sheet that includes a top surface, a bottom surface, a first contact edge and a second contact edge. A plurality of corrugations are formed in the top surface and the bottom surface that terminate at the first con... | 11/13/2007 |
| 7294587 | Component built-in module and method for producing the same A component built-in module includes an insulating layer, wirings integrated with both surfaces of the insulating layer, a via connecting the wirings, and one or more components selected from an electronic component and a semiconductor, which is embedded inside of t... | 11/13/2007 |
| 7294921 | System-on-a-chip with multi-layered metallized through-hole interconnection The present invention is directed to a high-performance system on a chip which uses multi-layer wiring/insulation through-hole interconnections to provide short wiring and controlled low-impedance wiring including ground planes and power supply distribution planes b... | 11/13/2007 |
| 7292452 | Reference layer openings A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein. ... | 11/06/2007 |
| 7287323 | Materials and structure for a high reliability BGA connection between LTCC and PB boards A ceramic circuit structure comprising a plurality of ceramic layers and at least one electronic component embedded within the plurality of ceramic layers. Within a first one of the ceramic layers is a via that passes through the ceramic layer. A contact pad is form... | 10/30/2007 |
| 7284323 | Process of fabricating conductive column A fabrication process of a conductive column suitable for a fabrication of a circuit board. The circuit board comprises a dielectric layer. A first blind hole is formed in the dielectric layer from a second surface opposite to the first surface, wherein the blind en... | 10/23/2007 |
| 7285730 | Ceramic circuit board and method for manufacturing the same In the ceramic circuit board, within the through hole of the ceramic substrate is arranged the metal column which is 0 to 150 μm shorter relative to the thickness of the ceramic substrate; the metal circuit plates are attached to both surfaces of the ceramic substr... | 10/23/2007 |
| 7282378 | Method of manufacturing inspection unit A conductive member having a first face adapted to be mounted on a board on which an inspection circuit is arranged, and a second face adapted to be opposed to a device to be inspected is prepared. The conductive member is formed with a first through hole having a f... | 10/16/2007 |
| 7279355 | Method for fabricating a packaging device for semiconductor die and semiconductor device incorporating same A substantially planar substrate having opposed major surfaces is provided. The substrate includes a through hole that extends between the major surfaces. The through hole is filled with a conductive interconnecting element. A conductive mounting pad and a conductiv... | 10/09/2007 |
| 7273806 | Forming of high aspect ratio conductive structure using injection molded solder Methods of forming a conductive structure on a substrate prior to packaging, and a test probe structure generated according to the method, are disclosed. The conductive structure includes a high aspect ratio structure formed by injected molded solder. The invention ... | 09/25/2007 |
| 7271349 | Via shielding for power/ground layers on printed circuit board A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive material in a via within the clearance hole will not contact the conductive layer and create a short circuit. In on... | 09/18/2007 |
| 7262368 | Connection structures for microelectronic devices and methods for forming such structures Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive p... | 08/28/2007 |
| 7259639 | Inductor topologies and decoupling structures for filters used in broadband applications, and design methodology thereof Inductor topologies for filters used in broadband applications are described. In one implementation, an apparatus, such as an interface module includes a printed circuit board and a filter. The filter includes a generally circular high Quality factor (Q) value spira... | 08/21/2007 |
| 7245001 | Multi-layer integrated circuit package Adhesive material is applied to a surface of a metallic core layer. The adhesive material is removed from a conductive region of the metallic core layer. A metallic contact is provided over the conductive region of the metallic core layer. The metallic core layer is... | 07/17/2007 |
| 7242592 | Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal conductors and ground conductors. The printed circuit board includes a plur... | 07/10/2007 |
| 7237331 | Electronic part manufacturing method and electronic part Provided is a method of manufacturing an electronic part having a plurality of wiring patterns and an insulating layer interposed between the wiring patterns and serving to establish electrical connection between the wiring patterns through an interlayer connecting ... | 07/03/2007 |
| 7238603 | Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate A connecting member between wiring films is provided in which: a normal copper foil, which is a general-purpose component and not expensive, or the like can be used as a material; formation of bumps is sufficiently achieved by conducting etching one time; and a nece... | 07/03/2007 |
| 7230835 | Apparatus for reducing signal reflection in a circuit board A circuit board has, in a first signal layer, a signal conductor having a relatively small width and a contact pad having a relatively large width. The relatively large width of the contact pad combined with the relatively narrow signal conductor creates an impedanc... | 06/12/2007 |
| 7227712 | Disk drive apparatus and method of mounting same A disk drive apparatus mounting socket includes a socket portion which supports a disk drive apparatus, a lead portion which is connected to the disk drive apparatus supported by the socket portion, and a terminal unit which is electrically connected to the lead por... | 06/05/2007 |
| 7217370 | Wiring board and process for producing the same A wiring board with microstrip structure has: a first conductor layer that is provided with conductor wirings to be connected to a semiconductor chip in its external terminal (bonding pad); a second conductor layer that is provided with a conductor pattern connected... | 05/15/2007 |
| 7214106 | Electrical connector Electrical connectors are adapted to provide a reliable electrical connection to mating elements of a mating connector. The connector can have sockets that accept mating elements of the mating connector. Conductors of the connector are associated with each socket an... | 05/08/2007 |
