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...Daniel Webster invented a "bull plow" to pull out tree stumps. It didn't catch on because it was huge and required four oxen to pull it!
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| Number | Title | Issue Date |
| 8158891 | Circuit board structure and method for manufacturing the same A circuit board disclosed in the present invention includes a core board on which a first circuit layer is placed, wherein the first circuit layer has a plurality of conductive pads; and at least one built-up structure covering the surface of the circuit board, whic... | 04/17/2012 |
| 8115112 | Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates Chip-scale packages and assemblies thereof are disclosed. The chip-scale package includes a core member of a metal or alloy having a recess for at least partially receiving a die therein and includes at least one flange member partially folded over another portion o... | 02/14/2012 |
| 8115113 | Multilayer printed wiring board with a built-in capacitor A multilayer printed wiring board including a layered capacitor section provided on a first interlayer resin insulation layer and a high dielectric layer and first and second layered electrodes that sandwich the high dielectric layer. A second interlayer resin insul... | 02/14/2012 |
| 8058568 | Circuit board and method for fabricating the same A circuit board and a method for fabricating the same are provided. The circuit board includes a core board, a first bonding layer disposed on the core board, and a first wiring layer disposed on the first bonding layer. The first bonding layer enables the first wir... | 11/15/2011 |
| 8053681 | Integrated circuit package and manufacturing method thereof An IC package includes: a multi-layered PCB having a plurality of insulating layers and a plurality of conductive pattern layers stacked in sequence and a plurality of via-holes formed through the plurality of the insulating layers for an electrical connection betwe... | 11/08/2011 |
| 8053682 | Multilayer ceramic substrate There is provided a multilayer ceramic substrate including a conductive via of a dual-layer structure capable of preventing loss in electrical conductivity and signal. The multilayer ceramic substrate includes: a plurality of dielectric layers; and a circuit pattern... | 11/08/2011 |
| 8039762 | Printed circuit board having a buried solder bump and a circuit layer flush with an insulating layer Disclosed is a printed circuit board having a buried solder bump, in which a circuit pattern and a solder bump formed on the circuit pattern are buried in an insulating layer, thus improving the degree of matching between the solder bump and the circuit pattern and ... | 10/18/2011 |
| 7999194 | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board Through holes 36 are formed to penetrate a core substrate 30 and lower interlayer resin insulating layers 50, and via holes 66 are formed right on the through holes 36, respectively. Due to this, the through holes 36 and the... | 08/16/2011 |
| 7989709 | Flexible sheet with electrical connecting locations engaging through holes in a rigid substrate A flexible printed circuit board includes a flexible sheet and a rigid substrate attached to the flexible printed circuit board. The flexible printed circuit board includes a first surface and an opposite second surface. A number of electrical connecting locations a... | 08/02/2011 |
| 7985930 | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board A metal layer 18 is sandwiched between insulating layers 14 and 20 so that required strength is maintained. Hence it follows that the thickness of a core substrate 30 can be reduced and, therefore, the thickness of a multi-layer printed c... | 07/26/2011 |
| 7973249 | Multilayer printed wiring board A multilayer printed wiring board including insulating layers and conductor layers being stacked alternately on each other. The conductor layers are electrically connected to each other through viaholes formed in the insulating layers. Each of the viaholes is formed... | 07/05/2011 |
| 7973248 | Printed circuit board using paste bump and manufacturing method thereof A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via ho... | 07/05/2011 |
| 7968803 | Wiring substrate, wiring material, copper-clad laminate, and method of manufacturing the wiring substrate A wiring substrate of the invention comprises an electrical insulation substrate (1), a through-hole (3) formed in the electrical insulation substrate, electrically conductive paste (4) filled inside the through-hole, and wiring traces (11 | 06/28/2011 |
| 7964802 | Interposer for decoupling integrated circuits on a circuit board An interposer (20) is used for decoupling a microchip (10) on a circuit board (30). The interposer (20) contains on its upper and lower surfaces structured metal layers (26a-26d) for attachment to the microchip... | 06/21/2011 |
| 7956293 | Multilayer printed wiring board and manufacturing method thereof A multilayer printed wiring board is characterized in that the interlayer connection material in the via holes has a lower coefficient of thermal expansion in the thickness direction than the electrically insulating substrate made of insulating material; the interla... | 06/07/2011 |
| 7943864 | Printed circuit board having electromagnetic bandgap structure In accordance with an embodiment, the printed circuit board, having an analog circuit and a digital circuit includes: a first metal layer and a second metal layer, one of the first metal layer and the second metal layer being a power layer and the other being a grou... | 05/17/2011 |
| 7943863 | Wiring substrate and manufacturing method thereof, and semiconductor device A wiring substrate includes a first insulation layer, a connection terminal, a second insulation layer, a via, and a wiring pattern. The connection terminal is disposed in the first insulation layer so as to be exposed from a first main surface of the first insulati... | 05/17/2011 |
| 7928323 | Wiring unit, method for producing wiring unit, liquid jetting apparatus, and method for producing liquid jetting apparatus A wiring unit includes a first insulating layer which is provided with an electrode and a wire electrically connected to the electrode on one surface of the first insulating layer; a second insulating layer which is formed on the one surface of the first insulating ... | 04/19/2011 |
| 7858885 | Circuit board structure The present invention provides a circuit board structure, the circuit board structure consisting of a carrier board having a first surface and an opposed second surface, the carrier board being formed with at least one through hole penetrating the first and second s... | 12/28/2010 |
| 7838779 | Wiring board, method for manufacturing same, and semiconductor package A wiring board in which lower-layer wiring composed of a wiring body and an etching barrier layer is formed in a concave portion formed on one face of a board-insulating film, upper-layer wiring is formed on the other face of the board-insulating film, and the upper... | 11/23/2010 |
| 7767914 | Multilayer printed wiring board, method for manufacturing buildup printed wiring board, and electronic apparatus A multilayer printed wiring board includes: an insulating base including an indentation section formed thereon; a conductor pattern formed on the insulating base, the conductor pattern including a thick film section formed by embedding a conductor in the indentation... | 08/03/2010 |
| 7759582 | Multilayer printed wiring board A multilayer printed wiring board comprises insulating layers and conductor layers being stacked alternately on each other. The conductor layers are electrically connected to each other through viaholes formed in the insulating layers. Each of the viaholes is formed... | 07/20/2010 |
| 7750250 | Blind via capture pad structure A capture pad structure includes a lower dielectric layer, a capture pad embedded within the lower dielectric layer, the capture pad comprising a plurality of linear segments. To form the capture pad, a focused laser beam is moved linearly to form linear channels in... | 07/06/2010 |
| 7737367 | Multilayer circuit board and manufacturing method thereof Holes having the same diameter as via holes are formed in predetermined positions in advance when forming wiring patterns on releasable carriers. The carriers with the wiring patterns are bonded on an insulating material, and a laser beam is irradiated from the side... | 06/15/2010 |
| 7705247 | Built-up printed circuit board with stack type via-holes A built-up printed circuit board includes stacked micro via-holes, each of which is provided for interconnection between layers in the printed circuit board, and in each of which a filling material, such as liquefied resin or conductive paste, is filled using a poly... | 04/27/2010 |
| 7438969 | Filling material, multilayer wiring board, and process of producing multilayer wiring board A solvent-free filling material comprising a filler, a thermosetting resin, a curing agent, and a curing catalyst, wherein the thermosetting resin is an epoxy resin, and the curing agent is a dicyandiamide curing agent; a multilayer printed wiring board comprising a... | 10/21/2008 |
| 7423222 | Circuit board and method of manufacturing the same A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component... | 09/09/2008 |
| 7420126 | Circuit board and circuit apparatus using the same A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a requirement as to heat radiation capability. The circuit apparatus has th... | 09/02/2008 |
| 7420131 | Wiring substrate A wiring substrate, in which a wiring stacked portion including a conductor layer and a resin layer is stacked on a principal face of a core substrate including a substantially cylindrical through hole conductor in a through hole extending therethrough and a filling... | 09/02/2008 |
| 7417872 | Circuit board with trace configuration for high-speed digital differential signaling Trace configurations for carrying high-speed digital differential signals provide for reduced conduction loss and improved signal integrity. In one embodiment, a circuit board has a first set of conductive traces disposed on non-conductive material, and a second set... | 08/26/2008 |
| 7408120 | Printed circuit board having axially parallel via holes Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole. ... | 08/05/2008 |
| 7400511 | Electronic component mounting structure An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connect... | 07/15/2008 |
| 7390974 | Multilayer printed wiring board with filled viahole structure The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The m... | 06/24/2008 |
| 7378601 | Signal transmission structure and circuit substrate thereof A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the via land. The conductive wall covers only a portion of the inner wall ... | 05/27/2008 |
| 7378602 | Multilayer core board and manufacturing method thereof A multilayer core board 10 includes tapered first via hole conductors 51 extending from the outer surface of a first insulating layer 24 to conductive portions 42a of a power source layer 42, second via hole conductors 52... | 05/27/2008 |
| 7377032 | Process for producing a printed wiring board for mounting electronic components A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4 is connected with the wiring pattern and the other end portion... | 05/27/2008 |
| 7374811 | Probe pad structure in a ceramic space transformer A method for manufacturing a ceramic device is provided. The ceramic device comprises a ceramic layer. A polyimide layer is on the ceramic layer. The polyimide layer has disposed therein a plurality of copper vias. Each copper via is in physical contact with the cer... | 05/20/2008 |
| 7375290 | Printed circuit board via with radio frequency absorber A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers interspersed between the non-conductive layers, vias extending through... | 05/20/2008 |
| 7371974 | Multilayer printed wiring board A multilayered printed circuit board includes a substrate and, as serially built up thereon, a conductor circuit and an interlaminar resin insulating layer in an alternate fashion and in repetition. The conductor circuits between which the interlaminar resin insulat... | 05/13/2008 |
| 7371973 | Contact node The contact node comprises at least two metallized contacts coupled with conductive paths arranged on surfaces of connection layers made on the base of a dielectric material and mutually aligned and interconnected electrically and mechanically by conductive binding ... | 05/13/2008 |
