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| Number | Title | Issue Date |
| 8173909 | Method for mating flexure to flex-print circuit and flexure therefor Inspection windows are cut or formed into the tail section of the flexure circuit tail in a hard disk drive Head Gimbal Assembly (HGA), or CIS, to enable visual inspection of the alignment of the CIS to the head preamp circuit, or FPC. The holes are made in the stee... | 05/08/2012 |
| 8173910 | Printed circuit board ball grid array system having improved mechanical strength A printed circuit board (PCB) ball grid array (BGA) system is provided. In one embodiment, the PCB BGA system includes a PCB, a PCB BGA pad formed on the PCB, a plated through-hole via disposed at least partially through the PCB proximate the PCB BGA pad, and a sold... | 05/08/2012 |
| 8143534 | Wiring board having solder bump and method for manufacturing the same A wiring board has a wiring board main body, a solder resist and solder bumps. The solder resist is formed on a top surface of the wiring board main body, and includes first openings, and second openings that have a diameter larger than that of the first openings. T... | 03/27/2012 |
| 8039761 | Printed circuit board with solder bump on solder pad and flow preventing dam Disclosed is a printed circuit board having a flow preventing dam and a manufacturing method thereof. The printed circuit board includes a base substrate having a solder pad, a solder bump formed on the solder pad of the base substrate, and a flow preventing dam for... | 10/18/2011 |
| 7999193 | Wiring substrate and method of manufacturing the same There is provided a wiring substrate. The wiring substrate includes: a core substrate formed of a conductive material and having a through hole therein; an insulating layer formed on first and second surfaces of the core substrate; wiring patterns formed on the firs... | 08/16/2011 |
| 7910838 | Solder ball interface An intercoupling component is provided that electrically connects the device leads of an integrated circuit package to a substrate. The package includes external device leads, each device lead having a downwardly extending section proximate a side of the package bod... | 03/22/2011 |
| 7800002 | Multilayer wiring board Disclosed are a multilayer wiring board, which has a high degree of freedom of wiring design and can realize high-density wiring, and a method which can simply manufacture the multilayer wiring board. The multilayer wiring board comprises a core substrate and two or... | 09/21/2010 |
| 7633016 | Coupling structure between circuit board and frame member A coupling structure between a circuit board and a frame member according to the present invention includes: the frame member made of a metal material; and the circuit board set in the frame member and having a land portion soldered to the frame member, in which a s... | 12/15/2009 |
| 7534967 | Conductor structures including penetrable materials Conductor structures include a substrate, a first conducting layer that is selectively passivated from growth of unwanted surface layers by the application of a selective passivation layer, and a second conducting layer that is applied onto the selective passivation... | 05/19/2009 |
| 7435910 | Multilayer printed circuit board A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electrically connect the IC chip to th... | 10/14/2008 |
| 7433201 | Oriented connections for leadless and leaded packages The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating such devices, and substrates and/or PCBs, especially if such assemblies ... | 10/07/2008 |
| 7420126 | Circuit board and circuit apparatus using the same A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a requirement as to heat radiation capability. The circuit apparatus has th... | 09/02/2008 |
| 7420129 | Semiconductor package including a semiconductor device, and method of manufacturing the same A method and apparatus of manufacturing a semiconductor device and the semiconductor device used in a semiconductor package are disclosed. The semiconductor device may include a main body having one or more supporting layers, a plurality of metal wires that may be f... | 09/02/2008 |
| 7408120 | Printed circuit board having axially parallel via holes Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole. ... | 08/05/2008 |
| 7394150 | Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys A semiconductor package includes a die that is interposed, flip-chip style, between an upper lead frame and a lower lead frame. The lower lead frame has contacts that are aligned with terminals on the bottom surface of the die. The upper lead frame contacts a termin... | 07/01/2008 |
| 7390974 | Multilayer printed wiring board with filled viahole structure The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The m... | 06/24/2008 |
| 7378597 | Multilayer printed circuit board A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electrically connect the IC chip to th... | 05/27/2008 |
| 7367116 | Multi-layer printed circuit board, and method for fabricating the same To provide an interlayer-connected, multi-layer flexible printed circuit board having high bonding reliability and most suitable for micropatterning the circuit layers in the device; and to provide a high-productivity method for fabricating the device. A mult... | 05/06/2008 |
| 7368666 | Surface-mounting type electronic circuit unit without detachment of solder A surface-mounting type electronic circuit unit includes pedestal bases. The pedestal bases are attached to first lands provided on the bottom surface of an insulating substrate and are made of plate-shaped metal material having a solder film on the outer surface th... | 05/06/2008 |
| 7365436 | Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same A disclosed substrate includes a base member having a through-hole, and a conductive metal filling in the through-hole so as to form a penetrating via. The penetrating via contains a conductive core member that is substantially at the central axis of the through-hol... | 04/29/2008 |
| 7356917 | Method for manufacturing multi-layer printed circuit board A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the insulation substrate. The surface conductive pattern has a surface r... | 04/15/2008 |
| 7355504 | Electrical devices An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising (a) a main portion which comprises a main part of the first electrode, a ma... | 04/08/2008 |
| 7342802 | Multilayer wiring board for an electronic device To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an interlayer insulating film allows for interlayer connection between plural wiring films insulated from one another with plural interlayer insulating layers.... | 03/11/2008 |
| 7338299 | Surface mounted electronic component An exemplary surface mounted electronic component has block body including a bottom soldering surface, a top surface and a peripheral wall having a first peripheral wall portion and a second peripheral wall portion. The bottom soldering surface defines a first solde... | 03/04/2008 |
| 7312523 | Enhanced via structure for organic module performance A circuit board comprises a resin-filled plated (RFP) through-hole; a dielectric layer over the RFP through-hole; a substantially circular RFP cap in the dielectric layer and connected to an upper opening of the RFP through-hole; a via stack in the dielectric layer;... | 12/25/2007 |
| 7309838 | Multi-layered circuit board assembly with improved thermal dissipation A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature dissipation resin, which is of insulating material and is arranged so as to d... | 12/18/2007 |
| 7310236 | Electronic device A casing that has an electronic component housed therein has a conductive layer made of a mixture of carbon fibers and a thermoplastic resin and an insulating layer where only the thermoplastic resin is exposed on a surface of the conductive layer. The casing preven... | 12/18/2007 |
| 7303427 | Electrical connector with air-circulation features A preferred embodiment of an electrical connector includes an electrical conductor for transmitting electrical power, and a housing. The electrical conductor is mounted in the housing so that the housing and the electrical conductor define a channel for circulating ... | 12/04/2007 |
| 7297875 | Fusion bonded assembly with attached leads A signal processing module can be manufactured from a plurality of composite substrate layers, each substrate layer includes elements of multiple individual processing modules. Surfaces of the layers are selectively metalicized to form signal processing elements whe... | 11/20/2007 |
| 7278207 | Method of making an electronic package An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of diele... | 10/09/2007 |
| 7273988 | Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board An electronic device is mounted on a wiring board, which includes: a substrate having through holes, and lands extending on surfaces of the substrate and adjacent to openings of the through holes. Further, at least one coating layer is provided, which coats at least... | 09/25/2007 |
| 7272806 | System and method for evaluating power and ground vias in a package design A method and software product evaluate vias in an electronic design. One or more via sufficiency rules are formulated, and then the electronic design is processed to determine whether the vias of the electronic design violate the via sufficiency rules. In the event ... | 09/18/2007 |
| 7268303 | Circuit board, mounting structure of ball grid array, electro-optic device and electronic device In a circuit board including a pad for mounting a ball grid array and a wiring, a mounting structure of the ball grid array, an electro-optic device, and an electronic device, the circuit board includes a pad for mounting the ball grid array, a wiring for connecting... | 09/11/2007 |
| 7261596 | Shielded semiconductor device A semiconductor device is disclosed that comprises a board, a ground terminal disposed on the board, a connection terminal disposed on the board, a semiconductor chip mounted on the board, and a shield member electrically connected to the ground terminal. The semico... | 08/28/2007 |
| 7259460 | Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package Aspects of the invention recite wire bonding on thinned portions of a lead-frame that is configured for use in an IC package. A harder lead-frame material, improved adhesive tape, and various structural features of the lead-frame itself, in various combinations or s... | 08/21/2007 |
| 7249411 | Methods for mounting surface-mounted electrical components Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. E... | 07/31/2007 |
| 7247939 | Metal filled semiconductor features with improved structural stability A method for forming a metal filled semiconductor feature with improved structural stability including a semiconductor wafer having an anisotropically etched opening formed through a plurality of dielectric insulating layers revealing a first etching resistant layer... | 07/24/2007 |
| 7240425 | Method of making an electrical connection to a conductor on an inner layer of a multi-layer printed circuit board What is provided is a multi-layer PCB having a plurality of stacked dielectric layers, a conductor disposed on at least one of the plurality of dielectric layers, and a non-conductive via extending through at least a portion of the plurality of dielectric layers to ... | 07/10/2007 |
| 7242592 | Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal conductors and ground conductors. The printed circuit board includes a plur... | 07/10/2007 |
| 7226654 | Laminated wiring board and its mounting structure A laminated wiring board comprising: a first wiring board forming wiring layers on the upper surface and on the lower surface of a first ceramic insulated substrate; and a second wiring board forming wiring layers ... | 06/05/2007 |
