Bizarre Patents
User-operated amusement apparatus for kicking the user's buttocks
An apparatus including a user-operated and controlled apparatus for self-infliction of repetitive blows to the user's buttocks by a plurality of elongated arms bearing flexible extensions that rotate under the user's control.
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| Number | Title | Issue Date |
| 4242719 | Solder-weld P.C. board apparatus A circuit board apparatus of the type which has multiple connection regions that can each make a solder connection to the lead of a component and a weld connection to a wire, which minimizes the possibility of damage to the region during wire welding and ... | 12/30/1980 |
| 4237606 | Method of manufacturing multilayer ceramic board In a method of manufacture of a multilayer ceramic board, a conductor land is formed and baked on a first substrate. A second substrate on which the wiring pattern is formed is then electrically connected to the first substrate via the land. An error in t... | 12/09/1980 |
| 4230385 | Printed circuit board, electrical connector and method of assembly A solderless electrical connector comprising a printed circuit board and electrical contact terminals mounted therein. A printed circuit board is fabricated to the construction stage wherein conductive circuitry interconnects plated through holes formed t... | 10/28/1980 |
| 4230553 | Treating multilayer printed wiring boards Multilayer printed wiring boards are conventionally laminated using epoxy adhesives. When the boards are drilled, a residual smear often remains within the drilled holes. This smear prevents proper through plating of the holes and the layers are left with... | 10/28/1980 |
| 4223435 | Circuit board with self-locking terminals The present invention provides an apertured circuit board having self-locking terminals which partially cover at least some of the apertures. The terminals, which are integral extensions of the circuit pathways, each include a pair of inwardly disposed ge... | 09/23/1980 |
| 4191789 | Fabrication of bi-level circuits Disclosed is a method of fabricating bi-level circuits which include metallization of via holes (14 and 15) in insulating subustrates (10). A thick film metal paste (13) is prepared which according to one embodiment comprises copper, glass frit and an org... | 03/04/1980 |
| 4173745 | Filtering configuration using feed-through capacitor A printed circuit board, preferably, including a feed-through capacitor having outer and inner conductors separated by a dielectric through which the outer and inner conductors capacitively couple. An electrical energy carrying printed circuit line which ... | 11/06/1979 |
| 4107836 | Circuit board with self-locking terminals The present invention provides an apertured circuit board having self-locking terminals which partially cover at least some of the apertures. The terminals, which are integral extensions of the circuit pathways, are adhesively anchored to the circuit boar... | 08/22/1978 |
| 4097684 | Electric wiring assemblies This invention generally relates to prefabricated electric wire assemblies comprising an interconnected network of separately formed, integral, shaped conductors, and to materials and techniques used in the manufacture of such assemblies.... | 06/27/1978 |
| 4095866 | High density printed circuit board and edge connector assembly A high density printed circuit board carrying integrated circuits or the like is provided with two parallel rows of terminals along one edge on both sides of the board. The terminals in the outer row of terminals closest to the edge of the board are conne... | 06/20/1978 |
| 4074088 | Keyboard apparatus and method of making A keyboard-operated electronic apparatus such as an electronic calculator is made by forming a dielectric card with a plurality of recesses in one card side. Preferably the card is formed with a number of apertures extending through the card. Electrically... | 02/14/1978 |
| 4064357 | Interconnected printed circuits and method of connecting them A method of making and electrically interconnecting layers of printed circuitry involves the steps of: (1) coating an insulator on both sides with an adhesive; (2) punching holes through the insulator at points where interconnections are to be made; (3) l... | 12/20/1977 |
| 4054479 | Additive process for producing printed circuit elements using a self-supported photosensitive sheet Printed circuit boards with plated through-holes are prepared by an electroless plating process using a self-supported, adherent, photohardenable sheet. The self-supported photohardenable sheet preferably is composed of a photopolymerizable material and m... | 10/18/1977 |
| 4047290 | Process for the production of a multi-chip wiring arrangement A process for producing multi-chip wiring arrangements which consist of a ceramic carrier with through contact holes associated with thin film wiring on one side of the carrier and with multi layer, thick layer wiring on the other side of the carrier. The... | 09/13/1977 |
| 4031371 | Microcomputer board having wire-wrap terminals A microcomputer board has a first section with fixedly mounted microcomputer components interconnected by a printed circuit, and a second section having unconnected wire-wrap terminals adapted to receive DIP components. Wire-wrap terminals are provided fo... | 06/21/1977 |
| 3983458 | Electrical device assembly and method An electrical device assembly wherein a plurality of electrical components or conductors having opposing terminal ends are disposed within apertures in a flat dielectric substrate, at least one of the terminal ends of selected components or conductors ext... | 09/28/1976 |
| 3977074 | Double sided printed circuit board and method for making same A single sided printed circuit board on a rigid substrate is prepared in a conventional manner, such as etching, with a first circuit including pads at the desired sites of interfacial connections. A rectangular hole is punched through the substrate at ea... | 08/31/1976 |
| 3969815 | Process for forming a through connection between a pair of circuit patterns disposed on opposite surfaces of a substrate In a process of forming through connections between metal circuit patterns formed in layers on opposite surfaces of a substrate characterized by forming an aperture through the pair of layers and the substrate, increasing the diameter of the aperture in t... | 07/20/1976 |
| 3953924 | Process for making a multilayer interconnect system A process for making an interconnect system for a multilayer circuit pattern. The interconnect system is formed having minimized through-hole space consumption so as to be suitable for high density, closely meshed circuit patterns.... | 05/04/1976 |
| 3953663 | Vacuum-heat treated printed circuit boards Relates to printed circuit boards which are devoid of electrical discontinuities likely to arise in the production of two-sided circuit boards having plated-through-holes and solder fillets therein for improving the electrical interconnections. Research d... | 04/27/1976 |
| 3941916 | Electronic circuit package and method of brazing An electronic package assembly having a plurality of gold-plated lead pins solderably secured within a corresponding array of pre-metalized, cylindrical-shaped holes disposed in a ceramic substrate of the package. The interior surfaces defining the holes ... | 03/02/1976 |
