Did You Know...
...that the Slinky toy was the result of a failed attempt by engineer Richard James to produce an antivibration device for ship instruments? His goal was to develop a spring that would instantaneously counterbalance the wave motion that rocks a ship at sea. Instead, he developed the Slinky.
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| Number | Title | Issue Date |
| 7476814 | Multilayer interconnection board A multilayer interconnection board includes a plurality of stacked insulation layers, wiring layers in the insulation layers, and via forming parts for interlayer connection, the via forming parts piercing the insulation layers. In the multilayer interconnection boa... | 01/13/2009 |
| 7470864 | Multi-conducting through hole structure A multi-conducting through hole structure is provided. The multi-conducting through hole structure has a substrate, at least two signal lines and at least a reference line. The substrate has a through hole passing therethrough. The signal lines are disposed on a por... | 12/30/2008 |
| 7470865 | Multilayer printed wiring board and a process of producing same A multilayer printed wiring board which permits the formation of fine wiring patterns, thereby increasing the density of wiring patterns. Using photosensitive glass having a coefficient of thermal expansion close to that of a copper film as a core substrate, a throu... | 12/30/2008 |
| 7449641 | High-speed signal transmission structure having parallel disposed and serially connected vias A high-speed signal transmission structure having parallel disposed and serially connected vias is disclosed. The structure is applicable to a multi-layered circuit board such as a high-speed digital circuit board for forming a high-speed signal transmission circuit... | 11/11/2008 |
| 7446263 | Multilayer printed circuit board The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in approximately the same plane at the time of manufacturing a multilayer printed ... | 11/04/2008 |
| 7442879 | Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a binder component and at least one metallic component including microparticles. In another embodiment, the paste includes the bind... | 10/28/2008 |
| 7440291 | Method of reducing noise induced from reference plane currents A method of reducing noise induced from reference plane currents is disclosed. The method includes routing a first path for an electrical trace on a circuit board such that the first path references a voltage plane. The method further includes routing a second path ... | 10/21/2008 |
| 7438969 | Filling material, multilayer wiring board, and process of producing multilayer wiring board A solvent-free filling material comprising a filler, a thermosetting resin, a curing agent, and a curing catalyst, wherein the thermosetting resin is an epoxy resin, and the curing agent is a dicyandiamide curing agent; a multilayer printed wiring board comprising a... | 10/21/2008 |
| 7438593 | Component for a printed circuit board and method for fitting a printed circuit board with this component A printed circuit board component includes a housing carrying a peg that engages a printed circuit board hole. This peg has a radially projecting detent lug extending beyond the plug outer periphery. The lug is located and formed on the peg so the peg outer peripher... | 10/21/2008 |
| 7435912 | Tailoring via impedance on a circuit board A circuit board includes multiple signal layers, in which signal lines are routed, and reference plane layers, in which power reference planes are provided. To connect signal lines at different signal layers, vias are passed through at least one signal layer and at ... | 10/14/2008 |
| 7435913 | Slanted vias for electrical circuits on circuit boards and other substrates Circuit boards, microelectronic devices, and other apparatuses having slanted vias are disclosed herein. In one embodiment, an apparatus for interconnecting electronic components includes a dielectric portion having a first surface and a second surface. A first term... | 10/14/2008 |
| 7436681 | Wiring board with built-in capacitor The invention provides a wiring board with built-in capacitors, that has a multilayer wiring structure and capable of mounting an IC chip thereon. The wiring board with built-in capacitors includes: a first capacitor that is built into the multilayer wiring structur... | 10/14/2008 |
| 7435910 | Multilayer printed circuit board A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electrically connect the IC chip to th... | 10/14/2008 |
| 7435914 | Tape substrate, tape package and flat panel display using same A tape substrate having hole(s) formed discontinuously along a bent portion thereof and configured to dissipate stress applied to the bent portion. A tape package using the tape substrate may be connected to a panel and a printed circuit board using an ACF. The tape... | 10/14/2008 |
| 7434311 | Printed wiring board manufacturing method This printed wiring board manufacturing method comprises the steps of providing a large number of through holes (for a through-hole) in a substrate made of an insulating material of which both sides are coated with a copper foil; making the inside of the through hol... | 10/14/2008 |
| 7432450 | Printed circuit board A printed circuit board on which a connector is mounted includes a conductive layer, insulating layers, and a supporting member. A part of the conductive layer is exposed on a top surface of the PCB in order to form a connecting pad portion for connecting the connec... | 10/07/2008 |
| 7427716 | Microvia structure and fabrication A system may include a first microvia pad, a second microvia pad having a projection extending in a direction toward the first microvia pad, and a microvia electrically coupled to the first microvia pad and to the second microvia pad. ... | 09/23/2008 |
| 7427718 | Ground plane having opening and conductive bridge traversing the opening Conductive bridges to traverse openings in ground planes, and methods of making the conductive bridges, are disclosed. In one aspect, an apparatus may include a ground plane, one or more openings defined in the ground plane, such as, for example, conjoined via openi... | 09/23/2008 |
| 7425684 | Universal systems printed circuit board for interconnections In Electronics, there exists three distinctive areas namely, discrete components or devices, circuits, and systems. A circuit is built from devices and a system is built from circuits. This invention aims at reducing the implementation of electronic systems down to ... | 09/16/2008 |
| 7420129 | Semiconductor package including a semiconductor device, and method of manufacturing the same A method and apparatus of manufacturing a semiconductor device and the semiconductor device used in a semiconductor package are disclosed. The semiconductor device may include a main body having one or more supporting layers, a plurality of metal wires that may be f... | 09/02/2008 |
| 7420130 | Wiring board and method for fabricating the same The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, ... | 09/02/2008 |
| 7420126 | Circuit board and circuit apparatus using the same A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a requirement as to heat radiation capability. The circuit apparatus has th... | 09/02/2008 |
| 7417195 | Circuit board and circuit board connection structure A printed circuit board 2 and an FPC board 3 to be connected together are each given a multilayer structure wherein insulating films 23, 33 and interconnection patterns 22, 32 are stacked alternately. In the FPC board 3, connecting... | 08/26/2008 |
| 7410837 | Method of manufacturing mounting substrate A method for manufacturing a mounting substrate on which a semiconductor chip is mounted includes: forming a wiring section by electrolytic plating on a first face of a supporting substrate which is made of an insulating material, by supplying electric power from a ... | 08/12/2008 |
| 7411134 | Hybrid ground grid for printed circuit board Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a substrate core to form multilayer ground grids. Such hybrid ground lines i... | 08/12/2008 |
| 7408120 | Printed circuit board having axially parallel via holes Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole. ... | 08/05/2008 |
| 7405365 | Wiring substrate and method for manufacturing the same A wiring substrate of the present invention includes a short ring (SR) formed along a periphery of the substrate, an independent line pattern (e.g., a gate terminal) that is coplanar with and independent of SR, a continuous line pattern (e.g., a storage capacitor st... | 07/29/2008 |
| 7405366 | Interposer and electronic device fabrication method An interposer 2 including a base 10 formed of a plurality of resin layers 26, 34, 42, 52, 56; a thin-film capacitor 12 buried in the base 10, including a lower electrode 20, a capacitor dielectric film 22 and an upper... | 07/29/2008 |
| 7405473 | Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing Techniques are provided for placing and routing vias that conduct signals through a connector between two electrical units. Vias that conduct a first set of signals are placed next to vias that provide return paths for the first set of signals to reduce cross-talk o... | 07/29/2008 |
| 7404251 | Manufacture of printed circuit boards with stubless plated through-holes A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertica... | 07/29/2008 |
| 7402760 | Multi-layer printed wiring board and manufacturing method thereof A multi-layer printed wiring board has a core substrate, a throughhole structure, a first interlayer insulation layer, a first via, a second interlayer insulation layer and a second via. The core substrate has a throughhole opening, and the throughhole structure is ... | 07/22/2008 |
| 7402759 | Printed circuit board, magnetic disk device, and method for manufacturing the printed circuit board An insulating substrate includes a first area where a semiconductor device is disposed, a second area where a wiring electrically connecting to the semiconductor device is disposed, and a third area where a terminal electrically connecting to the wiring is disposed.... | 07/22/2008 |
| 7402758 | Telescoping blind via in three-layer core A multilayer PCB including at least one carrier, wherein the at least one carrier comprises a pseudo three-layer core. Each three-layer core includes a first metal layer, a first dielectric layer, an internal bridge layer, a second dielectric layer, and a second met... | 07/22/2008 |
| 7400511 | Electronic component mounting structure An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connect... | 07/15/2008 |
| 7400512 | Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor. The ... | 07/15/2008 |
| 7400515 | Circuit board electrode connection structure An electrode connection structure between outer lead(s) of TCP(s), being first circuit board(s), and actuator member electrode(s) for connection to external circuitry, being second circuit board(s); actuator member(s) electrode(s) for connection to external circuitr... | 07/15/2008 |
| 7399930 | Method and device for repair of a contact pad of a printed circuit board Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surfa... | 07/15/2008 |
| 7399661 | Method for making an integrated circuit substrate having embedded back-side access conductors and vias A method for making an integrated circuit substrate having embedded back-side access conductors and vias provides a high-density mounting and interconnect structure for integrated circuits that is compatible with etched, plated or printed pre-manufactured substrate ... | 07/15/2008 |
| 7397000 | Wiring board and semiconductor package using the same A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. T... | 07/08/2008 |
| 7394027 | Multi-layer printed circuit board comprising a through connection for high frequency applications A high frequency multi-layer printed circuit board, according to the present invention, comprises a through connection having an impedance adapting structure surrounding the through connection and enabling an adjustment of the characteristic impedance of the through... | 07/01/2008 |
