Bizarre Patents
A method of swing on a swing is disclosed, in which a user positioned on a standard swing suspended by two chains from a substantially horizontal tree branch induces side to side motion by pulling alternately on one chain and then the other.
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| Number | Title | Issue Date |
| 7208839 | Semiconductor component assemblies having interconnects Methods relating to forming interconnects through injection of conductive materials, to fabricating semiconductor component assemblies, and to resulting assemblies. A semiconductor component substrate, such as a semiconductor die or other substrate, has dielectric m... | 04/24/2007 |
| 7209368 | Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making A circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a ground plane located beneath the signal and ground lines and separated therefrom by a commo... | 04/24/2007 |
| 7205483 | Flexible substrate having interlaminar junctions, and process for producing the same A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern ... | 04/17/2007 |
| 7205485 | Printed circuit board and method for fabricating the same A printed circuit board and a method for fabricating the same is provided. A substrate having a core layer and a plurality of pairs of bond pads thereon is prepared with at least one opening formed on the core layer between each pair of the bond pads. A solder mask ... | 04/17/2007 |
| 7202419 | Multi-layer integrated RF/IF circuit board including a central non-conductive layer A multi-layered integrated RF/IF circuit board is provided. The board is fabricated beginning with a center layer of material. In a first preferred embodiment, the center layer is a rigid core material. In a second preferred embodiment, the center layer is a pliable... | 04/10/2007 |
| 7199478 | Printed circuit board having an improved land structure A printed circuit board (PCB) having a plurality of lands corresponding to a plurality of solder pins provided on a semiconductor chip package, the lands provided adjacent to the border of the printed circuit board having a rectangular shape elongated in a direction... | 04/03/2007 |
| 7199307 | Structure and method for embedding capacitors in z-connected multi-chip modules A chip module element having an array of capacitors, a planar interconnect structure coupled to the array of capacitors, and a multilayer circuit structure coupled to the planar interconnect structure. The planar interconnect structure includes a plurality of conduc... | 04/03/2007 |
| 7197820 | Circuit board and its manufacturing method A circuit board is provided in which peeling strength is prevented from decreasing and a connection resistance to a conductive material is prevented from increasing, though the contact area decreases when the circuit board has a copper foil. This circuit board has a... | 04/03/2007 |
| 7197817 | Method for forming contact bumps for circuit board Disclosed is a method of forming bump electrodes on wired circuit boards. A high-concentration impurity Si template doped with boron and having a pit formed therein is prepared. A plated resist is formed on the high-concentration impurity Si template and an opening ... | 04/03/2007 |
| 7199309 | Structure for repairing or modifying surface connections on circuit boards A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a h... | 04/03/2007 |
| 7199305 | Protosubstrates The invention provides a nanolithographic protosubstrate adapted for nanolithographic formation of nanostructures on the protosubstrate comprising: a substrate having a top surface exposed for nanolithographic formation of nanostructures, wherein the top surface com... | 04/03/2007 |
| 7196906 | Circuit board having segments with different signal speed characteristics A circuit board includes multiple segments, with a first segment having plural signal layers and a second segment having plural signal layers. Signal paths provided by signal layers of the first segment exhibit higher speed signal transmission capability than signal... | 03/27/2007 |
| 7197110 | Method for determining chemical content of complex structures using X-ray microanalysis A method for identifying hazardous substances in a printed wiring assembly having a plurality of discrete components, using micro X-ray fluorescence spectroscopy. A micro X-ray fluorescence spectroscopy (μ-XRF) and/or X-ray Absorption Fine Structure (XAFS) spectros... | 03/27/2007 |
| 7196274 | Multi-layer integrated RF/IF circuit board A multi-layered integrated RF/IF circuit board is provided. The board is fabricated beginning with a center layer of material. In a first preferred embodiment, the center layer is a rigid core material. In a second preferred embodiment, the center layer is a pliable... | 03/27/2007 |
| 7195145 | Electrical circuit apparatus and method for assembling same A method for assembling an electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the g... | 03/27/2007 |
| 7194593 | Memory hub with integrated non-volatile memory A memory hub having an integrated non-volatile memory for storing configuration information is provided. The memory hub includes a high-speed interface for receiving memory access requests, a non-volatile memory having memory configuration information stored therein... | 03/20/2007 |
| 7188413 | Method of making a microelectronic package A microelectronic element is formed from a structure including metal layers on top and bottom sides of a dielectric. Apertures are formed in the top metal layer, and vias are formed in the dielectric in alignment with the apertures. Top and bottom conductive feature... | 03/13/2007 |
| 7190080 | Semiconductor chip assembly with embedded metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line... | 03/13/2007 |
| 7189929 | Flexible circuit with cover layer Embodiments of the present invention provide a flexible circuit at least partially encapsulated by a cover layer. The flexible circuit includes a substrate having one or more openings. One or more electrical conductors are bonded to the top surface of the substrate.... | 03/13/2007 |
| 7188410 | Insertion of electrical component within a via of a printed circuit board A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed ... | 03/13/2007 |
| 7188412 | Method for manufacturing printed wiring board Conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole formed in a thermoplastic resin film that interposes between conductor patterns and is hot-pressed from both sides. When the metal particles contained in... | 03/13/2007 |
| 7190592 | Integrated library core for embedded passive components and method for forming electronic device thereon An integrated library core for embedded passive components and a method for forming an electronic device on the library core are provided. An insulating core layer is formed with a plurality of openings penetrating therethrough and with electrically conductive layer... | 03/13/2007 |
| 7185426 | Method of manufacturing a semiconductor package A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of existing grid-array packages having a standard design. A semiconductor die ... | 03/06/2007 |
| 7186924 | Dielectric structure for printed circuit board traces A trace cover suitable for shielding a conductive trace on a top layer of a circuit board. The trace cover includes a dielectric body disposed substantially over the conductive trace, side shielding perpendicular to the direction of the conductive trace and substant... | 03/06/2007 |
| 7186920 | Flexible wiring board, an intermediate product of a flexible wiring board, and a multi-layer flexible wiring board The flexible wiring board has a first wiring film and a second wiring film. Because the first wiring film has a larger thickness than the second wiring film, the sectional area and electrical resistance of the first wiring film can be enlarged because of the larger ... | 03/06/2007 |
| 7185799 | Method of creating solder bar connections on electronic packages Solder connections are created between the substrate of an electronic package and a circuit board having lengths that are longer than the width. The solder connections are created by locating solder balls of power or ground connections close enough to one another so... | 03/06/2007 |
| 7186923 | Printed wiring boards and methods for making them A printed wiring board comprising conductive layers separated by nonconductive material and having through holes or other nonconductive surfaces on which an electrically conductive carbon coating is formed. The conductive carbon coating includes electrically conduct... | 03/06/2007 |
| 7183650 | Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material filling the holes and wirings formed on a surface opposite to a surface... | 02/27/2007 |
| 7183491 | Printed wiring board with improved impedance matching To provide a printed wiring board where the impedance between pads through which differential signals pass has been set to a predetermined standard value. The printed wiring board includes a first conductor layer extending over an area excluding a hole formed for ea... | 02/27/2007 |
| 7183496 | Soldered heat sink anchor and method of use An anchoring mechanism and method are provided for securing a component to a printed circuit board. The anchoring mechanism may include a loop, a first leg extending from the loop, and a second leg extending from the loop. The first leg may mount through a first hol... | 02/27/2007 |
| 7183497 | Multilayer wiring board A multilayer wiring board (11) is provided which includes a core substrate (12) including a plurality of through-holes (15). The through-holes (15) include through-hole conductors (17) on the inner walls of corresponding penetratio... | 02/27/2007 |
| 7183653 | Via including multiple electrical paths A system includes a device having at least one integrated circuit. The integrated circuit further includes a first layer of conductive material, a second layer of conductive material, and a via having multiple electrical paths for interconnecting the first layer of ... | 02/27/2007 |
| 7180315 | Substrate with patterned conductive layer A method of processing a substrate is provided. The method includes providing a substrate having a first surface, a second surface, and conductive paths extending from the first surface to the second surface. The method also includes (1) covering a portion of the fi... | 02/20/2007 |
| 7180005 | Printed wiring board The printed wiring board includes a substrate, an electrically conductive pattern formed on the substrate, and an electrical insulator covering the substrate and the electrically conductive pattern therewith, wherein a region of the electrically conductive pattern e... | 02/20/2007 |
| 7180171 | Single IC packaging solution for multi chip modules A multilayer printed circuit board (PCB) interface includes a top PCB layer, a middle PCB layer, and a bottom PCB layer. A top surface of the top PCB layer receives at least one top module. The middle PCB layer includes an electrically conductive layer disposed betw... | 02/20/2007 |
| 7180009 | Transmission line with stripped semi-rigid cable A high frequency coax transmission line structure is configured with a stripped semi-rigid cable (no shield). The stripped cable is inserted lengthwise into a metallized grounded slot formed in a printed wiring board. The dielectric barrel of the stripped cable cont... | 02/20/2007 |
| 7176383 | Printed circuit board with low cross-talk noise A printed circuit board and a method of making same in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers, each signal layer comprising a plurality of substantially pa... | 02/13/2007 |
| 7177136 | Wiring board, electro-optical device, method of manufacturing the electro-optical device, and electronic instrument A wiring board has a substrate, a bank disposed above the substrate and providing a plurality of regions, and a conductive layer and first and second interconnecting lines which are parallel to each other and formed between the bank and the substrate. The first inte... | 02/13/2007 |
| 7176384 | Electronic component In a stack-type piezoelectric device, a separator made of a material capable of preventing solder leaching is buried in a terminal electrode so as to block the whole of an aperture of a through hole. For this reason, it is feasible to securely prevent an electrocond... | 02/13/2007 |
| 7173804 | Array capacitor with IC contacts and applications An apparatus having a first set of contacts on a first side of the apparatus adapted to interface with a corresponding plurality of contacts on an integrated circuit package. The apparatus further includes a second set of contacts on a second side of the apparatus a... | 02/06/2007 |
