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| Number | Title | Issue Date |
| 8115110 | Printed circuit board minimizing undesirable signal reflections in a via and methods therefor What is provided is a multi-layer PCB having a plurality of stacked dielectric layers, a conductor disposed on at least one of the plurality of dielectric layers, and a non-conductive via extending through at least a portion of the plurality of dielectric layers to ... | 02/14/2012 |
| 8115111 | Multilayer printed wiring board with filled viahole structure A multilayer printed wiring board includes a multilayered structure having conductor circuit layers and interlaminar insulative layers, the interlaminar insulative layers including an outermost interlaminar insulative layer, the conductor circuit layers including an... | 02/14/2012 |
| 8110753 | Circuit board assembly A circuit board assembly includes: a circuit board having opposite first and second surfaces and formed with a first through-hole defined by a hole-defining wall that extends between and that terminates at the first and second surfaces and that cooperates with the f... | 02/07/2012 |
| 8106310 | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board A multi-layer printed circuit board having interlayer resin insulating layers on both sides of a core substrate, respectively, through holes provided to penetrate the core substrate and filled with resin filler, the interlayer resin insulating layers and conductor c... | 01/31/2012 |
| 8093506 | Multilayer wiring board and power supply structure to be embedded in multilayer wiring board A multilayer wiring board capable of feeding sufficient electric power to a circuit element, such as an IC chip. In one embodiment of the present invention, a multilayer wiring board is comprised of: a core board; a build up layer disposed on an upper surface of the... | 01/10/2012 |
| 8093507 | Printed wiring board and method for producing the same A multilayer printed circuit board including a substrate board having a lower conductor circuit, a resin insulating layer formed over the substrate board and lower conductor circuit, and a conductor circuit formed over the resin insulating layer. The resin insulatin... | 01/10/2012 |
| 8093508 | Printed wiring board and method of manufacturing the same A printed wiring board including a first insulating layer, a second insulating layer formed over the first insulating layer, a capacitor portion including an upper electrode, a lower electrode and a ceramic high dielectric layer formed between the upper electrode an... | 01/10/2012 |
| 8089007 | Printed circuit board A printed circuit board includes a reference layer, at least one first hole defined in the reference layer and adjacent from a first pin in a first column of pins of an electronic component, and at least one second hole defined in the reference layer and adjacent fr... | 01/03/2012 |
| 8089006 | High performance resonant element A circuit includes an input signal line, a high performance resonant element connected to the input signal line, and an output signal line connected to the high performance resonant element. The high performance resonant element is a via. ... | 01/03/2012 |
| 8084695 | Via structure for improving signal integrity The embodiment of the invention is about a novel via structure which can be incorporated into printed circuit boards, integrated circuit packages, and integrated circuits in order to reduce crosstalk, to improve signal integrity and to achieve EM emission compliance... | 12/27/2011 |
| 8084696 | Printed circuit board and manufacturing method thereof A printed circuit board and a method of manufacturing the same are disclosed. The method of manufacturing a printed circuit board including a connecting layer configured to which is configured to electrically connect both sides of an insulator, and a pad part, elect... | 12/27/2011 |
| 8080741 | Printed circuit board A printed circuit board, which increases the contact area between an IC and a printed circuit board, thus increasing the degree of adhesion, is disclosed. The printed circuit board includes: an insulation layer which includes a first circuit pattern, including at le... | 12/20/2011 |
| 8076590 | Printed circuit board A printed circuit board includes a first signal via, a second signal via, and a first ground via. A distance between the first ground via and the first signal via is substantially equal to a distance between the first ground via and the second signal via. ... | 12/13/2011 |
| 8076589 | Multilayer wiring board and its manufacturing method A multilayer wiring board employs a thin insulating substrate having substantially only resin flow as the compression property effect, and has an any-layer IVH structure where at least one core layer is formed without burying wiring. For sufficiently securing an eff... | 12/13/2011 |
| 8071890 | Electrically conductive structure of circuit board and circuit board using the same An electrically conductive structure includes a first conductive structure and a second conductive structure. Each has a conducting section at one end and a coupling section at the other end. The first and second conducting sections are electrically connected to a p... | 12/06/2011 |
| 8071889 | Electronic device with EMI screen and packing process thereof An electronic device with EMI screen and packaging process thereof to provide even active EMI prevention means includes adhesion of a transit substrate to a soldering surface of the electronic device, a protection circuit layer functioning as EMI screen being paved ... | 12/06/2011 |
| 8071891 | Interconnect structure A interconnect structure includes a substrate, a pair of interconnect pads, a pair of transmission lines. The substrate is stacked with at least one layer, and each of the layers has a first surface plane and a second surface plane. The pair of interconnect pads are... | 12/06/2011 |
| 8067700 | Via structure of printed circuit board A printed circuit board (200) includes at least one via (280) defined therein, the via has an upper cap (220) formed on a top surface of the PCB, and a lower cap (240) formed on a bottom surface of the PCB. A conductive hole (290) ... | 11/29/2011 |
| 8063316 | Split wave compensation for open stubs In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end ... | 11/22/2011 |
| 8063315 | Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as... | 11/22/2011 |
| 8058567 | High density package substrate and method for fabricating the same The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is provided. A bottom pad is disposed on the lower copper foil, aligned to a pr... | 11/15/2011 |
| 8058566 | Packaging substrate structure and manufacturing method thereof A packaging substrate structure includes a dielectric layer with a plurality of dielectric pillars disposed on a portion of a large-dimension opening area of the dielectric layer; and a first circuit layer with a plurality of first circuits disposed on a portion of ... | 11/15/2011 |
| 8049118 | Printed circuit board Printed circuit board in which deterioration of signal transmission characteristics otherwise caused by a stub parasitically formed in a through-hole is suppressed to provide optimum high-speed signal transmission characteristics. A printed circuit board 10 i... | 11/01/2011 |
| 8030579 | Multilayer printed wiring board An object of the present invention is to provide a multilayered printed circuit board having a short wiring distance of the conductor circuits, wide option of the design of the conductor circuits and additionally excellent in reliability since cracking scarcely take... | 10/04/2011 |
| 8030580 | Printed wiring board and electronic apparatus including same A printed wiring board, which may be included in an electronic apparatus, includes a pair of signal pads including a first signal pad and a second signal pad formed on a front side thereof and configured to transmit differential signals, a ground pad formed at a pos... | 10/04/2011 |
| 8022314 | Printed wiring board A printed wiring board including a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening pr... | 09/20/2011 |
| 8003897 | Printed wiring board A printed wiring board includes a wiring substrate provided with at least one conductor circuit, a solder resist layer formed on the surface of the wiring substrate, covering the at least one conductor circuit, conductor pads formed on a part of the at least one con... | 08/23/2011 |
| 8003896 | Multi-layer printed wiring board and manufacturing method thereof A multi-layer printed wiring board has a core substrate, a first interlayer insulation layer formed over the core substrate, a first filled via formed in the first interlayer insulation layer, a second interlayer insulation layer formed over the first interlayer ins... | 08/23/2011 |
| 7999192 | Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards An electrical signal connection, an electrical signaling system, and a method of connecting printed circuit boards. The electrical signal connection having a first conductive via and a second conductive via disposed in a first printed circuit board. A first conducti... | 08/16/2011 |
| 7994433 | Printed wiring board and method for producing the same A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conducto... | 08/09/2011 |
| 7989708 | Multi-layer wiring board In a multi-layer wiring board in which board wirings are arranged in a plurality of wiring layers so as to be connected via a through hole, two through holes are provided in parallel, and two through holes are connected therebetween in both end portions of the respe... | 08/02/2011 |
| 7985929 | Circuit board and method of manufacturing the same A circuit board and a method of manufacturing the same are provided. The circuit board includes: a multilayer board in which a plurality of conductive layers with desired patterns formed therein, and a plurality of insulating layers are stacked; a plurality of throu... | 07/26/2011 |
| 7977582 | Flexible multilayer printed circuit assembly with reduced EMI emissions A flexible multilayer printed circuit assembly with shield fences. The flexible multilayer printed circuit assembly with multiple conductive layers includes logic ground vias that connect logic ground plane layers together, and shield vias that connect a top and a b... | 07/12/2011 |
| 7968802 | Printed circuit board with differential traces A printed circuit board (PCB) includes a differential pair having a first differential trace and a second differential trace, a first via having an upper cap and a lower cap, and a second via having an upper cap and a lower cap. The first differential trace includes... | 06/28/2011 |
| 7956292 | Printed circuit board manufacturing method, printed circuit board, and electronic apparatus A printed circuit board manufacturing method includes: a hole-forming step of forming a through hole in a substrate that will become an element of a printed circuit board after manufacturing; and a jig insertion step of inserting a jig in the through hole formed in ... | 06/07/2011 |
| 7947910 | Printed circuit board with reduced crosstalk effect between transmission lines therein A printed circuit board includes a first signal layer, a second signal layer, a plurality of transmission lines respectively including first segments laid in parallel on the first signal layer and second segments laid in parallel on the second signal layer, and a pl... | 05/24/2011 |
| 7943861 | Printed wiring board and method for manufacturing printed wiring board A composite layer composed of an Ni layer 72 and a Pd layer 73 is formed on a solder pad 77U, and a solder 76α on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons su... | 05/17/2011 |
| 7943862 | Method and apparatus for optically transparent via filling A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable state so that a portion of the occluding material is internal to the via... | 05/17/2011 |
| 7935896 | Matched-impedance connector footprints Disclosed are methodologies for defining matched-impedance footprints on a substrate such as a printed circuit board, for example, that is adapted to receive an electrical component having an arrangement of terminal leads. Such a footprint may include an arrangement... | 05/03/2011 |
| 7935895 | Structuring and circuitizing printed circuit board through-holes Methods and apparatus for creating independent circuit connections within a through-hole of a substrate are described. According to one aspect of the present invention, a method includes defining a through-hole in a substrate, applying a conductive plating to a hole... | 05/03/2011 |
