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| Number | Title | Issue Date |
| 8183466 | Matched-impedance connector footprints Disclosed are methodologies for defining matched-impedance footprints on a substrate such as a printed circuit board, for example, that is adapted to receive an electrical component having an arrangement of terminal leads. Such a footprint may include an arrangement... | 05/22/2012 |
| 8183467 | Wiring board and method of producing the same A wiring board includes: wiring layers; insulating layers disposed between the wiring layers; and external connection pads respectively including surface plated layers, for connecting to an external circuit. In each of the external connection pads in one face of the... | 05/22/2012 |
| 8178790 | Interposer and method for manufacturing interposer An interposer and a method of manufacturing the same are provided. The interposer includes a substrate and a conductor portion formed inside the substrate. At least one insulating layer is formed on the substrate and on the conductor portion. A signal wiring portion... | 05/15/2012 |
| 8178789 | Wiring board and method of manufacturing wiring board A wiring board assembly and a method of making a wiring board assembly. The wiring board assembly includes a first wiring board having a first substrate, a non-pliable second substrate having a smaller mounting area than a mounting area of the first substrate and a ... | 05/15/2012 |
| 8173908 | Device interconnects A method of fabricating a device structure, comprises: forming an insulating layer (3b) over a first set of devices disposed over a substrate (3); forming one or more vias in the insulating layer; disposing a second set of devices (6) ove... | 05/08/2012 |
| 8173907 | Interposer and method for manufacturing interposer An interposer includes a first insulating layer made of an inorganic material and having a first land, a second land and a first wiring electrically connecting the first land and the second land, and a second insulating layer formed over a first surface of the first... | 05/08/2012 |
| 8164003 | Circuit board surface structure and fabrication method thereof A circuit board surface structure and a fabrication method thereof are proposed. The circuit board surface structure includes: a circuit board having a plurality of electrically connecting pads formed on at least one surface thereof; a first and a second insulating ... | 04/24/2012 |
| 8158889 | Electromagnetic bandgap structure and printed circuit board An electromagnetic bandgap structure and a printed circuit board are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure includes a mushroom type structure comprising a first metal plate and a via of which one ... | 04/17/2012 |
| 8153905 | Method for manufacturing printed wiring board and printed wiring board A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal... | 04/10/2012 |
| 8148646 | Process of positioning groups of contact structures A contact apparatus can be made by providing a first substrate with electrically conductive terminals and second substrates each of which can have contact structures. Each of the contact structures can have a contact tip. The second substrates can be aligned such th... | 04/03/2012 |
| 8138427 | Printed circuit board and method of manufacturing the same A printed circuit board and method of manufacturing the printed circuit board, including a first and second write wiring patterns, an end of a first line and an end of a second line of the first write wiring pattern are arranged on both sides of a third line of a se... | 03/20/2012 |
| 8138426 | Mounting structure A mounting structure is provided that can suppress flux from spreading, secure a connecting strength between a circuit board and an electronic component with underfill, and achieve a stable electrical connection between lands and terminals. The mounting structure is... | 03/20/2012 |
| 8124884 | Printed circuit board A printed circuit board (PCB) includes a positive differential signal line including first and second segments, a negative differential signal line including third and fourth segments, first and second connecting elements soldered on opposite surfaces of the PCB. Th... | 02/28/2012 |
| 8119928 | Multi-layered wiring substrate and method of manufacturing the same In a multi-layered wiring substrate according to an exemplary aspect of the present invention, a conductor formed in an edge face area functions as a pad for mounting a connector. ... | 02/21/2012 |
| 8115107 | System and method for mounting shielded cables to printed circuit board assemblies Methods and apparatus are provided for securely and cost effectively attaching one or more shielded cables to a planar substrate. A cable assembly includes a printed circuit board (PCB) coupled to a distal end of the one or more shielded cables. Perpendicular alignm... | 02/14/2012 |
| 8115108 | Flexible printed circuit board and manufacturing method for the same The insulation base side of single-sided FPC is turned to the die side, and the mounting surface side of ground circuit is turned to the upper side, and the FPC is placed on die (a). When the portion of ground circuit where the conduction is realized and metal reinf... | 02/14/2012 |
| 8115109 | Circuit board and method for jointing circuit board A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint ... | 02/14/2012 |
| 8110752 | Wiring substrate and method for manufacturing the same A method for manufacturing a wiring substrate includes forming a conductor circuit on an insulating layer, the conductor circuit including a pad, a circuit pattern connected to the pad, and a lead pattern connected to the pad. A solder resist layer is formed on the ... | 02/07/2012 |
| 8110751 | Semiconductor memory module and electronic component socket for coupling with the same The present invention relates to a semiconductor memory module and an electronic component socket for coupling with the same. A printed circuit board of the semiconductor memory module includes three signal pad arrays longitudinally formed in a row on one sides of a... | 02/07/2012 |
| 8106309 | Flexible printed circuit, display device including the same, and manufacturing method thereof A flexible printed circuit film includes a film including a first region of an adhesion region and a second region outside of the adhesion region, a signal wire formed on the second region, and reinforcement wiring connected to the signal wire and formed on the firs... | 01/31/2012 |
| 8106308 | Printed circuit board for package and manufacturing method thereof A printed circuit board for a package includes a first insulation layer, on one side of which an electronic component having a plurality of electrical contacts is mounted; a plurality of first bond pads formed on the other side of the first insulation layer in prede... | 01/31/2012 |
| 8101871 | Aluminum bond pads with enhanced wire bond stability An electronic device bond pad includes an Al layer located over an electronic device substrate. The Al layer includes an intrinsic group 10 metal located therein. ... | 01/24/2012 |
| 8089005 | Wiring structure of a substrate A wiring structure of a substrate adapted to mount a plurality of integrated circuits has a signal wire for connecting the integrated circuits to each other, first and second power supply layers faced to each other, and return path wires arranged generally in parall... | 01/03/2012 |
| 8084694 | Electrical contact device An electrical contact device comprising a first contact assemblage having multiple contact pads disposed in a row which are allocated to different connection types, and having a second contact assemblage having multiple contact pads disposed in a row in accordance w... | 12/27/2011 |
| 8080740 | Printed circuit board and method of manufacturing the same A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A ground layer is formed on the second insul... | 12/20/2011 |
| 8080739 | Signal connecting component A signal connecting component is suitable to be disposed on a circuit board. The signal connecting component includes an insulation element, at least a first bridge line, at least a second bridge line, a plurality of first pins and a plurality of second pins. The fi... | 12/20/2011 |
| 8076588 | Multilayer wiring board A multilayer wiring board having a structure in which wiring layers 12A to 12D and insulating layers 11A to 11C are alternately arranged, and in which one or plural kinds of wirings selected from a group of a signal wiring 25 havin... | 12/13/2011 |
| 8063314 | Pin definition layout of electronic paper display screen A pin definition layout of electronic paper display screen is provided. The electronic paper has a first pin area, a data signal source driver area, and a second pin area sequentially disposed at any side thereof. The first pin area and the second pin area each have... | 11/22/2011 |
| 8053678 | Interconnection, electronic device and method for manufacturing an electronic device An interconnection includes a bundle of conductive members, each of the conductive members being made of carbon nanotube having an end connected to a first conductive film, and another end connected to a second conductive film separated from the first conductive fil... | 11/08/2011 |
| 8053680 | Wiring board having efficiently arranged pads A wiring board includes a plate-shaped resin member; chip connection pads provided in the resin member, the chip connection pads having connection surfaces electrically connected to electrode pads provided on a semiconductor chip, the connection surfaces being situa... | 11/08/2011 |
| 8053679 | Printed circuit board An exemplary printed circuit board includes a substrate, a differential transmission line, and at least two weld pad pairs. The differential transmission line and the at least two weld pad pairs are disposed on the substrate. The differential transmission line inclu... | 11/08/2011 |
| 8035037 | Core substrate and method of producing the same The core substrate is capable of securely preventing short circuit between an electrically conductive core section and a plated through-hole section. The core substrate comprises: an electrically conductive core section having a pilot hole, through which a plated th... | 10/11/2011 |
| 8030578 | Electronic component and substrate unit The present invention is an electrode 10 so provided as to be soldered to an electronic component 12 and, when the electronic component 12 is mounted on a substrate 13, soldered to the substrate 13. The electrode 10 includes... | 10/04/2011 |
| 7999191 | Method for making cable with a conductive bump array, and method for connecting the cable to a task object A cable with conductive bumps is fabricated by forming a photoresist layer with multiple openings on a cable substrate, coating a conductive layer on the photoresist layer whereby the conductive layer in the openings forms the bumps at circuits on the cable substrat... | 08/16/2011 |
| 7985928 | Gap free anchored conductor and dielectric structure and method for fabrication thereof A microelectronic structure and a method for fabricating the microelectronic structure use a dielectric layer that is located and formed upon a first conductor layer. An aperture is located through the dielectric layer. The aperture penetrates vertically into the fi... | 07/26/2011 |
| 7973247 | Connecting portion of circuit board and circuit board-connecting structure technical field In a circuit board-connecting portion 10, a first connecting portion 15 and a second connecting portion 20 are disposed in facing relation such that first conductors 14 contact second conductors 19, and also a first substrate 12... | 07/05/2011 |
| 7973246 | Electronic component The invention is to provide an electronic component which can obtain the capacitance value of a capacitor element highly precisely. An electronic component has a lower conductor (first conductor) which is formed on a planarized layer of a substrate, a dielectric fil... | 07/05/2011 |
| 7968801 | Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure The camera module structure (10) of the present invention is arranged such that a board electrode (2) of a printed board (1) and a mounting electrode (4) of a camera module (3) mounted on the printed board (1) are joined wit... | 06/28/2011 |
| 7947909 | Substrate panel A substrate panel is disclosed. The substrate panel may include a pair of clamp contacts, a plurality of bus lines located between the pair of clamp contacts, and a plurality of substrate units supplied with an electric current by way of the plurality of bus lines, ... | 05/24/2011 |
| 7943860 | Material board for producing hybrid circuit board with metallic terminal plate and method for producing hybrid circuit board A material board for producing a hybrid circuit board includes a plurality of hybrid circuit board sections 1 on each of which an electronic component 2 is mounted and a metallic terminal plate 3 for external connection is bonded so as to projec... | 05/17/2011 |
