Bizarre Patents
Behavior Modification Wristwatch
A wristwatch including a watch band and a watch body having an octagon shaped perimeter and being red in color and having the word STOP thereon to resemble a stop sign.
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| Number | Title | Issue Date |
| 7362586 | Electronic component with shielding case and method of manufacturing the same Shielding cases each include a pair of opposed first surfaces with catching pieces protruding therefrom and a pair of second surfaces without catching pieces. A motherboard forms substrates each including a pair of opposed first side surfaces with catching grooves a... | 04/22/2008 |
| 7361844 | Power converter package and thermal management Power conversion apparatus includes a circuit board with power conversion circuitry and a package having an upper portion and a lower portion that respectively enclose circuitry on a top surface and a bottom surface of the circuit board. The lower portion encloses a... | 04/22/2008 |
| 7361845 | Wiring line for high frequency Wiring lines for use at a high frequency having reduced resistance and/or inductance are disclosed that may be readily manufactured in a semiconductor integrated circuit. Wiring lines can include extension lines (2), connected to both ends of an inductor (... | 04/22/2008 |
| 7361846 | High electrical performance semiconductor package A high electrical performance semiconductor package is proposed. A carrier is provided having a first surface, an opposite second surface, and conductive vias for electrically connecting the first surface to the second surface. A chip is attached to the first surfac... | 04/22/2008 |
| 7358619 | Tape carrier for TAB A striped tape carrier for TAB includes a plurality of mounting parts. In the respective mounting parts, wiring patterns to bond electrodes of electronic components are formed. Each of exposure regions includes a predetermined number of mounting parts. On both sides... | 04/15/2008 |
| 7358445 | Circuit substrate and apparatus including the circuit substrate The present invention provides a circuit substrate which has a substrate including a first surface and a second surface opposite to the first surface. A first and a second conductor patterns are formed on the first and the second surface respectively. The second sur... | 04/15/2008 |
| 7358617 | Bond pad for ball grid array package A device (100) and a method (200) for controlling resin bleed, the device comprising a substrate (105) having a surface (107), an integrated circuit (115) having a plurality of leads (120) extending therefrom, and an adhesiv... | 04/15/2008 |
| 7358446 | Power distribution system A power distribution system comprises a flexible power connector, a printed circuit board, a power supply, and a processor mounted on the printed circuit board. The flexible power connector comprises a first end electrically connected to the processor and a second e... | 04/15/2008 |
| 7356916 | Circuit-formed substrate and method of manufacturing circuit-formed substrate A circuit board with reliable electrical connections is provided. An insulated board material, having connections for connecting a layer to another layer, includes a reinforcing member. A thickness of the entire insulated board material is at least equal to and not ... | 04/15/2008 |
| 7357294 | Method for mounting a semiconductor package onto PCB A method for mounting a semiconductor package onto PCB includes a semiconductor package comprising a plurality of outer terminals exposed out of an encapsulant. A PCB having a surface with a plurality of contact pads is provided. Each contact pad has a first exposed... | 04/15/2008 |
| 7357644 | Connector having staggered contact architecture for enhanced working range An architecture for increasing the normalized working range of connectors having arrays of small contacts. One configuration includes a plurality of pairs of opposed contacts that are arranged in a staggered fashion. The opposed contacts are configured to engage an ... | 04/15/2008 |
| 7356782 | Voltage reference signal circuit layout inside multi-layered substrate A multi-layered substrate has a voltage reference signal circuit layout therein. A major change in the design of the multi-layered substrate is the moving of a reference signal trace from a signal layer to a non-signaling layer. Once the reference signal trace is mo... | 04/08/2008 |
| 7355127 | Printed wiring board and electronic device using the same The present invention provides a printed wiring board which has high insulation resistance between wirings and is unlikely to cause failures such as leakages or short circuits, attributable to ion migration even in high temperatures and highly humid environments. Th... | 04/08/2008 |
| 7355125 | Printed circuit board and chip module The present invention relates to computer hardware design and in particular to a printed circuit board comprising wiring dedicated to supply electric board components such as integrated circuits with at least three different reference planes. In order to provide a p... | 04/08/2008 |
| 7355863 | High frequency multilayer integrated circuit A high frequency multilayer integrated circuit is provided with: a multilayer board including n earth conductor layers (n: integer of two or more than two) and (n-1) dielectric layers each arranged between adjacent earth conductor layers; a first high frequency circ... | 04/08/2008 |
| 7355126 | Electronic parts packaging method and electronic parts package An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutua... | 04/08/2008 |
| 7350293 | Low profile ball-grid array package for high power A low-profile, high power ball grid array, or land grid array, device including a plastic tape having first and second surfaces, a portion of the first surface covered with an adhesive layer. First and second openings are stamped through the tape and adhesive layer,... | 04/01/2008 |
| 7350296 | Method of fabricating a printed circuit board including an embedded passive component Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating l... | 04/01/2008 |
| 7351068 | Semiconductor device A semiconductor device includes a first plate member having a circuit surface on which a circuit is provided, a second plate member having a circuit surface on which a circuit is provided, a plurality of first flat plates disposed on the circuit surface of the first... | 04/01/2008 |
| 7351916 | Thin circuit board A thin circuit board includes a dielectric layer with at least one cavity formed on a surface thereof; a metal pad formed in the cavity; at least one circuit layer formed on another surface of the dielectric layer; and a plurality of conductive vias formed in the di... | 04/01/2008 |
| 7351660 | Process for producing high performance interconnects A method for fabricating high performance vertical and horizontal electrical connections in a three dimensional semiconductor structure. A dielectric film is imprinted with a stamp pattern at high vacuum and with precise temperature and stamping pressure control. Th... | 04/01/2008 |
| 7352060 | Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate A multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring structure is disclosed. The multilayer wiring substrate includes a dielectric layer including a resin material mixed with an inorganic filler, wherein the inorganic filler i... | 04/01/2008 |
| 7352427 | Display device A display device which provides reliable connection between a semiconductor device and a printed circuit board includes a display panel, a printed circuit board disposed close to the display panel, and a semiconductor device of a film carrier type which is disposed ... | 04/01/2008 |
| 7351915 | Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same A printed circuit board (PCB) having at least one embedded capacitor and a method of fabricating the same is provided. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric c... | 04/01/2008 |
| 7352069 | Electronic component unit An object of the present invention is to provide an electronic part device which can be repaired even in the case of an electronic part device having a malfunction in electrical connection after carrying out underfill. The present invention is an electronic p... | 04/01/2008 |
| 7348496 | Circuit board with organic dielectric layer Embodiments of the present invention include forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate, using an electrocoating process to reduce loop inductance between the conductive la... | 03/25/2008 |
| 7349223 | Enhanced compliant probe card systems having improved planarity Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more ... | 03/25/2008 |
| 7348497 | Mounting structure for electronic components A mounting structure for electronic components is provided with a circuit board that has a step portion formed at one end portion thereof. The step portion is sandwiched by a lead of the electronic component so as to secure the lead to the step portion. The step por... | 03/25/2008 |
| 7348495 | Uniform force hydrostatic bolster plate A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on a substrate. A second embodiment of the invention involves a method t... | 03/25/2008 |
| 7349224 | Semiconductor device and printed circuit board For a multi-terminal semiconductor package, such as a BGA or a CSP, that handles high-speed differential signals, a high-speed signal is assigned to the innermost located electrode pad on an interposer substrate, and the electrode pad is connected to the outermost l... | 03/25/2008 |
| 7346982 | Method of fabricating printed circuit board having thin core layer A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed after t... | 03/25/2008 |
| 7348183 | Self-contained microelectrochemical bioassay platforms and methods Methods and devices for improved chemical and biomass detection assays combined well defined microstructures having independently addressable electrodes with various surface immobilization electrochemical assays. Combining known chemical detection immobilization ass... | 03/25/2008 |
| 7348494 | Signal layer interconnects Inner layer traces on a multilayer printed wiring board are exposed to enable direct interconnection with another device such as a printed wiring board. The traces may be exposed by removing at least some of the dielectric substrate material around the traces, or by... | 03/25/2008 |
| 7348493 | Metal-ceramic circuit board A metal-ceramic circuit board is characterized by being constituted by bonding directly on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal member of an electronic circuit. The base plate has a proof stres... | 03/25/2008 |
| 7345246 | Wiring board and capacitor to be built into wiring board An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the sub-core portion is housed. A first terminal array of the board core has an... | 03/18/2008 |
| 7345245 | Robust high density substrate design for thermal cycling reliability A semiconductor package for a die with improved thermal cycling reliability. A first layer of the package provides ball pads dispersed throughout. A second layer of the package provides signal traces. A high stress area associated with the corner of the dies is defi... | 03/18/2008 |
| 7342179 | Electronic device and method for producing the same An electronic device includes a plurality of components, nanoparticles to bond the components, and a receiving layer for holding the nanoparticles, the receiving layer being disposed on at least one of the bonded components. The electronic device may further include... | 03/11/2008 |
| 7342180 | Flexible printed circuit and liquid crystal display device using same An exemplary liquid crystal display device (200) includes a liquid crystal display panel (21), and a flexible printed circuit (2) joined to the liquid crystal display panel. The flexible printed circuit includes a substrate (20). The subs... | 03/11/2008 |
| 7342181 | Maximizing capacitance per unit area while minimizing signal transmission delay in PCB A printed circuit board (PCB) is provided that maximizes compensation capacitance per unit area of the PCB while minimizing signal transmission delays in the PCB. The PCB includes a first section having a first dielectric constant (DK), a second section having a sec... | 03/11/2008 |
| 7342802 | Multilayer wiring board for an electronic device To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an interlayer insulating film allows for interlayer connection between plural wiring films insulated from one another with plural interlayer insulating layers.... | 03/11/2008 |
