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| Number | Title | Issue Date |
| 8183465 | Component built-in wiring substrate and manufacturing method thereof A component built-in wiring substrate (10) which includes: a core substrate (11); a plate-shaped component (101); a resin filling portion (92); and a wiring stacking portion (31), wherein, when viewed from the core principal surfac... | 05/22/2012 |
| 8183464 | Substrate pad structure A substrate pad structure for connecting a lead connecting portion of an electronic device to a substrate is disclosed. The substrate pad structure includes a first pad portion and a second pad portion that are arranged on the substrate at corresponding positions of... | 05/22/2012 |
| 8168893 | Multilayer wiring board with concave portion for accomodating electronic component A multilayer wiring board includes a multilayer wiring substrate having a concave portion which accommodates an electronic component. The multilayer wiring substrate has multiple insulation layers, multiple conductive circuits, multiple vias and an electromagnetic s... | 05/01/2012 |
| 8168894 | Light emitting diode (LED) circuit board with multi-directional electrical connection The present invention provides a light emitting diode (LED) circuit board with a multi-directional electrical connection. The board includes a board body with a surface and an assembly plane as well as four sides and corresponding corners, and a plurality of positiv... | 05/01/2012 |
| 8168895 | Printed wiring board Provided is a multilayer printed wiring board in which multiple via holes that connect a first power supply wiring with a second power supply wiring are aligned in a line in parallel to a direction along which current flows. In order to prevent current from being co... | 05/01/2012 |
| 8158888 | Circuit substrate and method of fabricating the same and chip package structure A circuit substrate suitable for being connected to at least one solder ball is provided. The circuit substrate includes a substrate, at least one bonding pad, and a solder mask. The substrate has a surface. The bonding pad is disposed on the surface of the substrat... | 04/17/2012 |
| 8148645 | Wiring substrate and method of manufacturing the same A wiring substrate and method of forming a wiring substrate. The wiring substrate includes a base substrate, a first resin insulating layer provided on the base substrate and a laminated capacitor formed within the first resin insulating layer. The laminated capacit... | 04/03/2012 |
| 8143531 | Electronic component mounting package An electronic component mounting package includes a structure (coreless substrate) in which a plurality of wiring layers are stacked one on top of another with insulating layers interposed therebetween and are interconnected through via holes formed in the insulatin... | 03/27/2012 |
| 8143532 | Barrier layer to prevent conductive anodic filaments A through hole is formed in a circuit board that has fibers dispersed in a polymer matrix. Copper is sputtered within the through hole to form a sufficiently conductive layer for electrolytic plating over the sputtered copper layer. ... | 03/27/2012 |
| 8134083 | Circuit carrier A circuit carrier having a metal support layer, at least some portions of which are covered by a dielectric layer, the dielectric layer having a plurality of pores, with the pores being sealed by glass at least on the opposite side of the dielectric layer to the sup... | 03/13/2012 |
| 8129625 | Multilayer printed wiring board In a core substrate 30, a ground through hole 36E and a power through hole 36P are disposed in the grid formation, so that electromotive force induced in X direction and Y direction cancel out each other. As a result, even if mutual inductance i... | 03/06/2012 |
| 8129627 | Circuit board having semiconductor chip A circuit board includes a semiconductor chip having an upper surface and side surfaces connected to the upper surface. A bonding pad is disposed on the upper surface of the semiconductor chip. A bump is disposed on the bonding pad and projects from the bonding pad ... | 03/06/2012 |
| 8129626 | Multilayer wiring substrate with a reinforcing layer for preventing a warp A multilayer wiring substrate having no core substrate is provided. The multilayer wiring substrate includes: a laminated body includes: a plurality of insulating layers; and a plurality of wiring layers. The laminated body has: a mounting surface on which a semicon... | 03/06/2012 |
| 8124881 | Printed board and portable electronic device which uses this printed board A printed board comprising a packaging surface on which an electronic component is packaged, an adhesion prohibited portion which is provided at a region of the printed board different from a region where the electronic component is provided, and to which adhesion o... | 02/28/2012 |
| 8124883 | Ceramic multilayer substrate and method for manufacturing the same In a method for manufacturing a ceramic multilayer substrate, when a green ceramic stack prepared by stacking a plurality of ceramic green sheets is fired simultaneously with a ceramic chip electronic component disposed inside the green ceramic stack and including a... | 02/28/2012 |
| 8124882 | Multilayer printed wiring board A multilayer printed wiring board 10 includes: a mounting portion 60 on the top surface of which is mounted a semiconductor element that is electrically connected to a wiring pattern 32, etc.; and a capacitor portion 40 having a high diel... | 02/28/2012 |
| 8119926 | Terminal assembly with regions of differing solderability An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes an electrically conductive terminal including a first end and a second end oppos... | 02/21/2012 |
| 8119927 | Wiring board, method for manufacturing the same, and semiconductor package In a wiring board, a plurality of wiring layers and a plurality of insulating layers are alternately stacked. The wiring layers are electrically connected to one another through via holes formed in the insulating layers. The wiring board includes: a connection pad w... | 02/21/2012 |
| 8115106 | Surface mount device The disclosed subject matter includes a surface mount electronic device with high reliability and favorable optical characteristics. The surface mount electronic device can include a circuit board with at least one conductor pattern formed on an insulating board and... | 02/14/2012 |
| 8110749 | Printed wiring board Large-sized through holes are formed in a core layer of a printed wiring board. Large-sized vias are formed in the shape of a cylinder along the inward wall surfaces of the large-sized through holes located within a specific area. A filling material fills the inner ... | 02/07/2012 |
| 8110750 | Multilayer printed wiring board A multilayer printed wiring board has a core substrate, an interlayer insulation layer formed over the core substrate, conductive layers formed over the core substrate, and a via hole for providing electrical connection between the conductive layers. The conductive ... | 02/07/2012 |
| 8106307 | Substrate structure and electronic apparatus A substrate structure capable of miniaturizing and thinning a housing of a portable terminal is provided. A substrate structure 10 comprises a substrate 11, plural electronic components 12 mounted along one mounting surface 11A in ... | 01/31/2012 |
| 8101870 | Method for manufacturing printed circuit board, printed circuit board, and electronic apparatus A method for manufacturing a printed circuit board. The method includes: preparing a printed wiring board, the printed wiring board comprising through holes and a plurality of electrode pads; coating surfaces of the plurality of electrode pads and surfaces of the th... | 01/24/2012 |
| 8101868 | Multilayered printed circuit board and method for manufacturing the same A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating lay... | 01/24/2012 |
| 8101869 | Mounting structure, electro-optical device, and electronic apparatus A mounting structure includes a member to be bonded, a flexible base, a reinforcing portion, and a bonding member. The flexible base includes a plurality of first leads. The reinforcing portion is arranged between an edge of the flexible base and an outer lead of th... | 01/24/2012 |
| 8097814 | Printed circuit board and method of manufacturing the same A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer is formed in the periphery of the mounting region so a... | 01/17/2012 |
| 8089004 | Semiconductor device including wiring excellent in impedance matching, and method for designing the same A semiconductor device includes an interposer, and a semiconductor chip mounted on the interposer. In a plan view, the interposer includes a first region overlapping the semiconductor chip, and a second region excluding the first region. The interposer includes at l... | 01/03/2012 |
| 8084693 | Component with bonding adhesive A device comprising a component and an adhesive attached to at least one exterior portion of the component. When the component is on a printed circuit and passed through a reflow operation, the adhesive melts forming a physical bond between the component and the pri... | 12/27/2011 |
| 8080738 | Printed circuit having ground vias between signal vias A printed circuit includes a substrate having a pair of opposite sides. A signal via extends through at least one of the sides and at least partially through the substrate between the sides. Aggressor vias extend through at least one of the sides and at least partia... | 12/20/2011 |
| 8079011 | Printed circuit boards having pads for solder balls and methods for the implementation thereof A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after... | 12/13/2011 |
| 8067699 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board An intermediate layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit b... | 11/29/2011 |
| 8063313 | Printed circuit board and semiconductor package including the same A printed circuit board (PCB) and a semiconductor package that are configured to prevent delamination and voids. In one example embodiment, the semiconductor package includes a PCB having a base substrate on which conductive patterns are formed and which includes an... | 11/22/2011 |
| 8053677 | Electronic apparatus and method of manufacturing the same, and wiring substrate and method of manufacturing the same An electronic apparatus includes a multilayer wiring structure having insulating layers and wiring layers which are stacked and having a surface on which an electronic component is mounted, a dipole antenna formed on a surface 13A of the multilayer wiring str... | 11/08/2011 |
| 8049117 | Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A fir... | 11/01/2011 |
| 8049115 | Printed circuit board and light sensing device using the same A printed circuit board (PCB) adapted for mounting different kinds of light sensing modules thereon includes a lighting sensing area and a plurality of pads. The pads are disposed around the lighting sensing area, for configuring one light sensing module thereon. In... | 11/01/2011 |
| 8049116 | Circuit substrate and method for fabricating inductive circuit A circuit substrate including a laminated layer, an embedded electronic device, at least a circuit structure, and a solder mask layer is provided. The embedded electronic device is disposed within the laminated layer. The circuit structure is disposed on a surface o... | 11/01/2011 |
| 8044305 | Circuit board including hybrid via structures A circuit board may include hybrid via structures configured to connect to components, such as connectors and electronic components, mounted on the circuit board. A hybrid via structure may include one or more micro-vias configured to provide an electrical connectio... | 10/25/2011 |
| 8039757 | Electronic part mounting substrate and method for producing same An electronic part mounting substrate has a ceramic substrate, a metal member bonded to one side of the ceramic substrate, a metal plate of aluminum or an aluminum alloy, one side of the metal plate being bonded directly to the other side of the ceramic substrate, a... | 10/18/2011 |
| 8039759 | Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A fir... | 10/18/2011 |
| 8039756 | Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same A multilayered wiring board has electrodes disposed on a first surface and a second surface, alternately layered insulation layers and wiring layers, and vias that are disposed in the insulation layer and electrically connect the wiring layers. The second electrode ... | 10/18/2011 |
