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"What, sir, would you make a ship sail against the wind and currents by lighting a bonfire under her deck? I pray you, excuse me, I have not the time to listen to such nonsense."
Napoleon Bonaparte ; When told of the Robert Fulton steamboat
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| Number | Title | Issue Date |
| 8178788 | Electronic component package An electronic component package includes a film board where an electronic component is mounted, and a lid part mounted on the film board so as to cover a surface of the film board. The electronic component is provided in a cavity formed by the film board and the lid... | 05/15/2012 |
| 8158887 | Adhesive film, connecting method, and joined structure An adhesive film including a first adhesive layer containing a first main resin component and dispersed conductive particles, and a second adhesive layer containing a second main resin component and adhering to the first adhesive layer, each of the adhesive layers c... | 04/17/2012 |
| 7964801 | Circuit board structure and fabrication method thereof A circuit board structure and fabrication method thereof are disclosed, including: a circuit board with a circuit layer thereon; a reactant formed on the surface of the circuit layer, wherein the reactant is an organic metallic polymer having a polymer end and a met... | 06/21/2011 |
| 7875807 | Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a res... | 01/25/2011 |
| 7834275 | Secure electronic entity such as a passport A secure electronic entity comprising a support and a microcircuit having an active surface which is at least partially covered by a resin, wherein at least one distinct element masks the active surface in an at least partial manner, characterized in that the elemen... | 11/16/2010 |
| 7754976 | Compact circuit carrier package A circuit carrier assembly includes a plurality of substrates directly secured together by an electrically conductive securing substance. In one example, the securing substance is a conductive epoxy. In another example, the electrically conductive securing substance... | 07/13/2010 |
| 7645942 | Electrical interconnect with maximized electrical contact An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one ele... | 01/12/2010 |
| 7601920 | Surface mount composite electronic component and method for manufacturing same The present invention provides a surface mount composite electronic component which can be made compact. The structure of the surface mount composite electronic component is one in which a circuit element is formed on each of a set of opposing surfaces of an insulat... | 10/13/2009 |
| 7544898 | Multilayer wiring board, touch panel and manufacturing method of the same Providing a method for manufacturing a multilayer wiring board and a touch panel, which does not cause decreasing of yields, reliabilities and productivities even though the materials of each board to be stacked are different, and which manufactures the multilayer w... | 06/09/2009 |
| 7501584 | Circuit board device and method for board-to-board connection A structure for connecting substrates to each other, which is capable of thinning an electronic device on which a plurality of circuit boards is mounted, saving a space of the electronic device, and detaching a circuit board from the electronic device. The circuit b... | 03/10/2009 |
| 7436681 | Wiring board with built-in capacitor The invention provides a wiring board with built-in capacitors, that has a multilayer wiring structure and capable of mounting an IC chip thereon. The wiring board with built-in capacitors includes: a first capacitor that is built into the multilayer wiring structur... | 10/14/2008 |
| 7433201 | Oriented connections for leadless and leaded packages The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating such devices, and substrates and/or PCBs, especially if such assemblies ... | 10/07/2008 |
| 7421777 | Method of manufacturing multilayer wiring substrate using temporary metal support layer The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further redu... | 09/09/2008 |
| 7420127 | Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further redu... | 09/02/2008 |
| 7400512 | Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor. The ... | 07/15/2008 |
| 7400515 | Circuit board electrode connection structure An electrode connection structure between outer lead(s) of TCP(s), being first circuit board(s), and actuator member electrode(s) for connection to external circuitry, being second circuit board(s); actuator member(s) electrode(s) for connection to external circuitr... | 07/15/2008 |
| 7397672 | Flip chip mounting substrate The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line formed on one surface of a base sheet, wherein the plural mounting pads... | 07/08/2008 |
| 7396591 | Wiring substrate In a wiring substrate having a metal wiring pattern that is formed on a substrate and includes a contact portion for providing connection to an external element, an organic thin film containing silane is formed to cover the metal wiring pattern and the contact porti... | 07/08/2008 |
| 7384683 | Substrate for flexible printed wiring board and method for manufacturing the same The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a ... | 06/10/2008 |
| 7370412 | Method for connecting electronic device An electronic device connecting method according to a first aspect of the present invention includes: mounting an electronic device having at least one electrode portion on a sheet-like porous member having a hole therein so that the electrode portion is close to th... | 05/13/2008 |
| 7370411 | Wiring board manufacturing method A method of manufacturing a wiring board includes: forming a first insulating layer on a supporting board; mounting at least one reinforcing member on the first insulating layer; mounting at least one semiconductor chip on the first insulating layer; forming a secon... | 05/13/2008 |
| 7361843 | AC coupling of power plane sections using improved capacitance stitching material An information handling system has a printed circuit board with a split power plane having a plurality of sections that may be used for distributing different voltages on a single conductive foil layer of the printed circuit board to components on the printed circui... | 04/22/2008 |
| 7358445 | Circuit substrate and apparatus including the circuit substrate The present invention provides a circuit substrate which has a substrate including a first surface and a second surface opposite to the first surface. A first and a second conductor patterns are formed on the first and the second surface respectively. The second sur... | 04/15/2008 |
| 7355126 | Electronic parts packaging method and electronic parts package An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutua... | 04/08/2008 |
| 7351353 | Method for roughening copper surfaces for bonding to substrates The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened... | 04/01/2008 |
| 7352052 | Semiconductor device and manufacturing method therefor There is disclosed a semiconductor device comprising at least one semiconductor element, one chip mounting base being provided at least one first interconnection on one major surface thereof and at least one second interconnection on the other major surface thereof,... | 04/01/2008 |
| 7348493 | Metal-ceramic circuit board A metal-ceramic circuit board is characterized by being constituted by bonding directly on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal member of an electronic circuit. The base plate has a proof stres... | 03/25/2008 |
| 7347950 | Rigid flexible printed circuit board and method of fabricating same A rigid flexible printed circuit board (PCB) and a method of fabricating the same. Since a polyimide copper clad laminate is not used during the fabrication of the rigid flexible PCB, an increase in cost resulting from use of the polyimide copper clad laminate and p... | 03/25/2008 |
| 7348492 | Flexible wiring board and electrical device using the same A flexible wiring board is obtained as follows. A copper foil pattern is formed on the both surfaces of a base polymer film made of polyimide, etc. The copper foil pattern of the both sides, except for an end portion of the copper foil pattern of one surface, is cov... | 03/25/2008 |
| 7342177 | Wiring board, electro-optical device and electronic instrument A wiring board includes a substrate, an interconnect layer formed of a plurality of layers formed over the substrate, and a plurality of electrodes formed to overlap the interconnect layer. An interconnecting pattern positioned in one of the plurality of layers form... | 03/11/2008 |
| 7341642 | Manufacturing method for electric device The present invention provides a method of manufacturing an electric device, wherein an adhesive applied on a flexible wiring board is heated to a first temperature to lower its viscosity to a sufficient level, after which a semiconductor chip is placed onto the adh... | 03/11/2008 |
| 7339791 | CVD diamond enhanced microprocessor cooling system Cooling systems for microprocessors are addressed. Some systems may include a chemical vapor deposited (CVD) diamond heatspreader mounted to a base of a heat sink and to a microprocessor chip, while others may include a copper insert mounted within a depression of a... | 03/04/2008 |
| 7332212 | Circuitized substrate with conductive polymer and seed material adhesion layer A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating... | 02/19/2008 |
| 7331106 | Underfill method A process for selectively depositing a filled underfill material onto a die surface without covering solder bumps present on the die. The process entails microjetting a polymer matrix material, a filler material, and optionally a fluxing material onto the die surfac... | 02/19/2008 |
| 7326316 | Electrical interconnect using locally conductive adhesive An anisotropic electrically conducting interconnect is disclosed in which an adhesive comprising particles having a breakable coating of at feast one electrically nonconductive material is compressed between a first contact and a second contact. Compression to two c... | 02/05/2008 |
| 7319599 | Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor. The ... | 01/15/2008 |
| 7310236 | Electronic device A casing that has an electronic component housed therein has a conductive layer made of a mixture of carbon fibers and a thermoplastic resin and an insulating layer where only the thermoplastic resin is exposed on a surface of the conductive layer. The casing preven... | 12/18/2007 |
| 7303639 | Method for producing Z-axis interconnection assembly of printed wiring board elements A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to th... | 12/04/2007 |
| 7297875 | Fusion bonded assembly with attached leads A signal processing module can be manufactured from a plurality of composite substrate layers, each substrate layer includes elements of multiple individual processing modules. Surfaces of the layers are selectively metalicized to form signal processing elements whe... | 11/20/2007 |
| 7295027 | Semiconductor device socket and semiconductor device connecting method using anisotropic conductive sheet A semiconductor device socket, in which a semiconductor device is installed, includes a support member on which a substrate is placed, an anisotropic conductive sheet that acts as an intermediary in electric connection between the substrate and the semiconductor dev... | 11/13/2007 |
