Bizarre Patents
Dining Table Having Integral Dishwasher
A space-saving dishwasher, which may be installed within a counter top or table, having a dish-carrying rack that is vertically shiftable through the open top of the dishwasher for facilitating loading and unloading of the dishes.
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| Number | Title | Issue Date |
| 8173906 | Environmental protection coating system and method According to one embodiment of the disclosure, an environmental protection coating comprises a circuit assembly having a first protective dielectric layer and a second dielectric layer. The circuit assembly has an outer surface on which a plurality of discrete elect... | 05/08/2012 |
| 8168891 | Differential trace profile for printed circuit boards Circuit boards and methods for their manufacture are disclosed. The circuit boards carry high-speed signals using conductors formed to include lengthwise channels. The channels increase the surface area of the conductors, and therefore enhance the ability of the con... | 05/01/2012 |
| 8168892 | Soldermask-less printed wiring board A printed wiring board has a non-conducting substrate with first and second major outboard surfaces; printed electrical conductors over at least the first major outboard surface; and an electrically insulating coating selectively disposed over the printed electrical... | 05/01/2012 |
| 8153904 | Substrate panel including insulation parts and bus line A substrate panel is disclosed. The substrate panel may include a clamp contact, a bus line formed at a distance from the clamp contact, and a plurality of substrate units supplied with an electric current by way of the bus line, where an insulation part may be form... | 04/10/2012 |
| 8119924 | Wiring board, packaging board and electronic device Stress concentration at the connecting portion of the electronic component and the curved board and the area around the connecting portion is suppressed. In a flexible wiring board, insulation layers (11, 13) and wiring layers (12, 15) are piled up alt... | 02/21/2012 |
| 8119923 | Circuit board A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature... | 02/21/2012 |
| 8119925 | Core substrate and printed wiring board The core layer of a core substrate is made of carbon fibers impregnated with resin. When the temperature of the core layer increases, the core layer suffers from an increase in the thickness because of thermal expansion of the resin. The core layer is sandwiched bet... | 02/21/2012 |
| 8115105 | Prepreg and its application products for low thermal expansion and low dielectric tangent A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the ther... | 02/14/2012 |
| 8106306 | Ceramic multi-layer circuit substrate and manufacturing method thereof Provided is a method of manufacturing a ceramic multi-layer circuit substrate. A plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other, are formed and are then fired. The fired ceramic blo... | 01/31/2012 |
| 8093505 | Layered electronic circuit device Provided is a layered electronic circuit device capable of realizing high-density/high-function mounting, easily inspecting and repairing the respective constituent elements, and improving the electronic connection characteristic. The layered electronic circuit devi... | 01/10/2012 |
| 8058565 | Wiring board, semiconductor device, and method for manufacturing wiring board In a semiconductor device (1), a package board (2) is provided in which a plurality of wiring layers are layered, a plurality of mounting pads (5) arranged in a matrix are provided to the uppermost wiring layer of the package board (2), a... | 11/15/2011 |
| 8044304 | Multilayer printed circuit board A multilayer printed circuit board is characterized in that circuit boards 1 and 2 and a circuit board 3 are laminated alternately to form a multilayer body using a simultaneous lamination method, the circuit boards 1 and 2 includi... | 10/25/2011 |
| 8026450 | Multi-dielectric material circuit board supporting high-speed and low-speed signaling A circuit board comprises a center segment distributing power and low-speed signaling, and outer segments for high-speed signaling. The segments use dielectric materials with different dielectric constants, with the outer segments supporting higher-speed signal tran... | 09/27/2011 |
| 7968800 | Passive component incorporating interposer A passive component incorporating interposer includes a double-sided circuit board (1) having a wiring layer (8) on both sides, a passive component (2) mounted on the wiring layer (8) on one surface of the double-sided circuit board (1... | 06/28/2011 |
| 7902463 | Printed wiring board and method of manufacturing the same A printed wiring board includes an insulation layer having a surface, electrodes embedded in the insulation layer, a resistor formed on the surface of the insulation layer and electrically connected to the electrodes, and an external connection conductive pattern fo... | 03/08/2011 |
| 7655871 | Resin composition, resin-attached metal foil, base material-attached insulating sheet and multiple-layered printed wiring board A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition ... | 02/02/2010 |
| 7566834 | Wiring board and semiconductor package using the same A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. T... | 07/28/2009 |
| 7547849 | Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto A light-activatable polymer composition and polymer composite includes a polymer binder selected from epoxy resins, silica filled epoxy, bismaleimide resins, bismaleimide triazines, fluoropolymers, polyesters, polyphenylene oxide/polyphenylene ether resins, polybuta... | 06/16/2009 |
| 7459640 | NEXT high frequency improvement using hybrid substrates of two materials with different dielectric constant frequency slopes A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes PCB substrates made of materials having ... | 12/02/2008 |
| 7439451 | Tape carrier Only individual piece-like flexible wiring boards produced separately and judged to be non-defective products in an inspection step in advance are mounted at regular intervals on a carrying support film to thereby obtain a TAB tape carrier. According to this method,... | 10/21/2008 |
| 7425683 | Flexible wiring base material and process for producing the same The present invention provides a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating with tin-bismuth alloy, of a solder resist layer. The invention also pr... | 09/16/2008 |
| 7420129 | Semiconductor package including a semiconductor device, and method of manufacturing the same A method and apparatus of manufacturing a semiconductor device and the semiconductor device used in a semiconductor package are disclosed. The semiconductor device may include a main body having one or more supporting layers, a plurality of metal wires that may be f... | 09/02/2008 |
| 7397000 | Wiring board and semiconductor package using the same A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. T... | 07/08/2008 |
| 7384683 | Substrate for flexible printed wiring board and method for manufacturing the same The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a ... | 06/10/2008 |
| 7385143 | Thermal bonding structure and manufacture process of flexible printed circuit board A thermal bonding structure and manufacture process of a flexible printed circuit (FPC) board are disclosed, and the thermal bonding structure includes a laminated structure having a first insulating layer with a solder pad area and showing parts of a first conducti... | 06/10/2008 |
| 7381903 | Printed circuit board and inspection method therefor It is an object of the present invention to provide a printed circuit board and an inspection method therefor capable of electrically inspecting misregistration of a solder resist and a display by silk printing with respect to a wiring pattern on a printed circuit b... | 06/03/2008 |
| 7378598 | Printed circuit board substrate and method for constructing same A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A signa... | 05/27/2008 |
| 7377032 | Process for producing a printed wiring board for mounting electronic components A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4 is connected with the wiring pattern and the other end portion... | 05/27/2008 |
| 7361843 | AC coupling of power plane sections using improved capacitance stitching material An information handling system has a printed circuit board with a split power plane having a plurality of sections that may be used for distributing different voltages on a single conductive foil layer of the printed circuit board to components on the printed circui... | 04/22/2008 |
| 7359213 | Circuit board A circuit board is formed by mounting at least one passive component on a first surface of a first laminate material; interconnecting the passive component to contact traces and vias of the first laminate material; and attaching a second laminate material to the fir... | 04/15/2008 |
| 7352061 | Flexible core for enhancement of package interconnect reliability An IC package is disclosed that comprises a core region disposed between upper and lower build-up layer regions. In one embodiment, the core region comprises a low modulus material. In an alternative embodiment the core region comprises a medium modulus material. In... | 04/01/2008 |
| 7349225 | Multifunctional composite sandwich element with embedded electronics A composite sandwich structure with embedded electronics, that in one embodiment includes two multilayered composite facesheet laminates, a central core, embedded electronic components within the central core region, embedded electrical conductors within the central... | 03/25/2008 |
| 7348045 | Controlled depth etched dielectric film A dielectric film for use as a substrate for a flexible circuit comprises a polymer selected from the group consisting of liquid crystal polymers and polyimide copolymers including carboxylic ester structural units in the polymeric backbone. The dielectric film has ... | 03/25/2008 |
| 7348494 | Signal layer interconnects Inner layer traces on a multilayer printed wiring board are exposed to enable direct interconnection with another device such as a printed wiring board. The traces may be exposed by removing at least some of the dielectric substrate material around the traces, or by... | 03/25/2008 |
| 7342181 | Maximizing capacitance per unit area while minimizing signal transmission delay in PCB A printed circuit board (PCB) is provided that maximizes compensation capacitance per unit area of the PCB while minimizing signal transmission delays in the PCB. The PCB includes a first section having a first dielectric constant (DK), a second section having a sec... | 03/11/2008 |
| 7342183 | Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same A circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sinter... | 03/11/2008 |
| 7342802 | Multilayer wiring board for an electronic device To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an interlayer insulating film allows for interlayer connection between plural wiring films insulated from one another with plural interlayer insulating layers.... | 03/11/2008 |
| 7336499 | Flexible printed wiring board An object of the present invention is to provide a flexible printed wiring board which relaxes stress concentration in the flexible printed wiring board during production steps, thereby preventing wire breakage in inner lead portions and cracking in solder resist wh... | 02/26/2008 |
| 7334324 | Method of manufacturing multilayer wiring board A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polya... | 02/26/2008 |
| 7332229 | Varnish, shaped item, electrical insulating film, laminate, flame retardant slurry and process for producing flame retardant particles and varnish The invention provides a varnish that contains an insulting resin, a curing agent, a flame retardant, and an organic solvent. The flame retardant comprises flame retardant particles surface treated with at least one surface treatment agent selected from the group co... | 02/19/2008 |
