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| Number | Title | Issue Date |
| 8183463 | Plating film, printed wiring board, and module substrate The present invention provides a plating film 50 including a nickel plating layer containing phosphorus and a gold plating layer formed on the nickel plating layer, wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %, and wherein (3×... | 05/22/2012 |
| 8173905 | Wiring structure and method for fabricating the same A wiring structure has a silicon layer, a backing layer provided on the silicon layer, the backing layer comprising a copper alloy containing a nickel, and a copper layer provided on the backing layer, and a diffusion barrier layer having an electrical conductivity,... | 05/08/2012 |
| 8168889 | Thermosetting conductive paste and multilayer ceramic part having an external electrode formed using the same Disclosed is a thermosetting conductive paste which is advantageous in that an external electrode for multilayer ceramic electronic part formed using the paste exhibits excellent bonding properties with an internal electrode and is suitable for mounting on a substra... | 05/01/2012 |
| 8168890 | Printed circuit board and component package having the same A printed circuit board, a component package that includes the printed circuit board, and a method of manufacturing the component package are disclosed. The printed circuit board, which may include an insulation layer, a pad formed over the insulation layer and wire... | 05/01/2012 |
| 8119922 | Dual cavity, high-heat dissipating printed wiring board assembly Two panel-sized fully populated printed wiring board assemblies formed together, with an anisotropic epoxy that provides electrical connection for RF signals and DC supplies without the need for wirebonds, mechanical interconnects or solder balls. ... | 02/21/2012 |
| 8110748 | Wiring, display device and method of manufacturing the same The present invention provides a wiring, a display device, and a method of manufacturing the same. A first metal diffusion-preventing layer is formed on a substrate or on a circuit element formed on the substrate. Then, a metal wiring layer is selectively formed on ... | 02/07/2012 |
| 8101866 | Packaging substrate with conductive structure A packaging substrate with conductive structure is provided, including a substrate body having at least one conductive pad on a surface thereof, a stress buffer metal layer disposed on the conductive pad, a solder resist layer disposed on the substrate body and havi... | 01/24/2012 |
| 8101867 | Electroless Ni-P plating method and substrate for electronic component An electroless Ni—P plating method according to the present invention includes the steps of: providing a substrate including an insulating substrate and a copper alloy layer that has a predetermined pattern including a plurality of island portions that are isolate... | 01/24/2012 |
| 8093504 | Circuit board structure employing ferrite element A circuit board structure includes a dielectric layer, a first metal layer, a second metal layer and a first ferrite element. The first metal layer is disposed on an upper surface of the dielectric layer and has a first circuit area, a second circuit area and a firs... | 01/10/2012 |
| 8076587 | Printed circuit board for harsh environments A printed circuit board (PCB 22) capable of withstanding ultra high G forces and ultra high temperature as in a gas turbine (11). The PCB includes a substrate having a plurality of cavities (30A, 36A) formed therein for receiving componen... | 12/13/2011 |
| 8071888 | Electrically conductive ink, electrically conductive circuit, and non-contact-type medium This invention provides an electrically conductive ink comprising an electrically conductive material and a vinyl chloride/vinyl acetate/hydroxyalkyl (meth)acrylate copolymer resin. There is also provided a noncontact-type medium comprising a base material and, prov... | 12/06/2011 |
| 8058564 | Circuit board surface structure A circuit board surface structure includes a circuit board having at least one surface provided with a plurality of electrically connecting pads, an insulating protective layer characterized by photosensitivity and solder resisting and formed on the circuit board, a... | 11/15/2011 |
| 8049114 | Package substrate with a cavity, semiconductor package and fabrication method thereof A method of making a package substrate includes providing a cladding sheet comprising a first metal layer, a second metal layer and an intermediate layer between the first and second metal layers; etching away a portion of the first metal layer to expose a portion o... | 11/01/2011 |
| 8030577 | Printed wiring board and method for producing the same The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer p... | 10/04/2011 |
| 8026449 | Circuit board with ESD protection and electronic device using same A circuit board includes a signal layer and a power supply layer. The signal layer includes a first surface and a second surface opposite to the first surface. A number of pads are formed on the first surface for connecting to an electronic component. The power supp... | 09/27/2011 |
| 8013256 | Printed wiring board A printed wiring board including solder pads excellent in frequency characteristic is provided. To do so, each solder pad 73 is formed by providing a single tin layer 74 on a conductor circuit 158 or a via 160. Therefore, a signal propaga... | 09/06/2011 |
| 8008582 | Anisotropic electrically conductive structure An anisotropic electrically conductive structure comprising: a dielectric matrix having a first surface and a second surface; a heat curable adhesive layer disposed on at least one or both of said first surface and said second surface; a plurality of passages at lea... | 08/30/2011 |
| 7999189 | Circuit board structure and method for fabricating the same A circuit board structure and a method for fabricating the same are disclosed, including providing a core board having conductive traces and solder pads respectively formed thereon, wherein width of the solder pads corresponds to that of the conductive traces, and p... | 08/16/2011 |
| 7982138 | Method of nickel-gold plating and printed circuit board Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel pl... | 07/19/2011 |
| 7982137 | Circuit board with an attached die and intermediate interposer A die having a base formed of a first material is connected to a board having a base formed of a second material. An interposer having a coefficient of thermal expansion intermediate coefficients of thermal expansion of the first and second materials is positioned b... | 07/19/2011 |
| 7928322 | Conductive ink, conductive circuit and non-contact media Disclosed is an active energy ray-curable conductive ink containing a conductive substance and a binder component, which is characterized in that the binder component contains a chlorinated polyester and an active energy ray-polymerizable compound. This active energ... | 04/19/2011 |
| 7906732 | Method for producing a glass plate with a conductive printed wire and glass plate with a conductive printed wire Provided is a process for producing a glass plate with a conductive printed wire, which does not require a screen plate for each model, facilitates adjustments for desired heat generation performance or antenna performance, has an excellent adhesion to a glass plate... | 03/15/2011 |
| 7875806 | Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing solders Methods of forming and assemblies having hybrid interconnection grid arrays composed of a homogenous mixture of Pb-free solder joints and Pb-containing solder paste on corresponding sites of a printed board. The aligned Pb-free solder joints and Pb-containing solder... | 01/25/2011 |
| 7626125 | Wiring, display device and method of manufacturing the same The present invention provides a wiring, a display device, and a method of manufacturing the same. A first metal diffusion-preventing layer is formed on a substrate or on a circuit element formed on the substrate. Then, a metal wiring layer is selectively formed on ... | 12/01/2009 |
| 7582833 | Transparent substrate provided with electroconductive strips The present invention relates to a method of manufacturing electrically conducting tracks on a transparent substrate, by screen printing with an electrically conducting paste, and to the transparent substrate provided with said tracks. According to the invent... | 09/01/2009 |
| 7525049 | Electronic component case and battery and electric double layer capacitor A battery case as an electronic component case includes a second conductive plate made of metal, an insulating wall having an upper end surface and a bottom end surface, a first conductive plate made of metal joined to an upper end surface of the insulating wall, an... | 04/28/2009 |
| 7425081 | LED lamp assembly with conductive epoxy LED interconnections A lamp assembly including at least two light emitting diodes (LEDs) attached to an electrically non-conductive housing by at least two beads of electrically conductive epoxy. The electrically conductive epoxy beads are disposed in at least two grooves formed in the ... | 09/16/2008 |
| 7425683 | Flexible wiring base material and process for producing the same The present invention provides a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating with tin-bismuth alloy, of a solder resist layer. The invention also pr... | 09/16/2008 |
| 7423220 | Conductive paste for multilayer electronic components and multilayer electronic component using same A conductive paste for multilayer electronic components which is to be directly printed on a ceramic green sheet, the conductive paste contains a conductive powder, a resin and an organic solvent, wherein the organic solvent contains at least one solvent selected fr... | 09/09/2008 |
| 7408785 | Structure for mounting electronic component on wiring board A structure for mounting an electronic component on a wiring board according to the invention includes a wiring board that is provided with wiring patterns, each having a land portion, and an electronic component that has a plurality of electrodes which are soldered... | 08/05/2008 |
| 7390440 | Process for producing metal-containing particles having their surface coated with at least two dispersants different in vaporization temperature To provide metal-containing fine particles having good dispersion stability, which have their surface coated with dispersants vaporizable even during firing at low temperatures, a fine particle dispersion having the above metal-containing fine particles dispersed th... | 06/24/2008 |
| 7388296 | Wiring substrate and bonding pad composition A wiring substrate comprised of a substrate main body made of glass-ceramic, a pad formed on a surface of the substrate main body and a conductor pin provided in an upright position on the pad. The pad is comprised of a ceramic that is the same as the ceramic consti... | 06/17/2008 |
| 7381902 | Wiring board and method of manufacturing the same A wiring board comprises a patterned wiring formed of electrically conductive resin composed primarily of silver and embedded into a substrate in a manner that a surface thereof is exposed above the substrate, and a covering conductor formed primarily of carbon cove... | 06/03/2008 |
| 7381903 | Printed circuit board and inspection method therefor It is an object of the present invention to provide a printed circuit board and an inspection method therefor capable of electrically inspecting misregistration of a solder resist and a display by silk printing with respect to a wiring pattern on a printed circuit b... | 06/03/2008 |
| 7382628 | Circuit-component-containing module A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove... | 06/03/2008 |
| 7378598 | Printed circuit board substrate and method for constructing same A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A signa... | 05/27/2008 |
| 7377032 | Process for producing a printed wiring board for mounting electronic components A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4 is connected with the wiring pattern and the other end portion... | 05/27/2008 |
| 7375287 | Assembly for accommodating the power electronics and control electronics of an electric motor An arrangement to receive and accommodate the power and control electronics of an electric motor comprises a first circuit board mounted with control electronic components, a second circuit board mounted with power electronic components which has a substrate that no... | 05/20/2008 |
| 7371974 | Multilayer printed wiring board A multilayered printed circuit board includes a substrate and, as serially built up thereon, a conductor circuit and an interlaminar resin insulating layer in an alternate fashion and in repetition. The conductor circuits between which the interlaminar resin insulat... | 05/13/2008 |
| 7372139 | Semiconductor chip package A semiconductor chip package may include a substrate, which may have bonding pads formed thereon. A semiconductor chip mounted on the substrate may have chip pads, and electrical connections for connecting the chip pads of the semiconductor chip to the substrate bon... | 05/13/2008 |
