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| Number | Title | Issue Date |
| 8143530 | Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates A substrate and method for making same for use in electronic packages having a core layer of copper-invar-copper (CIC) with a layer of polytetrafluoroethylene (PTFE) placed upon both sides of the CIC. A layer of etched copper foil is placed on the outer surface of e... | 03/27/2012 |
| 8143529 | Laminated multi-layer circuit board Plural thermoplastic resin films, each having a circuit pattern formed thereon, are laminated. Via-holes filled with conductor paste are formed in the thermoplastic films to electrically connect neighboring layers. The laminated body is pressed under heat between a ... | 03/27/2012 |
| 8134082 | Solid printed circuit board and method of manufacturing the same A solid printed circuit board is manufactured by bonding upper and lower printed circuit boards having different shapes and provided with wirings formed on surfaces thereof. A bonding layer is made of insulating material containing thermosetting resin and inorganic ... | 03/13/2012 |
| 8134081 | Three-dimensional circuit board and its manufacturing method A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in whic... | 03/13/2012 |
| 8089003 | Printed circuit board assembly A printed circuit board substrate includes an insulation matrix and a waterproof layer. The insulation matrix includes a first surface and a second surface at an opposite side thereof to the first surface. The waterproof layer is formed in the insulation matrix and ... | 01/03/2012 |
| 8080737 | Ceramic substrate, method of manufacturing the same, and electrical device using the same Provided are a ceramic substrate, a method of manufacturing the same, and an electrical device using the same. A ceramic substrate includes a first laminated body, a second laminated body and an adhesive part. The first laminated body includes a predetermined electr... | 12/20/2011 |
| 8071887 | Printed circuit board and method for manufacturing same A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of car... | 12/06/2011 |
| 8058563 | Interposer and method for manufacturing interposer An interposer includes an inorganic insulating layer, a first wiring formed in or on a surface of the inorganic insulating layer, an organic insulating layer formed over the inorganic insulating layer and on the first wiring, a second wiring formed on the organic in... | 11/15/2011 |
| 7943856 | Composition for producing printed circuit board and printed circuit board using the same A composition for producing a printed circuit board is provided. The composition includes a polyamic acid having one or two crosslinkable functional groups introduced at one or both ends thereof, a liquid crystal polymer (LCP) or a liquid crystalline thermoset (LCT)... | 05/17/2011 |
| 7880093 | 3-dimensional substrate for embodying multi-packages and method of fabricating the same A substrate for embodying multi-package comprises an underlying layer has a polymer material containing a conductive filler and provided with a step-like groove divided into step part and bottom part; a coating layer formed over the underlying layer, the coating lay... | 02/01/2011 |
| 7812261 | Multilayer printed wiring board and test body for printed wiring board There are provided a multilayer printed circuit board and a testing piece for the printed circuit board, including a substrate having an inner-layer conductor circuit and one or more outer-layer conductor circuits formed on the substrate with an insulating layer lai... | 10/12/2010 |
| 7791879 | Electronic device shell A shell of an electronic device includes a front cover, a rear cover, and a latching assembly. The front cover includes two first sidewalls. The rear cover includes two first borders. The latching assembly includes two first latching members, two spacers, and two gr... | 09/07/2010 |
| 7771233 | High speed, high density electrical connector An electrical connector with electrically lossy materials bridging ground members. The lossy conductive members may be formed by filling a settable binder with conductive particles, allowing the partially conductive members to be formed through an insert molding pro... | 08/10/2010 |
| 7514637 | Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in approximately the same plane at the time of manufacturing a multilayer printed ... | 04/07/2009 |
| 7388157 | Printed wiring board A printed wiring board is made of first and second substrates superimposed on each other. The first and second substrates respectively include a core layer made of resin containing carbon fibers. The second substrate has the outline different from that of the first ... | 06/17/2008 |
| 7377032 | Process for producing a printed wiring board for mounting electronic components A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4 is connected with the wiring pattern and the other end portion... | 05/27/2008 |
| 7371107 | Electrical connector An electrical connector is connected with a circuit board. The electrical connector includes an insulating body and a plurality of pins received in the insulating body. The insulating body is transparent. There is an identification layer on the bottom of the insulat... | 05/13/2008 |
| 7371471 | Electromagnetic noise suppressing thin film An electromagnetic noise suppressing thin film has a structure including an inorganic insulating matrix made of oxie, nitride, fluoride, or a mixture thereof and columnar-structured particles made of a pure metal of Fe, Co, or Ni or an alloy containing at least 20 w... | 05/13/2008 |
| 7365273 | Thermal management of surface-mount circuit devices A circuit board assembly having a laminate construction of multiple layers, such as a LTCC ceramic substrate, with conductor lines between adjacent pairs of layers. A heat sink is bonded to a first surface of the substrate, and a cavity is defined by and between the... | 04/29/2008 |
| 7359213 | Circuit board A circuit board is formed by mounting at least one passive component on a first surface of a first laminate material; interconnecting the passive component to contact traces and vias of the first laminate material; and attaching a second laminate material to the fir... | 04/15/2008 |
| 7355127 | Printed wiring board and electronic device using the same The present invention provides a printed wiring board which has high insulation resistance between wirings and is unlikely to cause failures such as leakages or short circuits, attributable to ion migration even in high temperatures and highly humid environments. Th... | 04/08/2008 |
| 7350292 | Method for affecting impedance of an electrical apparatus A method for affecting an impedance of a portion of an electrical circuit loop in an electrical circuit apparatus includes providing an electrical circuit apparatus having at least a portion of an electrical circuit loop including at least one of at least one trace ... | 04/01/2008 |
| 7352554 | Method for fabricating a Johnsen-Rahbek electrostatic wafer clamp The present invention is directed to a J-R electrostatic clamp (ESC) and method for forming same. The ESC comprises a ceramic layer for clamping a wafer thereto, and a plurality of electrodes arranged across the ceramic layer in an interior region and a peripheral r... | 04/01/2008 |
| 7348493 | Metal-ceramic circuit board A metal-ceramic circuit board is characterized by being constituted by bonding directly on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal member of an electronic circuit. The base plate has a proof stres... | 03/25/2008 |
| 7342181 | Maximizing capacitance per unit area while minimizing signal transmission delay in PCB A printed circuit board (PCB) is provided that maximizes compensation capacitance per unit area of the PCB while minimizing signal transmission delays in the PCB. The PCB includes a first section having a first dielectric constant (DK), a second section having a sec... | 03/11/2008 |
| 7341919 | Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device A capacitor element configured to mount a semiconductor element thereon includes a base. A capacitor part is provided on the base. The base is made of a resin whose coefficient of linear expansion is adjusted in accordance with a coefficient of linear expansion of t... | 03/11/2008 |
| 7342802 | Multilayer wiring board for an electronic device To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an interlayer insulating film allows for interlayer connection between plural wiring films insulated from one another with plural interlayer insulating layers.... | 03/11/2008 |
| 7338892 | Circuit carrier and manufacturing process thereof A circuit carrier including a core layer, a passive component, a plurality of dielectric layers, and a plurality of circuit layers is provided. The core layer has a first surface and a second surface. In addition, the core layer has a hole, and the passive component... | 03/04/2008 |
| 7338884 | Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device An interconnecting substrate for carrying a semiconductor device, comprising: an insulating layer; an interconnection set on an obverse surface of the insulating layer; an electrode which is set on a reverse surface side of the insulating layer and formed in such a ... | 03/04/2008 |
| 7335531 | Semiconductor device package and method of production and semiconductor device of same A semiconductor device including a semiconductor device package providing a capacitor in its circuit board and a semiconductor chip mounted on that package, wherein the capacitor is provided directly under a semiconductor chip mounting surface of the circuit board o... | 02/26/2008 |
| 7334323 | Method of making mutilayered circuitized substrate assembly having sintered paste connections A method of making a circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic c... | 02/26/2008 |
| 7332805 | Electronic package with improved current carrying capability and method of forming the same An electronic package and method for forming such package that expands the current capability of lines and/or reducing line resistance for packages with a given feature dimension while relaxing feature tolerances. The methods and structures include electrical wiring... | 02/19/2008 |
| 7330354 | Mobile terminal device and method for radiating heat therefrom In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the elec... | 02/12/2008 |
| 7330491 | Fault tolerant laser diode package A laser diode package (10) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package (10) includes a laser diode bar (12), a forward-biased diode (14), a heat sink (18), and ... | 02/12/2008 |
| 7328505 | Method for manufacturing multilayer circuit board A multilayer circuit board that has electrodes only on one surface is manufactured as follows. A plurality of conductor layers are formed on a resin film made of thermoplastic resin to form a single-sided conductor layer film. Then, a plurality of via-holes 24 | 02/12/2008 |
| 7326463 | Conductive circuits or cables manufactured from conductive loaded resin-based materials Circuit conductors and cables are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin h... | 02/05/2008 |
| 7321097 | Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the same The invention provides in a preferred embodiment an electronic component comprising a first conductive layer, a non-conductive layer and a second conductive layer. A hole is etched through the non-conductive layer. A nanotube, which is provided in said hole, links t... | 01/22/2008 |
| 7311971 | One part, heat cured pressure sensitive adhesives Novel one part, heat cured pressure-sensitive adhesives capable of bonding metallic and non-metallic materials at ambient temperatures and curing at elevated temperatures to form a bond with very high adhesive bond strengths at temperatures up to at least 160° C. T... | 12/25/2007 |
| 7310405 | High-Z cast reflector compositions and method of manufacture A scintillator pack comprises an array of scintillator pixels and an x-ray absorbing layer disposed in inter-scintillator regions between the scintillator pixels. The x-ray absorbing layer acts to absorb x-rays and protect underlying regions of the inter-scintillato... | 12/18/2007 |
| 7309647 | Method of mounting an electroless nickel immersion gold flip chip package A flip chip package, apparatus and technique in which a ball grid array composed of a doped eutectic Pb/Sn solder composition is used. The dopant in the Pb/Sn solder forms a compound or complex with the phosphorous residue from the electroless nickel plating process... | 12/18/2007 |
