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| Number | Title | Issue Date |
| 8164002 | Wired circuit board and producing method thereof A wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a first semiconductive layer formed on a surface of the insulating base layer exposed fr... | 04/24/2012 |
| 8164001 | Multilayer printed circuit board A multilayer printed circuit board includes an inner magnetic layer essentially consisting of magnetic material. The inner magnetic layer may be formed by an action of chemical bond or van der Waals force. The inner magnetic layer may comprise a plurality of magneti... | 04/24/2012 |
| 8153903 | Circuit board and image display apparatus In a circuit board disposed in parallel to a fixing plane, a guard spacer (abutting member) is disposed on a multi-layer printed circuit board on the side of the fixing plane to suppress deformation of the multi-layer printed circuit board to prevent short circuit i... | 04/10/2012 |
| 8148643 | Multilayered printed circuit board and manufacturing method thereof An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an... | 04/03/2012 |
| 8148644 | Electronic card and aircraft including same An electronic card that includes at least two superimposed conducting layers with an insulation layer between the two conducting layers, the two conducting layers each including a utility conducting portion and a conducting portion at the periphery of the utility co... | 04/03/2012 |
| 8143528 | Printed circuit board and method of manufacturing the same A printed circuit board includes a signal layer, an insulation layer, and a reference layer. A transmission line is located on the signal layer. A probing pad is located on the transmission line. Two aligned slots defined in opposite sides of the reference layer lea... | 03/27/2012 |
| 8138423 | Printed wiring board and method for manufacturing printed wiring board A printed wiring board and a method for manufacturing the printed wiring board in which widths of a first and a second circuit are close to each other and substantial miniaturization can be achieved. In order to achieve this object, a first circuit and a second circ... | 03/20/2012 |
| 8138425 | Projected capacitive touch panel and fabricating method thereof A touch panel and a fabricating method thereof are provided. The touch panel includes: a substrate; a first conductive layer configured on the substrate and having a first and a second portions; an insulating layer covering the first portion; and a second conductive... | 03/20/2012 |
| 8138424 | Wiring substrate including a reinforcing structural body A wiring substrate includes (i) a wiring forming region in which wiring layers and an insulating layer are alternately stacked, (ii) an outer periphery region around the wiring forming region, and (iii) a reinforcing structural body having (a) a first reinforcing me... | 03/20/2012 |
| 8134080 | Wired circuit board A wired circuit board that can provide an enhanced adhesion of a metal supporting board at a marginal portion of an opening formed in the metal supporting board with a simple structure to prevent stripping of the metal supporting board. In a suspension board with ci... | 03/13/2012 |
| 8129623 | Resin film, adhesive sheet, circuit board, and electronic apparatus The invention relates to a resin film having a high adhesiveness to other materials, an adhesive sheet, a circuit board and an electronic apparatus in which an adhesive layer and the resin film are firmly adhered. A resin film (1) includes a plurality of proj... | 03/06/2012 |
| 8129624 | Pressure sensor A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an ... | 03/06/2012 |
| 8124880 | Circuit board and method for manufacturing thereof A method of manufacturing a circuit board that includes: forming a conductive relievo pattern, including a first plating layer, a first metal layer, and a second plating layer stacked sequentially in correspondence with a first circuit pattern, on a seed layer stack... | 02/28/2012 |
| 8119920 | Multilayer printed wiring board An IC chip for a high frequency region, particularly a packaged substrate in which no malfunction or error occurs even if 3 GHz is exceeded. A conductive layer on a core substrate is formed at a thickness of 30 μm and a conductor circuit on an interlayer resin insu... | 02/21/2012 |
| 8119921 | Impedance tuning for circuit board signal path surface pad structures The characteristic impedance of a surface pad is manipulated by reticulating the pad and filling the spaces with a dielectric material, providing an inductive element in the coupling of the surface pad to an underlying ground pad of a ground plane, or a combination ... | 02/21/2012 |
| 8115104 | Circuit board with buried conductive trace formed thereon and method for manufacturing the same A circuit board with a buried conductive trace formed thereon according to the present invention is provided. A buried conductive trace layer is formed on the surface of a substrate and the pads and fingers of the conductive trace layer are heightened to facilitate ... | 02/14/2012 |
| 8106305 | Print circuit board with high insulated region, method of manufacturing thereof, and print circuit board assembly thereof A print circuit board includes: a first surface; a guard plane disposed on an inner layer; a high insulated region formed on the first surface of the board so as to be opposed to the guard plane, the high insulated region being substantially surrounded by one or mor... | 01/31/2012 |
| 8101865 | Printed wiring board and a method of production thereof A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a f... | 01/24/2012 |
| 8101864 | Electronic device substrate and its fabrication method, and electronic device and its fabrication method An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is... | 01/24/2012 |
| 8097813 | Carbon nanotube based interposer In at least one embodiment, an interposer for a board interconnect system is provided. The interposer comprises a frame and at least one interconnect. The frame receives a substrate. The substrate includes a top side, a bottom side, and a conductive interface. The c... | 01/17/2012 |
| 8093503 | Multilayer wiring board A coreless wiring board has no core board but a laminated structure in which a conductor layer and resin insulating layers are alternately laminated into a multilayer. Each of the resin insulating layers is formed to contain a glass cloth in an epoxy resin. A plural... | 01/10/2012 |
| 8093502 | Flex-rigid wiring board and manufacturing method thereof A flex-rigid printed wiring board is proposed which includes rigid substrates each formed from an insulative base material and a conductor circuit provided on the insulative base material, and a bendably flexible substrate formed from an insulative base material, co... | 01/10/2012 |
| 8084692 | Reducing noise coupling in high speed digital systems An apparatus having reduced noise coupling includes a core layer having an upper and lower surface, the upper and lower surface each including a copper sheet layer, a pre-preg layer having an upper surface and a lower surface, the upper surface of the pre-preg layer... | 12/27/2011 |
| 8071886 | Wired circuit board having a semiconductive grounding layer and producing method thereof A wired circuit board includes a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a plurality of wires, and a semiconductive layer formed on a surface of the insulating l... | 12/06/2011 |
| 8067698 | Wiring substrate for use in semiconductor apparatus, method for fabricating the same, and semiconductor apparatus using the same On a printed-wiring board 1-1, a conductor layer 2 is laminated to both the top surface and the bottom surface of a substrate core 7 so as to pattern the substrate core, and a solder resist 4 is laminated to the substrate core. The... | 11/29/2011 |
| 8063312 | Wired circuit board and producing method thereof A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board, an insulating base layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the insulating base layer and a having a ... | 11/22/2011 |
| 8058562 | Wiring substrate and method of manufacturing the same A wiring substrate is provided. The wiring substrate includes: a core layer in which a gap is formed; and a lamination layer which includes an insulating layer and a wiring layer and which is formed on at least one surface of the core layer. The lamination layer has... | 11/15/2011 |
| 8053676 | Substrate panel having a plurality of substrate strips for semiconductor packages A substrate panel primarily comprises a plurality of substrate strips arranged in an array, one or more current input lines, a plurality of cascaded lines connecting between the substrate strips, and a current input buffer gate. Current input lines connect a current... | 11/08/2011 |
| 8053675 | Apparatus for balancing power plane pin currents in a printed wiring board using collinear slots Printed wiring board (PWB) provides for reduction in pin counts required for power plane (including ground plane) connections and/or reduction in requirements for connector current handling per pin. Multiple collinear slots in the form of a dashed line are introduce... | 11/08/2011 |
| 8049113 | Printed circuit boards The present invention relates to a printed circuit board. In one embodiment, a printed circuit board includes a dielectric layer and a conductive trace formed on the dielectric layer. The conductive layer includes a first conductive portion, a connecting portion and... | 11/01/2011 |
| 8044301 | Printed circuit board provided with heat circulating medium and method for manufacturing the same A printed circuit board includes a lower plate provided with an internal circuit wiring and having a recessed part at a surface thereof and a plurality of projection patterns at a lower surface of the recessed part; an upper plate having the same structure of the lo... | 10/25/2011 |
| 8044302 | Printed circuit board having coplanar LC balance Provided is a printed circuit board having coplanar LC balance, comprising: an insulation layer, printed circuit patterns formed on the insulation layer, power source wirings supplying power in the printed circuit patterns, and at least three signal wirings formed b... | 10/25/2011 |
| 8044303 | Trace carrier A trace carrier is provided. The trace carrier includes a first insulating tube, a second insulating tube, a trace pair, and a sealed hollow insulating cylinder. The trace pair is passing through the first insulating tube and the second insulating tube, and is coile... | 10/25/2011 |
| 8039755 | Method for manufacturing a printed circuit board element as well as a printed circuit board element A circuit board element and production thereof are disclosed, whereby a noble metal is applied to a structured conductor layer on a circuit board substrate, comprising said conductor layer. The conductor layer is roughened on the surface, preferably after the struct... | 10/18/2011 |
| 8035035 | Multi-layer wiring board and method of manufacturing the same A multi-layer wiring board without a core substrate includes: a multi-layer laminated structure; first terminals provided on a front surface of the multi-layer laminated structure; second terminals provided on a rear surface of the multi-layer laminated structure; a... | 10/11/2011 |
| 8035034 | Printed circuit board A printed circuit board includes a base and a signal trace laid on the base. The signal trace includes a plurality of straight line segments parallel to the first fibers. The signal trace is laid on the base in such a manner that the line segments of the signal trac... | 10/11/2011 |
| 8030575 | Mounting structure providing electrical surge protection A solution for protecting an electronic device from an electrical surge using a mounting structure is provided. In particular, the mounting structure comprises a conductive material and is electrically connected to the protected electrical device. The conductive mat... | 10/04/2011 |
| 8030576 | Wired circuit board with interposed metal thin film and producing method thereof A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer and including a wire and a terminal portion, an insulating cover layer formed on the insulating base layer and having an opening portion to expose the t... | 10/04/2011 |
| 8026448 | Multilayer wiring board and method of manufacturing the same A multilayer wiring board includes at least two wiring boards having wiring layers containing wiring patterns formed on both sides. A pair of fin-shaped bumps are formed at desired positions on wiring patterns on the surfaces facing each other, of the wiring boards,... | 09/27/2011 |
| 8022310 | Multilayer wiring board The present invention provides a multilayer wiring board in which warpage during reflow soldering can be reduced even if there is no sufficient space for disposing a dummy pattern or if a dummy pattern cannot be disposed. A difference between the ratios of copper re... | 09/20/2011 |
