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| Number | Title | Issue Date |
| 8404977 | Flexible circuit assembly without solder Provided is a flexible electronic assembly that uses no solder. Components or component packages are mounted on a flexible substrate. Vias connect through the substrate to the components' leads. Circuits are formed on the opposite side of the substrate interconnecti... | 03/26/2013 |
| 8338713 | Cabled signaling system and components thereof An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are ... | 12/25/2012 |
| 8198538 | Capacitor devices having multi-sectional conductors A capacitive device is provided. The capacitive device includes a first electrode and a second electrode below the first electrode and spaced apart from the first electrode, wherein at least one of the first electrode and the second electrode includes a plurality of... | 06/12/2012 |
| 7645941 | Shielded flexible circuits and methods for manufacturing same A shielded flexible cable having a plurality of shielded electronic circuits in close proximity to one another such that signals transmitted on one of said plurality of shielded electronic circuits do not substantially interfere with signals transmitted on the other... | 01/12/2010 |
| 7418980 | Vacuum cleaner hose The present invention relates to a vacuum cleaner hose manufactured by continuously spirally winding one row or two rows of band-shaped materials extruded with an electric wire inserted therein. The vacuum cleaner hose is formed by spirally winding and sticking a ba... | 09/02/2008 |
| 7396591 | Wiring substrate In a wiring substrate having a metal wiring pattern that is formed on a substrate and includes a contact portion for providing connection to an external element, an organic thin film containing silane is formed to cover the metal wiring pattern and the contact porti... | 07/08/2008 |
| 7342177 | Wiring board, electro-optical device and electronic instrument A wiring board includes a substrate, an interconnect layer formed of a plurality of layers formed over the substrate, and a plurality of electrodes formed to overlap the interconnect layer. An interconnecting pattern positioned in one of the plurality of layers form... | 03/11/2008 |
| 7336883 | Indexing optical fiber adapter The device includes an indexing adapter, two port monitors, a light source, and two fiber optic connectors. The indexing adapter has only three fiber optic connector receptacles. Two of the three fiber optic connector receptacles are situated adjacent to the third f... | 02/26/2008 |
| 7329817 | Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are produced in an insulating layer for insulating a lead wire for electr... | 02/12/2008 |
| 7321167 | Flex tape architecture for integrated circuit signal ingress/egress In an integrated circuit design, flex tape is used to provide signal ingress/egress to/from the integrated circuit design. Various architectures for the signal ingress/egress via flex tape is provided. In one embodiment, coaxial design is provided. In another embodi... | 01/22/2008 |
| 7307293 | Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages susp... | 12/11/2007 |
| 7304249 | Bonding pads for a printed circuit board Bonding pad(s) for a printed circuit board with circuit patterns are provided. The bonding pad(s) include a plurality of copper patterns formed on the PCB and electrically connected to the circuit patterns, a filler filled between the copper patterns such that an up... | 12/04/2007 |
| 7301228 | Semiconductor device, method for manufacturing same and thin plate interconnect line member The present invention provides a low-profile and light-weight semiconductor device having improved product reliability and higher frequency performance. A multi-layer interconnect line structure is disposed just under circuit devices 410a and 410 | 11/27/2007 |
| 7285321 | Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto The present invention relates to a multi-layer laminate having a low glass transition temperature polyimide layer, a high glass transition temperature polyimide layer, and a conductive layer. The low glass transition temperature polyimide layer is synthesized... | 10/23/2007 |
| 7257891 | Method for forming bonding pads A method for forming bonding pads on a printed circuit board (PCB) with circuit patterns is provided. A plurality of copper patterns are formed on the PCB which are electrically connected to the circuit patterns, and a filler is filled between the copper patterns su... | 08/21/2007 |
| 7235457 | High permeability layered films to reduce noise in high speed interconnects This invention provides a structure and method for improved transmission line operation on integrated circuits. One method of the invention includes forming transmission lines in an integrated circuit. The method includes forming a first layer of electrically conduc... | 06/26/2007 |
| 7226217 | Transceiver/fiber optic connector adaptor with patch cord ID reading capability The device includes a first optical connector, a second optical connector, a flexible substrate, a first electrical connector, a second electrical connector, a memory chip, and a clip. The first electrical connector is attached to the flexible substrate. The second ... | 06/05/2007 |
| 7217963 | Semiconductor integrated circuit device In a low power consumption mode in which prior data is retained upon power shutdown, the return speed thereof is increased. While use of an existent data retaining flip-flop may be considered, this is not preferred since it increases area overhead such as enlargemen... | 05/15/2007 |
| 7186924 | Dielectric structure for printed circuit board traces A trace cover suitable for shielding a conductive trace on a top layer of a circuit board. The trace cover includes a dielectric body disposed substantially over the conductive trace, side shielding perpendicular to the direction of the conductive trace and substant... | 03/06/2007 |
| 7170153 | Semiconductor device and its manufacturing method In order to manufacture a thin and small semiconductor device at low cost, the semiconductor device and its manufacturing method are disclosed. The semiconductor device comprises: a film wiring substrate made of insulating resin; a semiconductor chip fixed to the ma... | 01/30/2007 |
| 7148428 | Flexible cable for high-speed interconnect A system and method are disclosed in which flex cables are affixed to PCBs, for providing high-speed signaling paths between ICs disposed upon the PCBs. The flex cables are fixably attached to the PCBs so as to substantially mimic their structural orientation. Where... | 12/12/2006 |
| 7145083 | Reducing or eliminating cross-talk at device-substrate interface Inter-layer shielding is employed to shield printed circuit board transmission lines from EMI and cross-talk at traversals between adjacent inner layers, between inner layers separated by one or more inner layers, between an outer layer and an adjacent inner layer, ... | 12/05/2006 |
| 7105221 | Circuit board, laminated member for circuit board, and method for making laminated member for circuit board The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit ... | 09/12/2006 |
| 7101619 | Laminate The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable... | 09/05/2006 |
| 7101770 | Capacitive techniques to reduce noise in high speed interconnections Improved methods and structures are provided using capacitive techniques to reduce noise in high speed interconnections, such as in CMOS integrated circuits. The present invention offers an improved signal to noise ration. The present invention provides for the fabr... | 09/05/2006 |
| 7101778 | Transmission lines for CMOS integrated circuits Improved methods and structures are provided for impedance-controlled low-loss lines in CMOS integrated circuits. The present invention offers a reduction in signal delay. Moreover, the present invention further provides a reduction in skew and crosstalk. Embodiment... | 09/05/2006 |
| 7097461 | Electric connecting device An electrical connecting device has the following features: a current or data transmitter device which can be connected to at least one current-transmitting or pulse-transmitting source is arranged in a transmitter housing and has contact elements. A current receivi... | 08/29/2006 |
| 7094068 | Load board A load board for packaged IC testing. The load board with predetermined testing circuit thereon has bonding pad areas on its surface. A plurality of bonding pads is formed on the bonding pad areas, each of which is disposed corresponding to a lead of a packaged IC f... | 08/22/2006 |
| 6948977 | Connector assembly and assembly method A connector assembly that is mountable on a circuit board includes a casing having a metallic housing. The housing has at least one receptacle where a connecting element is mounted. A shielded cable connects between the connecting element and an interconnect that is... | 09/27/2005 |
| 6943452 | Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality An integrated circuit is provided that contains a coaxial signal line formed at least partially within a silicon-containing substrate. The coaxial signal line comprises an inner conductor having a length, said length axially surrounded by, and insulated from, an out... | 09/13/2005 |
| 6936502 | Package modification for channel-routed circuit boards A method for implementing a circuit component on a surface of a multilayer circuit board is provided. The circuit component includes a plurality of pins and the circuit board includes a plurality of electrically conductive vias penetrating at least one layer of the ... | 08/30/2005 |
| 6929849 | Embedded electrical traces A method for making a fine electrically conductive grid embedded in a polymer substrate. The method includes the steps of providing a polymer substrate, forming a pattern of grooves in the substrate, filling the grooves with electrically conductive powder, and then ... | 08/16/2005 |
| 6911265 | Laminate The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable... | 06/28/2005 |
| 6909051 | Method and apparatus for coupling a circuit board to a transmission line that includes a heat sensitive dielectric A preferred method for coupling a transmission line to a circuit board includes the steps of: providing a circuit board with a first side and an opposing second side; dispensing solder upon the first side of the circuit board; providing a first coupler having a cond... | 06/21/2005 |
| 6906268 | Heat-shrinkable retainer for PCB double-sided assembly An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same... | 06/14/2005 |
| 6867506 | Plastic ball grid array assembly An apparatus for enclosing logic chips includes a substrate upon which a logic chip is mounted and a mold cap disposed upon the substrate and covering the logic chip. The mold cap includes at least one extension of sufficient size and shape to provide structural sup... | 03/15/2005 |
| 6841856 | Insert conductor for use in a generator and having structure for preventing deformation An insert conductor that makes it possible to provide a brush holder that does not have wire portions unnecessarily to the outside and which permits reduced manufacturing cost. The insert conductor is equipped with: a conductor which has a wiring section composed of... | 01/11/2005 |
| 6822168 | Cable harness arrangement A cable harness arrangement, especially for connection of the individual components of a motor vehicle, is provided which includes a flexible printed circuit board having at least one flat printed circuit and at least one non-flat conductor. The non-flat conductor i... | 11/23/2004 |
| 6803092 | Selective deposition of circuit-protective polymers A composition for electrophoretic deposition of an insulating, protective coating. The composition comprises a cationic resin emulsion; and a curative mixed with the cationic resin emulsion. The composition after electrophoretic deposition and curing provides the pr... | 10/12/2004 |
| 6794578 | Quadrax to twinax conversion apparatus and method A Quadrax to Twinax conversion apparatus includes stacked trace layers of transmission line with a ground plane between the trace layers. Embodiments include trace layers of stripline or microstrip. Orthogonal plated through holes include a diagonal pair of through ... | 09/21/2004 |
