Bizarre Patents
Crispy Chip Sandwich and Process of Producing a Sandwich Product
A food product comprising a multilayer cookie or snack having outer layers formed from a crispy type edible food product such as a potato chip or corn chip, etc. with an intermediate marshmallow layer being in contact with the inner surface of each crispy chip and one or more filler substances.
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| Number | Title | Issue Date |
| 6189602 | Electronic device with improved heat dissipation A portable electronic device such as a portable personal computer has a first part such as a main unit incorporating a heat-generating component, e.g., a CPU, a second part such as a display unit, and a connector for pivotally connecting the first and sec... | 02/20/2001 |
| 6185102 | Heat transfer device A heat transfer device comprises a heat conductive base, first and second cylindrical chambers defined in the heat conductive base and parallel to each other, a first heat conduction pipe fixed within the first cylindrical chamber, a second heat conductio... | 02/06/2001 |
| 6181553 | Arrangement and method for transferring heat from a portable personal computer An arrangement and method for enhancing the cooling capacity of portable personal computers. More particularly, there is provided to the provision of an arrangement for increasing the cooling capacity of portable personal computers, particularly such as l... | 01/30/2001 |
| 6178088 | Electronic apparatus An electronic apparatus having a heat pipe that is thermally bonded to plates to internal and external enclosures. The electronic apparatus is located in a heat dissipative external enclosure. The electronic apparatus having at least one unit contained in... | 01/23/2001 |
| 6175493 | Heat transfer from base to display portion of a portable computer A computer system includes a portable computer having a base portion and a lid portion connected to pivotally open relative to the base portion. A heat generating component is mounted in the base portion. A first heat transfer system is mounted in the bas... | 01/16/2001 |
| 6169247 | Enclosure for electronic components An enclosure for electronic devices has a wall of a rigid plastic material, with elongated chambers defined therein. The chambers are filled with a material having a high thermal conductivity, or materials having high heat capacity, such as phase change m... | 01/02/2001 |
| 6167949 | Low EMI emissions heat sink device A low electro-magnetic radiation emissions heat sink that dissipates heat away from an integrated circuit package by means of conduction to the electronic chassis. The heat sink may also include a ferrite ring for reducing electro-magnetic radiation emiss... | 01/02/2001 |
| 6166908 | Integrated circuit cartridge An integrated circuit cartridge has been described. The cartridge includes a heat pipe lid that comes in thermal contact with at least one integrated circuit die. The integrated circuit die is mounted on a substrate that is held in a cavity of a pin chass... | 12/26/2000 |
| 6164368 | Heat sink for portable electronic devices A heat sink for use in a portable electronic device for disposing of the heat generated by an electronic component of the device, the heat sink comprising in its entirety a metal clad plate composed of two metal sheets and having a nonbonded portion in a ... | 12/26/2000 |
| 6163073 | Integrated heatsink and heatpipe A heatsink mounted to an electronic device having an area substantially greater than that of the device includes a heatpipe in the heatsink for transferring heat within the heatsink to reduce thermal gradients therein.... | 12/19/2000 |
| 6152213 | Cooling system for electronic packages A cooling system for various electronic packages used in electronic equipment such as electronic computers, work stations, word processors, etc. and, particularly, a cooling system capable of efficiently cooling various electronic packages and, particular... | 11/28/2000 |
| 6148906 | Flat plate heat pipe cooling system for electronic equipment enclosure A cooling system for an electronic equipment enclosure employs a flat plate heat pipe to deliver heat from the interior of the enclosure through a connector to a removable external heat sink. The heat pipe includes a metallic bottom plate having a depress... | 11/21/2000 |
| 6148905 | Two-phase thermosyphon including air feed through slots The present invention provides a two-phase thermosyphon (100) and a method for forming the two-phase thermosyphon (100). The two-phase thermosyphon (100) includes a hermetically sealed housing (101) including a first outer surface (107), a second outer su... | 11/21/2000 |
| 6137682 | Air-cooled electronic apparatus An electronic apparatus includes a circuit board, a connector provided on the circuit board, an integrated circuit module attached to the connector, and a heat sink attached to the integrated circuit module. A heat transfer device is disposed at a positio... | 10/24/2000 |
| 6137681 | Thermal module A thermal module for dissipating heat generated by a component of a computer consists of a heat sink having a top face defining a cavity exposed to a front side of the heat sink and a bottom face defining a passage fixedly receiving an end portion of a he... | 10/24/2000 |
| 6134106 | Winding chain dissipating unit suitable for electronic device A winding chain dissipating unit suitable for an electronic device is disclosed. The winding chain dissipating unit has a winding chain outer tube, a winding chain inner tube, and heat pipe within the winding chain inner tube. The inner diameter of the wi... | 10/17/2000 |
| 6125036 | Moisture barrier seals for cooled IC chip module assemblies A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which features a moisture barrier on its outer wall surface.... | 09/26/2000 |
| 6122166 | Personal computer cooling device having hinged heat pipe A device for cooling a personal computer including: a body having a heat generating electronic element therein; and a keyboard section connected in an openable manner to the personal computer body through a hinge. A first heat pipe, which has its one end ... | 09/19/2000 |
| 6118655 | Cooling fan with heat pipe-defined fan housing portion Heat generating components in the base housing of a portable computer are thermally communicated with a longitudinal evaporator portion of a thermosyphoning heat pipe. A longitudinal condenser portion of the heat pipe is flattened, bent to a circular shap... | 09/12/2000 |
| 6115251 | Cooling apparatus for computer subsystem An improved apparatus is disclosed for cooling the power dissipating components of a computer subsystem, including microprocessors and hard disk drive assemblies. The apparatus utilizes the computer subsystem's chassis or enclosure, by configuring it as a... | 09/05/2000 |
| 6115252 | Heat sink device for electronic devices A heat sink device for use in an electronic device for dissipating into the atmosphere outside a housing of the electronic device the heat generated by an electronic component disposed within the housing. The housing has a peripheral wall formed with a he... | 09/05/2000 |
| 6111751 | Connector and connecting structure using connector A connector is provided which can simplify the path for heat radiation between electronic devices, ease restrictions in the structures of the electronic devices and in the arrangement of parts on the printed circuit boards, and reduce work for the highly ... | 08/29/2000 |
| 6105662 | Cooling system for electronic packages A cooling system for various electronic packages used in electronic equipment such as electronic computers, work stations, word processors, etc. and, particularly, a cooling system capable of efficiently cooling various electronic packages and, particular... | 08/22/2000 |
| 6102110 | Two-phase or mono-phase heat exchanger for electronic power component A two-phase or mono-phase heat-exchanger for at least one electronic power component wherein the heat-exchanger supports a plurality of heat exchange tubes, each having a heat exchange fluid therein, and wherein said heat-exchanger includes at least one r... | 08/15/2000 |
| 6097596 | Portable computer rotational heat pipe heat transfer Heat transfer through a heat pipe from a heat source on one side of a hinge to a heat dissipation capability on the other side of the hinge is achieved by providing a rotatable coupler with a thermal transfer body mounted on the side of the hinge away fro... | 08/01/2000 |
| 6094347 | Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station An airflow heat exchange apparatus. One embodiment includes a housing configured to removably mate with an electronic device. The housing has a vent on a substantially horizontal surface and a fan positioned to increase airflow through the electronic devi... | 07/25/2000 |
| 6085831 | Direct chip-cooling through liquid vaporization heat exchange An apparatus for and method of cooling an electronic module comprising a heat sink enclosure placed directly over a chip or substrate in a flip chip package. The heat sink enclosure has a plurality of cooling fins extending from within the cavity of the e... | 07/11/2000 |
| 6088223 | Electronic apparatus with improved heatsink arrangement Electronic apparatus comprises an electronic component which in use generates heat and a heatsink mounted within a housing having a thermal path to the electronic component. The heatsink comprises formations for generating by natural convection a cooling ... | 07/11/2000 |
| 6084772 | Electronics enclosure for power electronics with passive thermal management An electronics enclosure is provided with passive thermal management for a high power electronic units, for example a power amplifier for wireless telecommunications, the enclosure being suitable for mast head mounted units, or remotely located units expo... | 07/04/2000 |
| 6084769 | Docking station with auxiliary heat dissipation system for a docked portable computer A portable computer docking base has incorporated therein a plug-in cooling system used to provide auxiliary operating heat dissipation for a portable notebook computer moved through a docking path along the base into a docked relationship therewith. The ... | 07/04/2000 |
| 6082443 | Cooling device with heat pipe The invention provides a cooling device with a heat pipe, which is capable of effectively radiating heat from electronic equipment such as a small-sized computer. The cooling device with the heat pipe comprises a plate-like container made of heat transfer... | 07/04/2000 |
| 6078499 | Spring loaded heat pipe connector for hinged apparatus package An improved primary to secondary heat pipe thermal transfer connector for a hinged electronic apparatus package is achieved through the use of a thermal transfer block with a sleeve positioned on the hinge centerline of a hinged apparatus package and in a... | 06/20/2000 |
| 6075700 | Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures A method and apparatus are disclosed for attenuating RF noise produced by electronic systems by providing low RF impedance shorting of heat dissipating structures, such as heat sinks, to PCB reference planes. The RF impedance shorting path uses existing p... | 06/13/2000 |
| 6069793 | Circuit module and information processing apparatus The present invention provides an information processing apparatus that may be designed in small and thin size and a small and thin CPU module that has a nigh heat releasing effect and is suitable therefor. The CPU module includes a processor, a connector... | 05/30/2000 |
| 6064572 | Thermosyphon-powered jet-impingement cooling device A thermosyphon-powered jet-impingement cooling device delivering superior thermal energy dissipation for compact heat sources such as electronic devices. Thermal energy from a heat source travels through the heat source/heat spreader plate interface to th... | 05/16/2000 |
| 6061235 | Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management A modular integrated apparatus and method that integrates mechanical, electrical, and thermal management, and that includes a computer processor (CPU), or VLSI module, connected to a circuit board and a thermal plate. The modular integrated apparatus incl... | 05/09/2000 |
| 6058010 | Enhanced test head liquid cooled cold plate A cold plate, planar in shape, is machined to provide an interior cavity having a plurality of thermally conductive members which transfer any thermal energy absorbed by the cold plate to a chilled water stream flowing through the interior cavity. Electro... | 05/02/2000 |
| 6058012 | Apparatus, method and system for thermal management of an electronic system having semiconductor devices A thermal management controller to regulate the operating temperature of high speed, high circuit density semiconductor dice in an electronic product. The thermal management controller monitors the temperature of a heat sink in thermal contact with the hi... | 05/02/2000 |
| 6055157 | Large area, multi-device heat pipe for stacked MCM-based systems The invention is a computer module for scalably adding computing power and cooling capacity to a computer system. Computing power can be added by merely adding additional printed circuit cards to the computing module. Cooling capability is added by adding... | 04/25/2000 |
| 6052285 | Electronic card with blind mate heat pipes An electronic assembly that includes a heat pipe that extends from an electronic card. The heat pipe has a condenser end that can be inserted into an elastic thermally conductive port of a manifold. The manifold may be part of a cooling system that remove... | 04/18/2000 |
