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| Number | Title | Issue Date |
| 5097387 | Circuit chip package employing low melting point solder for heat transfer A circuit chip package and method for assembling the same is disclosed which employs low eutectic or melting point solder, such as an indium alloy, as a thermally conductive medium between each circuit chip and the package cover. The melting point of the ... | 03/17/1992 |
| 5095404 | Arrangement for mounting and cooling high density tab IC chips A printed circuit board assembly includes a printed circuit board having a top side, a bottom side and a hole. A heat spreader which comprises a plate made of a material having high thermal conductivity is mounted on the bottom side of the printed circuit... | 03/10/1992 |
| 4958257 | Heat conducting interface for electronic module A heat conducting interface unit for use in mounting an electronic module between cooling plates, includes an elongated flexible, U-shaped, highly heat conductive metallic heat exchange member adapted to receive a condenser end of the electronic module. T... | 09/18/1990 |
| 4931905 | Heat pipe cooled electronic circuit card Two metal plates have U-shaped grooves formed therein so that the plates may form congruent halves wherein matching grooves complete independent heat pipes. The bight section of each heat pipe serves as an evaporator section while the parallel arms of eac... | 06/05/1990 |
| 4739296 | Current transformer cooled by a circulating dielectric fluid A current transformer has a hollow tube made from an electrical conductor which is bent at its center so as to form a loop which functions as a primary winding and two parallel straight portions at the ends of the tube which function as leads for the prim... | 04/19/1988 |
| 4733331 | Heat dissipation mechanism for power semiconductor elements A power semiconductor column has power semiconductor elements arranged in alternation with thermally and electrically conductive evaporation blocks. Each evaporation block is connected in a separate heat-dissipating fluid circuit. Each fluid circuit has a... | 03/22/1988 |
| 4727455 | Semiconductor power module with an integrated heat pipe A semiconductor power module includes a metallized ceramic carrier plate having an opening formed therein, a semiconductor power component with a base area of a given size adjacent the ceramic plate at the opening, a heat pipe integrated in the semiconduc... | 02/23/1988 |
| 4727454 | Semiconductor power module A semiconductor power module includes a substrate formed of metallized ceramic, at least one semiconductor power component with a base surface soldered to the metallized ceramic, and at least one heat conduit integrated into the semiconductor power module... | 02/23/1988 |
| 4675783 | Heat pipe heat sink for semiconductor devices A heat pipe heat sink for air cooling of semiconductor devices characterized by arranging heat pipes in a zigzag form toward the direction of air flow around the fin section in the heat sinks. A block for mounting the semiconductor device is fitted to the... | 06/23/1987 |
| 4675785 | Heat distributing diode mounting assembly A diode assembly includes a base plate in which a plurality of diodes are mounted in a circle, uniformly spaced. A heat pipe within the diode circle extends perpendicular to the plate and is surrounded by radiating, heat-dissipating fins extending radiall... | 06/23/1987 |
| 4631573 | Cooled stack of electrically isolated semiconductors Electrical isolation of semiconductors in a stack with interposed heat sinks is attained through the use of a thin sheet 30 of electrical insulating material disposed between first and second, electrically conductive heat sink elements 26, 28, each having... | 12/23/1986 |
| 4513352 | Thermal protection apparatus An apparatus which thermally protects sensitive components in tools used in a geothermal borehole. The apparatus comprises a Dewar within a housing. The Dewar contains heat pipes such as brass heat pipes for thermally conducting heat from heat sensitive c... | 04/23/1985 |
| 4503483 | Heat pipe cooling module for high power circuit boards A heat pipe cooling module assembly (20) for cooling electronic components (28) includes a plurality of heat pipe modules (22) comprising condenser and evaporator sections (24, 26) and working fluid therein. In a preferred embodiment, each evaporator sect... | 03/05/1985 |
| 4414604 | Heat radiation system for electronic devices A container for electronic devices including heat generating elements comprises at least a first vertical wall portion formed therein with a closed conduit system and a heat exchange medium filling said closed conduit system, said heat exchange medium cha... | 11/08/1983 |
| 4366526 | Heat-pipe cooled electronic circuit card A circuit card having the capability for the high-density packaging of electronic components thereon for use in high power-density card racks in computer and other electronic and avionic systems. The card has an all metal construction with an elongated pl... | 12/28/1982 |
| 4358631 | Heat dissipating electrical bushing An improved electrical bushing uses a refrigerant to provide cooling of both the bushing and the electrical apparatus to which the bushing is connected. The refrigerant vaporizes inside the hollow conductor of the bushing at the hot contact end, and flows... | 11/09/1982 |
| 4327399 | Heat pipe cooling arrangement for integrated circuit chips A heat pipe structure comprises a wiring substrate consisting of ceramic or silicon having a cavity in the interior on the inner surface of which is formed a wick and which contains working fluid, and radiating fins formed at the end of the substrate. Int... | 04/27/1982 |
| 4285027 | Cooling system The invention is concerned with a cooling system for cooling telecommunication equipment at an unattended microwave relay station or the like located in desert or like regions where there is a large difference between the maximum daytime temperature and m... | 08/18/1981 |
| 4212349 | Micro bellows thermo capsule A closed two phase liquid-vapor heat transfer device is provided which is independent of orientation and requires no wick. A micro bellows containment vessel is filled with liquid to form a coolant vapor phase bubble which is centered within the vessel du... | 07/15/1980 |
| 4123618 | Vapor-cooled terminal-bushings for oil-type circuit-interrupters An improved vapor-cooled terminal-bushing is provided for increased current-carrying capacity, such as 6,000 amperes, for example, in an oil-type circuit-breaker, being provided with a "dry" body portion, utilizing resinous materials, such as epoxy-resin ... | 10/31/1978 |
| 4120019 | Apparatus for cooling electrical components In a cooling assembly including a heat conductive block mounting an electronic part, and a heat pipe attached to the heat conductive block, a connector connected to the leads of the electronic part is arranged in the heat conductive block.... | 10/10/1978 |
| 4047198 | Transistor cooling by heat pipes having a wick of dielectric powder A micro-electronic package which is capable of operating with power densities extending at least to 10 kilowatts per square centimeter comprises a sealed enclosure coupled to an external heat sink and electronic devices and circuitry within the enclosure.... | 09/06/1977 |
| 4044396 | Heat pipe cooling of airborne phased array radar A system for controlling temperature in phased array radar modules where a combination support plate-heat exchanger allows a cooling fluid to circulate therethrough and a heat pipe extends the length of the module and into the support plate-heat exchanger... | 08/23/1977 |
| 4019098 | Heat pipe cooling system for electronic devices In order to remove heat from integrated circuit modules a layered aluminum heat transfer structure is secured to the upper portion of a circuit board. The heat transfer structure includes a number of heat pipes for transferring heat to a condenser region.... | 04/19/1977 |
| 4009418 | Attachment of heat pipes to electrical apparatus An electrical apparatus, such as a distribution transformer, provided with heat pipes for cooling. The apparatus is provided with attachment wells, either extending into the cooling fluid of the apparatus or secured along the outside wall of the apparatus... | 02/22/1977 |
| 4009417 | Electrical apparatus with heat pipe cooling An electrical apparatus, such as a distribution transformer, having heat pipe cooling. The transformer is provided with a cover in the form of a heat pipe with an evaporator section extending from the cover into the dielectric fluid of the transformer. Th... | 02/22/1977 |
| 4005297 | Vacuum-type circuit interrupters having heat-dissipating devices associated with the contact structures thereof Vacuum "bottles", or vacuum-type circuit interrupters are provided having heat pipes, or reflux condensers provided in the contacts and contact-stems thereof, to remove the generated heat from the interior of the vacuum-interrupter envelope at the contact... | 01/25/1977 |
| 3989095 | Semi conductor cooling system A semi-conductor cooling system formed of a container having a wall portion made of soft yieldable material which is adapted to contact the surface of a semi-conductor device. A porous member is disposed within the container adjacent the inner surface of ... | 11/02/1976 |
| 3989099 | Vapor cooling device for semiconductor device A plurality of semiconductor elements alternating in compressive contact relationship hollow heat dissipation blocks are disposed below a coolant reservoir filled with a condensible coolant in its liquid phase having a liquid surface. The hollow blocks ar... | 11/02/1976 |
| 3978518 | Reinforced transcalent device A semiconductor wafer is sandwiched between the ends of two heat pipes. One end of each heat pipe is in electrical and thermal contact with the wafer. The heat pipes are fastened together so that the wafer is held in compression between the two heat pipes... | 08/31/1976 |
| 3957107 | Thermal switch A sealed extensible bellows containing freon and a flexible wick provide a heat pipe, and fixed end of which is attached to a heat sink (a cold body), the other movable end of the bellows carries a thermally conductive plate that moves from a nonengaging ... | 05/18/1976 |
| 3952797 | Semi conductor cooling system A semi-conductor cooling system formed of a container having a wall portion made of soft yieldable material which is adapted to contact the surface of a semi-conductor device. A porous member is disposed within the container adjacent the inner surface of ... | 04/27/1976 |
