Bizarre Patents
Wearable Device For Feeding and Observing Birds and Other Flying Animals
A device for feeding and observing flying animals comprising a hat, a support mounted on the hat and extending outward from the hat, and a feeder mounted on the support.
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| Number | Title | Issue Date |
| 7485801 | Heat trace or control cable support with insulating jackets A structure is provided that applies support to wiring such as heat trace wiring to the joints and elbows of a marine arm allowing enough flexibility to avoid significant friction in the wiring while accommodating movement of the joints. A removable insulation blank... | 02/03/2009 |
| 7431071 | Fluid circuit heat transfer device for plural heat sources A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources. The evaporator can be an integral vessel made of thermally conductive ... | 10/07/2008 |
| 7426112 | Heat dissipating module A heat dissipating module includes a releasing member, a heat pipe, which has a first end connected to the releasing member and a second end attached to the top surface of a thermal chip on a circuit board, and a fastening member, which has a protruded arch portion ... | 09/16/2008 |
| 7417859 | Heat radiating assembly for plasma display apparatus and plasma display apparatus including the same A heat radiating assembly employable by a plasma display apparatus for radiating heat generated by a signal transmission unit, which transmits electric signals from a circuit unit that drives a plasma display panel and includes an electronic device covered by a prot... | 08/26/2008 |
| 7414850 | Heat dissipation module for electronic device A heat dissipation module for removing heat from a heat-generating electronic component includes a base (106) and a clip (40, 40a). The clip includes a connecting arm (42, 42a) and a securing arm (44, 44a) for locking... | 08/19/2008 |
| 7414848 | Heat dissipation device A heat dissipation device includes a base and two heat sinks formed by aluminum extrusion and located on the base. Each heat sink includes a heat conducting portion. The two heat sinks include a plurality of first fins extending inwardly from first faces of the heat... | 08/19/2008 |
| 7397667 | Cooler module and its fastening structure A cooler module mounted on a CPU on a circuit board inside a computer is disclosed to include a mounting base frame, which is made of a thermal conductive material and has a heat-transfer zone disposed in contact with the CPU and two arms respectively extended from ... | 07/08/2008 |
| 7391613 | Memory module assembly including a clamp for mounting heat sinks thereon A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp ( | 06/24/2008 |
| 7388747 | Heat plate fixing structure A heat plate fixing structure is provided, suitable for being used in the heatsink structure of the heating element for an electronic device, which is provided with a support part and a fixing piece, wherein the fixing piece is fixed onto the internal side of the to... | 06/17/2008 |
| 7388752 | Series-connected heat dissipater coupled by heat pipe A series-connected heat dissipater coupled by heat-pipe used for the interface cards of a computer system. Wherein, a plurality of additional auxiliary dissipaters are provided onto the insertion slots adjacent to the interface cards, and are connected to the main d... | 06/17/2008 |
| 7385820 | Heat dissipation module A heat dissipation module for removing heat from a heat generating component, includes a block, a heat pipe and a fin unit. The block includes a first surface and a second surface. One end of the heat pipe is thermally attached to the fin unit, and the other end of ... | 06/10/2008 |
| 7382047 | Heat dissipation device A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fi... | 06/03/2008 |
| 7382616 | Cooling system for computer hardware The present invention represents a significant advancement in the field of cooling systems for computer hardware. In one embodiment, a system for cooling a heat-generating electronic device is provided. The system is mountable to a first side of a circuit board. The... | 06/03/2008 |
| 7365978 | Heat dissipating device A heat dissipating device includes a heat sink (60), a radiator (70) and heat-transfer pipes (80). The heat sink includes a chassis (62), a plate (64) separate from the chassis and a plurality of fins (66) extending between ... | 04/29/2008 |
| 7365982 | Liquid cooling device A liquid cooling device (10) includes a heat sink (12), a reservoir (14) containing liquid therein and distant from the heat sink, and a heat-transfer member. The heat-transfer member includes a heat-absorbing segment (162) contacting the... | 04/29/2008 |
| 7342785 | Cooling device incorporating boiling chamber A cooling device incorporating a boiling chamber includes a heat sink (10), a fan (30) and a fan duct (50) covering the heat sink and the fan therein. The heat sink includes a chamber (14) receiving liquid (26) therein and a mounti... | 03/11/2008 |
| 7339787 | Heat sink module for dissipating heat from a heat source on a motherboard A heat sink module includes a fan set and a heat sink plate. The fan set is integrated as a whole, reducing manufacture time, and the material of the fan set is plastic, thus reducing the weight as well. Due to the hook design of the fan set and the ear design of th... | 03/04/2008 |
| 7336488 | Radiator mechanism and electronic apparatus having same It is an exemplified object of the present invention to provide a radiator mechanism and electronic apparatus having the radiator mechanism that can prevent destruction, deterioration, and malfunction due to heat of exoergic components or other electronic components... | 02/26/2008 |
| 7336489 | Waterproof thermal management module and portable A waterproof thermal management module for a portable electronic device that including a housing and a heat source is disclosed. The waterproof thermal management module includes a separated chamber, a heat absorber, a radiator, a heat pipe and a fan. The separated ... | 02/26/2008 |
| 7333336 | Heat radiating apparatus A heat radiating apparatus is provided which includes a heat sink configured to be positioned in thermal contact with a heat source in order to take heat from the heat source, at least one heat pipe having a portion connected to the heat sink and configured to trans... | 02/19/2008 |
| 7333334 | Liquid cooling system and electronic equipment using the same For cooling of an electronic equipment, a heat receiving jacket, to which piping extended outside the electronic equipment is connected, is mounted to a heat generating element in the electronic equipment, a radiator, a cooling-liquid tank, a pump, and a pipe, which... | 02/19/2008 |
| 7333332 | Heatsink thermal module with noise improvement The invention provided a heatsink thermal module with noise improvement, which has a heatsink thermal module additionally consisting of a heat pipe, a heatsink fins set and a fan module; the fan module is combined with the heatsink fins set which consists of multipl... | 02/19/2008 |
| 7327571 | Thermal load balancing systems and methods Systems and methods for implementing thermal load balancing are disclosed. In an exemplary embodiment, a thermal load balancing system for a multiprocessor computer having a plurality of processors may comprise a heat sink network having a plurality of local heat si... | 02/05/2008 |
| 7327576 | Heat dissipation device A heat dissipation device for being installed to and cooling an electronic card device (40) includes first and second heat dissipation units (10, 20) and at least one heat pipe (30). The heat dissipation units each include a base plate (12, 2... | 02/05/2008 |
| 7324341 | Electronics assembly and heat pipe device An electronics assembly is provided having a heat pipe device for cooling electronics. The assembly includes a substrate and an electronics package supported on the substrate. The assembly also includes a heat pipe device in thermal communication with an exposed sur... | 01/29/2008 |
| 7321491 | Heat sink for a portable computer A heat sink (200) for a portable computer (100) includes a plurality of fins (210) located external to the portable computer, a conducting plate (230) extending into an inner space of the portable computer for absorbing heat in the portab... | 01/22/2008 |
| 7319588 | Heat dissipation device A heat dissipation assembly includes a printed circuit board, first and second heat dissipation units each defining a channel therein and a heat pipe. The printed circuit board has an electronic heat-generating component mounted thereon. The first heat dissipation u... | 01/15/2008 |
| 7317615 | Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a p... | 01/08/2008 |
| 7304846 | Heatsink device of video graphics array and chipset Disclosed is a heatsink device of video graphics array (VGA) and chipset. The main characteristic is making an integrated design for heatsink devices. Using a heatsink plate stacks on VGA and chipset instead of several ones as before. The heatsink plate has more hea... | 12/04/2007 |
| 7299859 | Temperature control of thermooptic devices A low power or passive optical apparatus provides temperature control of dynamic thermooptic devices and temperature-sensitive optical devices formed on the same substrate. The optical apparatus includes a variable heat transfer device with a conductive heat transfe... | 11/27/2007 |
| 7295435 | Heat sink having ferrofluid-based pump for nanoliquid cooling A heat sink uses a ferrofluid-based pump assembly for controlling the direction of nanofluid flow within the heat sink. The nanofluid is thermally conductive and absorbs heat from a heat source, which is then directed away from the heat source by the ferrofluid-base... | 11/13/2007 |
| 7295436 | Cooling system for computer components A power supply housing (12) is mounted inside of a computer housing (10). Housing (12). It includes components (34) that generate heat when the computer is being used. The power supply housing (12) is sealed in order to make it lea... | 11/13/2007 |
| 7280358 | Liquid loop with multiple heat exchangers for efficient space utilization A liquid loop cooling system, a tubing encloses an interior lumen within which a cooling fluid can circulate. A plurality of heat exchangers is coupled to the tubing and is configured within in a constrained space in conformance to space availability. ... | 10/09/2007 |
| 7277282 | Integrated circuit cooling system including heat pipes and external heat sink An apparatus includes an integrated circuit (IC) package and a heat sink having a base and a plurality of fins extending from the base. The apparatus further includes a plurality of heat pipes. Each heat pipe has a first end and a second end. The first ends of the h... | 10/02/2007 |
| 7277286 | Computers Provided is a computer. The computer includes: a plurality of parts including heat-generating components that generate heat during operation; a case in which the parts are installed; and one or more heat-dissipating plates separated from the case by a predetermined ... | 10/02/2007 |
| 7274571 | Heatsink A method according to one embodiment may include providing a heatsink having a base having a first region with a thickness greater than a second region. The heatsink may further include a plurality of fins extending from the base with at least one fin oriented at an... | 09/25/2007 |
| 7269013 | Heat dissipation device having phase-changeable medium therein A heat dissipation device includes a heat dissipation body and a heat conducting body thermally combined with the heat dissipation device. The heat dissipation body includes a central portion defining a through hole therein and a plurality of fin extending from a pe... | 09/11/2007 |
| 7262965 | Thermal structure for electric devices A thermal structure includes a fin module, a heat sink base, a heat pipe, a fan housing, and a fan. One end of the heat pipe is connected with the fin module and the other end of the heat pipe is installed on the heat sink base. The fan housing is fixed on the fin m... | 08/28/2007 |
| 7254019 | Heat dissipation module for hinged mobile computer A heat dissipation module for a mobile computer, the mobile computer having a base (10) and a display unit (20) pivotally coupled to the base, the base having a number of through holes (13) defined on a shell (18) thereof, the heat dissip... | 08/07/2007 |
| 7250674 | Coolant cooled type semiconductor device A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semicond... | 07/31/2007 |
