Did You Know...
...that in 1800 ether was first used by partyers as a fun diversion? Sniffing the gas led to hilarious and raucous laughter as people watched each other become more and more intoxicated and silly. Several doctors independently realized the value ether would have to anesthetize surgery patients. Of those who claimed rights to the "discovery," none had a happy ending. One had a seizure and died defending his rights. Another spent his life in an asylum because he had been denied acclaim. A third became addicted to chloroform and, in a New York City jail, he soaked a cloth in the drug, severed an artery and bled to death.
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| Number | Title | Issue Date |
| 7213636 | Cooling assembly with impingement cooled heat sink The subject invention provides a cooling assembly for removing heat from an electronic device. The cooling assembly includes a heat sink having a base plate and a plurality of fins extending upwardly from the base plate to a top extremity. A nozzle directs a flow of... | 05/08/2007 |
| 7215546 | Pump, electronic apparatus, and cooling system The present invention provides a cooling pump, an electronic apparatus, and a cooling system in which positioning between a heat generating unit and a cooling pump can be achieved easily. The cooling pump according to the invention includes: a rotor having a disk-sh... | 05/08/2007 |
| 7215547 | Integrated cooling system for electronic devices The present invention provides a method for producing an electronic assembly and an electronic assembly with an integrated cooling system for dissipating heat. The electronic assembly comprises a base; and at least one electrical component attached to the base. The ... | 05/08/2007 |
| 7215545 | Liquid cooled diamond bearing heat sink A liquid cooled heat sink for cooling integrated and power modules. The heat sink is formed of a Diamond, Silicon Carbide composite and is provided with heat transfer facilitating fins and an enclosure for routing the cooling liquid into heat transfer contact with t... | 05/08/2007 |
| 7212407 | Electrical power converter method and system employing multiple output converters A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI ... | 05/01/2007 |
| 7212404 | Integrated heat sink device An integrated heat sink device, which is utilized to dissipate the heat generated by heat-generating elements with different angles of radiation surface (for instance, CPU and display chip are with radiation surfaces at 180° and 90°), is provided. The integrated h... | 05/01/2007 |
| 7212406 | Cooling of electrical components with split-flow closed-end devices A cooling system (11) is provided for electrical components (10, 90) in which passageways (21) are inserted in non-magnetic cores of the electrical components, and in which the passageways (21) provide both inflow and outflow of a cooling... | 05/01/2007 |
| 7212405 | Method and apparatus for providing distributed fluid flows in a thermal management arrangement Embodiments of the present invention include an apparatus, method, and system for providing a flow distributive interface for a thermal management arrangement. ... | 05/01/2007 |
| 7209355 | Cooling device and an electronic apparatus including the same A cooling device for cooling a heat-generating component includes a circulating passage arranged to have coolant circulate therein, a centrifugal pump including a first case made of metallic material, a second case made of resin material, and an impeller accommodate... | 04/24/2007 |
| 7204299 | Cooling assembly with sucessively contracting and expanding coolant flow A fluid heat exchanger assembly having an upper wall and a lower wall extending between the inlet and the outlet for establishing a direction of flow to cool an electronic device. A plurality of projections extend linearly transversely across the direction of flow t... | 04/17/2007 |
| 7204303 | Flat tube cold plate assembly A flat tube cold plate assembly has a channel plate having an opening therethrough defining a flow path. A plurality of flat tubes is retained within the opening in the channel plate along the flow path. A plurality of fins extends within the interior of the flat tu... | 04/17/2007 |
| 7204298 | Techniques for microchannel cooling Techniques for heat transfer are provided. In one aspect of the invention, a heat-transfer device is provided. The heat-transfer device comprises one or more microchannels suitable for containing a heat-transfer fluid, one or more of the microchannels having protrud... | 04/17/2007 |
| 7206203 | Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins An electronic device cooling assembly and fabrication method are provided which include a manifold with an orifice for injecting a cooling liquid onto a surface to be cooled, and an elastic pin support material with an opening aligned to the orifice of the manifold.... | 04/17/2007 |
| 7205057 | Integrated fuel cell and heat sink assembly The invention is an integrated heat sink fuel cell assembly made of a heat sink assembly with a base and at least one cooling fin extending from the base, at least one connector extending from the heat sink assembly to a heat source, and at least one fuel cell compr... | 04/17/2007 |
| 7204832 | Cooling system for a photo cosmetic device Photocosmetic device for use in medical or non-medical environments (e.g., a home, barbershop, or spa), which can be used for a variety of tissue treatments. Radiation is delivered to the tissue via optical systems designed to pattern the radiation and project the r... | 04/17/2007 |
| 7201217 | Cold plate assembly A cold plate assembly, which in one embodiment includes a manifold layer comprising one or more input coolant sub-manifold channels and one or more output coolant sub-manifold channels. A metering plate having a plurality of orifices defined there through is dispose... | 04/10/2007 |
| 7201214 | Remedies to prevent cracking in a liquid system A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are desig... | 04/10/2007 |
| 7203064 | Heat exchanger with cooling channels having varying geometry A device may include an integrated circuit chip and channels to carry a coolant. The channels may be proximate to an upper surface of the integrated circuit chip, and the channels may extend along a length of the integrated circuit chip. A density of the channels ma... | 04/10/2007 |
| 7203063 | Small form factor liquid loop cooling system An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the comp... | 04/10/2007 |
| 7201012 | Remedies to prevent cracking in a liquid system A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are desig... | 04/10/2007 |
| 7200934 | Electronic assemblies with high capacity heat sinks and methods of manufacture An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan a... | 04/10/2007 |
| 7200007 | Power stack A power stack includes cooling pipes and semiconductor modules which are alternately laminated. Each cooling pipe includes an inside space dissected into cooling passages in which coolant flows. Both surfaces of the semiconductor module in a laminating direction are... | 04/03/2007 |
| 7198096 | Stacked low profile cooling system and method for making same A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the l... | 04/03/2007 |
| 7197819 | Method of assembling an electric power A method of assembling and providing an electric power apparatus. The method uses a heat resistant housing having a structure adapted to accommodate and retain a power circuit card and also including a bracket adapted to accommodate and constrain a rigid conductive ... | 04/03/2007 |
| 7193850 | Integrated heat removal and vibration damping for avionic equipment An electronic equipment rack system supports a printed wire board (PWB) assembly having a structural stiffener with a heat pipe mounted therein. The heat pipe is mounted within the structural stiffener directly adjacent the printed wire board to conduct thermal ener... | 03/20/2007 |
| 7193316 | Integrated circuit coolant microchannel with movable portion According to some embodiments, a microchannel is provided to transport a coolant. The microchannel may be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. Moreover, a movable portion may be provided to adjust a volume o... | 03/20/2007 |
| 7193854 | Using a leaf spring to attach clamp plates with a heat sink to both sides of a component mounted on a printed circuit assembly A heat sink assembly for cooling a component is disclosed, the heat sink assembly comprising a printed circuit board; a clamp plate; a waterblock cooling device; and a force attachment component to attach the clamp plate and the waterblock cooling device with the pr... | 03/20/2007 |
| 7190581 | Low thermal resistance power module assembly A power module assembly with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate with passageways or openings for coolant that extend through the plate from a lower surface to an upper surface... | 03/13/2007 |
| 7190582 | Cooling device, electronic equipment device, and method of manufacturing cooling device A compact, thin type and high cooling performance cooling device, an electronic apparatus and a method of manufacturing the same are provided. The cooling device (1) has a pair of a first substrate (2) and a second substrate (3) which are made o... | 03/13/2007 |
| 7188667 | Liquid cooling structure for electronic device A structure for cooling an electronic device. The structure includes a first layer disposed over the electronic device for providing a heat path from the electronic device and a bottom layer including a fin structure and a lower surface opposite the fin structure, w... | 03/13/2007 |
| 7190583 | Self contained, liquid to air cooled, memory test engineering workstation Although various embodiments of the method and apparatus of the present invention have been illustrated in the accompanying Drawings and described in the foregoing Detailed Description, it will be understood that the invention is not limited to the embodiments discl... | 03/13/2007 |
| 7188662 | Apparatus and method of efficient fluid delivery for cooling a heat producing device A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the ... | 03/13/2007 |
| 7190580 | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices. Apparatus for microchannel cooling include integrated... | 03/13/2007 |
| 7187550 | Gasketed field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components A field-replaceable active pumped liquid heat sink module includes a liquid pump, a radiator, an optional receiver, and a gasketed cold heat exchanger box, all of which are connected together in a liquid pump loop through which a coolant such as water is circulated.... | 03/06/2007 |
| 7187548 | Power converter having improved fluid cooling A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting... | 03/06/2007 |
| 7185697 | Electroosmotic microchannel cooling system Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as wel... | 03/06/2007 |
| 7187549 | Heat exchange apparatus with parallel flow In at least one embodiment, the present invention is a heat exchange apparatus which includes at least one heat exchanger, an intake manifold, and at least one multichip module. Where the intake manifold is in fluid communication with each heat exchanger and where t... | 03/06/2007 |
| 7187568 | Power converter having improved terminal structure A terminal structure for power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat fr... | 03/06/2007 |
| 7184269 | Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly A cooling apparatus for an electronics assembly having a substrate and one or more electronics devices includes an enclosure sealably engaging the substrate to form a cavity, with the electronics devices and a heat exchange assembly being disposed within the cavity.... | 02/27/2007 |
| 7182125 | Low profile heat exchanger with notched turbulizer A multi-pass heat exchanger including first and second plates forming a fluid chamber therebetween having an inlet opening and an outlet opening, and a turbulizer plate having rows of fluid flow augmenting convolutions in the fluid chamber, the turbulizer plate incl... | 02/27/2007 |
