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| Number | Title | Issue Date |
| 4020399 | Vapor cooling device for dissipating heat of semiconductor elements A plurality of semiconductor elements alternating with hollow heat dissipation blocks are connected together into a unitary structure by means of a fastening mechanism and disposed below a coolant reservoir. The hollow blocks are connected in fluid commun... | 04/26/1977 |
| 4019098 | Heat pipe cooling system for electronic devices In order to remove heat from integrated circuit modules a layered aluminum heat transfer structure is secured to the upper portion of a circuit board. The heat transfer structure includes a number of heat pipes for transferring heat to a condenser region.... | 04/19/1977 |
| 4012770 | Cooling a heat-producing electrical or electronic component Vapor chamber-containing apparatus is provided for cooling heat-producing electrical and electronic components wherein the heat is absorbed by a vaporizable agent.... | 03/15/1977 |
| 4010489 | High power semiconductor device cooling apparatus and method A heat sink assembly is described for cooling right cylindrical packages containing high power semiconductor devices. Opposite end faces of the packages cooperate with heat sink members to provide liquid coolant flow channels in which the liquid coolant i... | 03/01/1977 |
| 4009423 | Liquid cooled heat exchanger for electronic power supplies A liquid cooled heat exchanger particularly adapted to cool heat sinks of an electrical power supply for large electronic systems. The heat exchanger has thin flexible walls. Pressure of the coolant within the heat exchanger assures a positive mechanical ... | 02/22/1977 |
| 3996604 | Vapor cooled semiconductor device having an improved structure and mounting assembly A vapor cooled semiconductor device which comprises an envelope having at least one aperture, at least one semiconductor element enclosed therein, an electrode contacting the semiconductor element and exposed across the aperture of the envelope, an expand... | 12/07/1976 |
| 3993123 | Gas encapsulated cooling module A gas encapsulated cooling unit is provided for one or more heat generating components mounted on a substrate. A heat conductive cap is sealed to the substrate enclosing the heat generating components. The wall of the cap opposite the substrate contains e... | 11/23/1976 |
| 3989099 | Vapor cooling device for semiconductor device A plurality of semiconductor elements alternating in compressive contact relationship hollow heat dissipation blocks are disposed below a coolant reservoir filled with a condensible coolant in its liquid phase having a liquid surface. The hollow blocks ar... | 11/02/1976 |
| 3984861 | Transcallent semiconductor device Metal plates of tungsten or molybdenum, having an optimum thickness of 1000 micrometers or less, are bonded to respective cathode and anode electrical coatings on the opposed major surfaces of a semiconductor wafer. The metal plates in turn are conductive... | 10/05/1976 |
| 3978518 | Reinforced transcalent device A semiconductor wafer is sandwiched between the ends of two heat pipes. One end of each heat pipe is in electrical and thermal contact with the wafer. The heat pipes are fastened together so that the wafer is held in compression between the two heat pipes... | 08/31/1976 |
| 3972063 | Vapor cooled semiconductor device enclosed in an envelope having a compression mechanism for holding said device within said envelope A stack including a semiconductor element and the associated components is held within a lower portion of a hermetic envelope between its side wall and a closure block movably secured to its opposite side wall to close an opening on the latter and is imme... | 07/27/1976 |
| 3971435 | Heat transfer device The invention contemplates a heat-transfer device or heat pipe characterized by integral screen-wick structure providing relatively great contact area between the internal working fluid or condensable medium and the heat input.... | 07/27/1976 |
| 3952797 | Semi conductor cooling system A semi-conductor cooling system formed of a container having a wall portion made of soft yieldable material which is adapted to contact the surface of a semi-conductor device. A porous member is disposed within the container adjacent the inner surface of ... | 04/27/1976 |
| 3946429 | Self-fusing transcalent electrical device A cooling chamber is bonded to an electrical device to be cooled. The chamber includes a metal wall connecting the device into the working electrical circuit. A thinned portion of the metal wall forms a fuse which will burn out due to an excessive flow of... | 03/23/1976 |
