Did You Know...
...that Robert Adler has the dubious distinction of being the Father of the Couch Potato? Back in 1955 Adler was employed by what was then Zenith Radio Corp., where he was charged to invent something that would allow viewers to turn down the TV volume without leaving their chairs. After a series of flops (such as a wired contraption that people tripped over), Adler hit on the idea of using sound waves. Thus the Remote Control was born...
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| Number | Title | Issue Date |
| 7414843 | Method and apparatus for a layered thermal management arrangement Embodiments of the present invention include an apparatus, method, and system for providing a layered thermal management arrangement. Embodiments of the present invention provide a layered thermal management arrangement, including a plurality of first channels, one ... | 08/19/2008 |
| 7414845 | Circuit board assembly for a liquid submersion cooled electronic device A circuit board assembly, for example, a computer motherboard, for use in a liquid submersion cooled electronic device, for example, a computer, is configured to facilitate movement of the cooling liquid when the circuit board is submerged in the cooling liquid, the... | 08/19/2008 |
| 7414846 | Cooling structure for interface card A cooling structure for interface card for cooling the heating component on an interface card includes a heat sink, a metallic hood, and a water block, wherein the heat sink has a heat conducting seat and a plurality of cooling fins, while the heat conducting seat i... | 08/19/2008 |
| 7411791 | Extendable heat dissipation apparatus An extendable heat dissipation apparatus includes a base, an extendable heat dissipation member and a connecting element. A normal fin is formed on the base, and the connecting element integrates the extendable heat dissipation member in the apparatus with the base.... | 08/12/2008 |
| 7408776 | Conductive heat transport cooling system and method for a multi-component electronics system A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate phy... | 08/05/2008 |
| 7408778 | Heat sinks for dissipating a thermal load Heat sinks for dissipating a thermal load are disclosed that include: a heat sink base capable of receiving a thermal load from a thermal source; heat-dissipating fins mounted on the heat sink base, each heat-dissipating fin enclosing a hollowed cavity inside the he... | 08/05/2008 |
| 7408775 | Electrical module and support therefor with integrated cooling A rack system is disclosed that includes a plurality of electrical modules (48), a frame (10) supporting the plurality of electrical modules (48) that includes a plurality of frame members (16, 18, 20, 22, 26, 38, 39, 40) and a plurality ... | 08/05/2008 |
| 7408780 | Compliant thermal interface structure utilizing spring elements with fins A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at leas... | 08/05/2008 |
| 7404433 | Liquid cooled heat sink A liquid cooled heat sink includes: a casing defining an inner space and provided with a partitioning wall dividing the inner space into upper and lower chambers and formed with a fluid passage in fluid communication with the upper and lower chambers, the casing bei... | 07/29/2008 |
| 7403392 | Liquid submersion cooling system A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electroni... | 07/22/2008 |
| 7400503 | Systems for low cost coaxial liquid cooling According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger coupled to a pump, wherein the heat exchanger and the pump are oriented w... | 07/15/2008 |
| 7400502 | Connector heat transfer unit A connector heat transfer unit is presented. A number of embodiments are presented. Each embodiment includes a housing capable electrically connecting one or more heat generating components to an electronic system and cooling the heat generating components. ... | 07/15/2008 |
| 7400500 | Low-power compact computer A low-power compact computer comprises a processor having relatively low-power consumption, a supporting chipset having conventional power consumption, and a conventional random access memory storage circuit. ... | 07/15/2008 |
| 7400505 | Hybrid cooling system and method for a multi-component electronics system A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be... | 07/15/2008 |
| 7400504 | Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at le... | 07/15/2008 |
| 7398818 | Fluidic pump for heat management A heat producing device is placed in contact with a heat exchanger that is fluidically coupled to a fluid pump. The fluid pump operates to pumps fluid through a closed fluidic system between the heat exchanger and a spot where the heat can be dissipated. In an aspec... | 07/15/2008 |
| 7397662 | Electronic card unit and method for removing heat from a heat-generating component on a printed circuit board A heat-radiating structure of an electronic card unit is compact and reinforces a printed circuit board while improving heat radiation efficiency. Card unit 6 has dual function reinforcing plate-heat dissipaters 17 and 18 at the upper and lower ... | 07/08/2008 |
| 7397664 | Heatspreader for single-device and multi-device modules A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric base coupled to the perimeter of the heatsink base. Each of the slider p... | 07/08/2008 |
| 7394655 | Absorptive cooling for electronic devices Embodiments of this invention include active electrical components withing a housing that contains an absorptive cooler. The absorptive cooler is used to cool active electrical components, such as central processors or other heat-sensitive components. In some embodi... | 07/01/2008 |
| 7391613 | Memory module assembly including a clamp for mounting heat sinks thereon A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp ( | 06/24/2008 |
| 7391612 | Dual impeller push-pull axial fan sink A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 06/24/2008 |
| 7390427 | Hydrofluoroether as a heat-transfer fluid The present invention provides an apparatus comprising a device and a mechanism for heat transfer comprising a hydrofluoroether heat-transfer fluid wherein the heat transfer fluid is represented by the following structure: Rf—O—Rh... | 06/24/2008 |
| 7388746 | Heatsink assembly A heatsink assembly having a simple structure for coupling a heatsink and an electronic chip is provided with a heatsink which contacts an electronic chip mounted on a substrate and absorbs heat generated from the electronic chip; and a pressing member which is coup... | 06/17/2008 |
| 7388747 | Heat plate fixing structure A heat plate fixing structure is provided, suitable for being used in the heatsink structure of the heating element for an electronic device, which is provided with a support part and a fixing piece, wherein the fixing piece is fixed onto the internal side of the to... | 06/17/2008 |
| 7388752 | Series-connected heat dissipater coupled by heat pipe A series-connected heat dissipater coupled by heat-pipe used for the interface cards of a computer system. Wherein, a plurality of additional auxiliary dissipaters are provided onto the insertion slots adjacent to the interface cards, and are connected to the main d... | 06/17/2008 |
| 7385817 | Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coola... | 06/10/2008 |
| 7385816 | Dual impeller push-pull axial fan heat sink A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 06/10/2008 |
| 7385821 | Cooling method for ICS The present invention is a cooling device for removing heat from an integrated circuit. In one embodiment, the cooling device includes a conduit and a flexible channel having a first open end and a second closed end. The flexible channel's first open end has an inte... | 06/10/2008 |
| 7385815 | Dual impeller push-pull axial fan A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 06/10/2008 |
| 7382616 | Cooling system for computer hardware The present invention represents a significant advancement in the field of cooling systems for computer hardware. In one embodiment, a system for cooling a heat-generating electronic device is provided. The system is mountable to a first side of a circuit board. The... | 06/03/2008 |
| 7380409 | Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and actuation mechanism. The isolation valve is disposed within at least one of ... | 06/03/2008 |
| 7379301 | Integrated liquid cooling system An integrated liquid cooling system for removing heat from a heat-generating component includes a base (10), a pump (20) mounted in the base and a heat-dissipating member (30) communicating with the pump and coupling with the base. The pump incl... | 05/27/2008 |
| 7375962 | Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surfac... | 05/20/2008 |
| 7373967 | Mechanical assembly, for regulating the temperature of an IC-Chip, having a gimbaled heat-exchanger with coiled springy conduits A mechanical assembly for regulating the temperature of an IC-chip in an IC-module includes: a) a heat-exchanger having a first face for contacting a second face on the IC-module; and b) a gimbal, coupled to the heat-exchanger, for tilting and pressing the first fac... | 05/20/2008 |
| 7372698 | Electronics equipment heat exchanger system An electronics equipment heat exchanger system for thermally managing the electronic devices of a computer server and the exhaust air emitted from the computer server. The electronics equipment heat exchanger system generally includes a heat exchanger attached near ... | 05/13/2008 |
| 7371615 | Heat sink and method for its production A method for producing a heat sink for cooling a semiconductor device including forming plural base members, the base member being each in plate or block-shape, the base member each having paths shaped on one or both sides of surfaces thereof, and the base member ea... | 05/13/2008 |
| 7372697 | Cooling device and electronic apparatus According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates; a heat-receiving section thermally connected to a heating element; and a heat-sinking section for dissipating heat received by the h... | 05/13/2008 |
| 7369410 | Apparatuses for dissipating heat from semiconductor devices An apparatus for providing two-phase heat transfer for semiconductor devices includes a vapor chamber configured to carry a cooling liquid, the vapor chamber having base section, and a plurality of three-dimensional (3D) shaped members. The plurality of 3D-shaped me... | 05/06/2008 |
| 7369409 | Apparatus, method, and control program for cooling electronic devices A thermal distribution detecting unit detects a thermal distribution state on a surface of an electronic device. An emission control unit identifies a position to be cooled in accordance with the thermal distribution state detected. A nozzle selecting unit selects a... | 05/06/2008 |
| 7369412 | Heat dissipation device A heat dissipation device used for dissipating heat from heat generating electronic components mounted on an interface card, which has a mounting bracket for being mounted to a computer case, includes a heat-absorbing member, a pair of heat pipes and a pair of heat-... | 05/06/2008 |
