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| Number | Title | Issue Date |
| 7139172 | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices having a non-uniform power density distribution, which... | 11/21/2006 |
| 7134486 | Control of electrolysis gases in electroosmotic pump systems Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as wel... | 11/14/2006 |
| 7135246 | Electronic apparatus having energy-saving cooling system An electronic apparatus includes a component to which a pressure is applied or which provides vibration, a heat absorbing member, a heat dissipating member, an elastomer bag which receives a pressure or the vibration from the component, a first check valve connected... | 11/14/2006 |
| 7135877 | Temperature and condensation control system for functional tester An innovative chip testing system and method includes controlling temperature and condensation during testing. Coarse temperature is controlled by providing a desired fluid flow rate and fluid temperature to a cold plate. Fine temperature control is provided by a fe... | 11/14/2006 |
| 7134484 | Increased efficiency in liquid and gaseous planar device cooling technology A two loop heat conversion system for high heat density planar devices in which high density heat in an area adjacent to a surface is transferred into a liquid cooling medium closed loop in a radiated heat to liquid heat transfer component positioned in contact with... | 11/14/2006 |
| 7133283 | Frame-level thermal interface component for transfer of heat from an electronic component of a computer system A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from ... | 11/07/2006 |
| 7131487 | Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers An apparatus for cooling heat producing devices is disclosed. In one embodiment, the apparatus includes a heat absorber attached to a first end of a base. Both the base and the heat absorber may be formed of a thermally conductive material, and a width of the heat a... | 11/07/2006 |
| 7131486 | Electroosmotic microchannel cooling system Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as wel... | 11/07/2006 |
| 7128133 | Hydrofluoroether as a heat-transfer fluid The present invention provides an apparatus comprising a device and a mechanism for heat transfer comprising a hydrofluoroether heat-transfer fluid wherein the heat transfer fluid is represented by the following structure: Rf—O—Rh... | 10/31/2006 |
| 7128134 | Heat dissipation module A heat dissipation module is disclosed for providing good heat-dissipating efficiency. First and second cases correspond to each other, with a heat conducting structure connecting to an opening of the second case. The first and second cases and the heat conducting s... | 10/31/2006 |
| 7128140 | Heat sinks A heat sink (100) includes a cooling block (105) having a plurality of fins (110) extending through the block to provide a series of coolant channels (112) extending between the fins, the channels having in the interior of the block a ven... | 10/31/2006 |
| 7129731 | Heat pipe with chilled liquid condenser system for burn-in testing A burn-in testing cooling system includes a heat pipe having a tubular body. A capillary wick is disposed on an evaporator portion of the tubular body, and a base seals off the evaporator portion. The base is sized and shaped so as to be releasably thermally engaged... | 10/31/2006 |
| 7124811 | Systems for integrated pump and cold plate According to some embodiments, systems for an integrated pump and cold plate may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein... | 10/24/2006 |
| 7124775 | Micro pump device with liquid tank A micro pump device with liquid tank comprises a liquid tank being made of transparent material; and a micro pump having an inlet positioned in center of the liquid tank and the micro pump locating the side of said liquid tank. And, the liquid tank further includes ... | 10/24/2006 |
| 7126822 | Electronic packages, assemblies, and systems with fluid cooling To accommodate high power densities associated with high-performance integrated circuits, an integrated circuit (IC) package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to a heat spreader. The heat spreader ha... | 10/24/2006 |
| 7121333 | Radiator sheet The present invention relates to a radiator sheet improvement and more particularly to a structure with enhanced strength and increased heat exchange surface after assembling, which is achieved first by forming large holes and adjacent small holes on each radiator s... | 10/17/2006 |
| 7123479 | Enhanced flow channel for component cooling in computer systems An evaporator having an enhanced flow channel design for use in a computer system is described. Specifically, micro-channels of the evaporator comprise nucleation sites and different channel widths. The enhanced flow channel design improves heat transfer from a comp... | 10/17/2006 |
| 7117931 | Systems for low cost liquid cooling According to some embodiments, systems for low cost liquid cooling may be provided. In some embodiments, a system may comprise a core having a first end and a second end, wherein the core defines a cavity extending between the first and second ends, a plurality of f... | 10/10/2006 |
| 7117930 | Heat pipe fin stack with extruded base A heat sink has a base plate to be clamped against a heat source and one or more heat pipes containing a phase change fluid. Each heat pipe has an elongated tubular evaporator fitted in a channel in the base plate, and a columnar condenser part perpendicular to the ... | 10/10/2006 |
| 7120021 | Liquid cooling system Liquid cooling systems and apparatus and data processing systems and communication systems with liquid cooling systems are presented. A number of embodiments are presented. In each embodiment a plurality of heat transfer systems capable of engaging a plurality heat ... | 10/10/2006 |
| 7120022 | Loop thermosyphon with wicking structure and semiconductor die as evaporator A loop thermosyphon system has a semiconductor die with a plurality of microchannels. A condenser is in fluid communication with the microchannels. A wicking structure wicks fluid between the condenser to the semiconductor die. ... | 10/10/2006 |
| 7117928 | Heat sinks for a cooler A heat sink includes a base having a first side in contact with a heat-generating electronic element and a second side opposed to the first side. Fins are formed on the second side of the base. A non-rectilinear air channel is formed between two adjacent fins, with ... | 10/10/2006 |
| 7120027 | Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures Structures and methods for mounting electronic devices and associated heat sinks to computer modules and other structures are described herein. In one embodiment, a structure for holding a heat sink in contact with an electronic device includes an electronic device ... | 10/10/2006 |
| 7114556 | Burn-in oven heat exchanger having improved thermal conduction A heat exchange system that can accommodate a high power integrated circuit chip for burn-in temperature stressing includes a heat sink having a chip engaging surface that is adapted to engage a surface of the chip. A liquid layer fills a heat exchange gap between t... | 10/03/2006 |
| 7114550 | Cooling device for heat-generating elements A cooling device for cooling heat generating elements in which a cooling effect is produced by collision of a coolant with the back face side of heat-generating elements (1). The coolant (10) is introduced into a coolant introduction chamber (3)... | 10/03/2006 |
| 7114551 | Liquid cooling module A cooling module designed so that the following components are stacked above a CPU: a cooling jacket allowing a cooling liquid to absorb heat generated by the CPU, a pump causing the cooling liquid to circulate, a reserve tank used to provide a supplementary cooling... | 10/03/2006 |
| 7115987 | Integrated stacked microchannel heat exchanger and heat spreader Integrated stacked microchannel heat exchanger and heat spreaders for cooling integrated circuit (IC) dies and packages and cooling systems employing the same are disclosed. In one embodiment, a stacked microchannel heat exchanger is operatively and thermally couple... | 10/03/2006 |
| 7111674 | Heat dissipating housing with interlocking chamfers and ESD resistance A system is designed to facilitate heat transfer via radiation, convection and conduction from components within the system to the external environment and housing. The system includes a thermally conductive plate positioned between a surface of the housing and one ... | 09/26/2006 |
| 7113404 | Liquid cooling system A liquid cooling system, comprises: heat-receiving jacket 7, thermally connected with a heat-generation element, a pump attached onto a radiator 1a, and a tank portion 2 on the radiator 1a, wherein a coolant liquid is circul... | 09/26/2006 |
| 7110258 | Heat dissipating microdevice A heat dissipating microdevice includes a board, a fluid microsystem, and a coolant. The board includes an insulator layer that has first and second surfaces, a conductor layer formed on the first surface, and a cover member disposed on the second surface. The fluid... | 09/19/2006 |
| 7110260 | Method and apparatus for cooling heat-generating structure An apparatus includes a heat receiving portion which receives heat within a footprint from a heat generating structure, and a cooling arrangement which causes flow of a coolant that absorbs heat at the heat receiving portion, the cooling arrangement being disposed i... | 09/19/2006 |
| 7108056 | Slit-type restrictor for controlling flow delivery to electrohydrodynamic thin film evaporator Cooling means for a heated surface comprising an enclosure for enclosing the heated surface and two oppositely charged interleaved radial arrays of microelectrodes positioned on the surface within the enclosure. The combined arrays have a closely spaced end and a pe... | 09/19/2006 |
| 7105836 | Method and apparatus for cooling a reticle during lithographic exposure Systems and methods eliminate vibrations produced by coolant fluid flowing through a short stroke stage and prevent change in thermally-induced distortion of the short stroke stage by maintaining the temperature and temperature distribution within the short stroke s... | 09/12/2006 |
| 7104313 | Apparatus for using fluid laden with nanoparticles for application in electronic cooling An apparatus for using fluid laden with nanoparticles for application in electronic cooling is described. In one embodiment, an electromagnetic pump is used to circulate the nanoparticle laden fluid. ... | 09/12/2006 |
| 7104312 | Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exch... | 09/12/2006 |
| 7106590 | Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems A cooling system is provided employing multiple coolant conditioning units (CCUs). Each CCU, which is coupled to a different, associated electronics rack of multiple electronics racks to be cooled, includes a heat exchanger, a first cooling loop with a control valve... | 09/12/2006 |
| 7102374 | Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a sp... | 09/05/2006 |
| 7100389 | Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test An apparatus and method for controlling the temperature of an electronic device under test utilizes a thermal head spaced apart from a movable support structure by a mechanical isolation assembly. The support structure has a manifold configured to route refrigerant ... | 09/05/2006 |
| 7100677 | Integrated liquid cooling system for electrical components A liquid cooling system includes a tank (10) for thermally contacting a heat source (100), a cylindrical heat dissipating unit (20) mounted on the tank, and a pump (30) located within the cylindrical heat dissipating unit. The tank define... | 09/05/2006 |
| 7100678 | Phase-change heat dissipating device and method for manufacturing it A phase-change heat dissipating device includes a hollow tube and a driving member connected to the tube. The tube has a vaporizing portion and a condensing portion and contains working fluid therein. The driving member includes a number of shrinkable chambers seria... | 09/05/2006 |
