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| Number | Title | Issue Date |
| 4296455 | Slotted heat sinks for high powered air cooled modules An air cooled high density integrated circuit system wherein heat sink structures are located on one of the surfaces of the modules in the system. The heat sink is composed of a plurality of hollow or flat heat conductive bodies having an opening or openi... | 10/20/1981 |
| 4292647 | Semiconductor package and electronic array having improved heat dissipation A semiconductor package and electronic array in which the semiconductor packages of the array share a common substrate. The substrate has a plurality of sets of contacts with each set of contacts receiving contacts of a semiconductor chip. Each chip and s... | 09/29/1981 |
| 4291364 | Air-cooled hybrid electronic package Metallized ceramic modules (MC), which are mounted on printed circuit cards, and multi-layer ceramic modules (MLC), which are mounted on a printed circuit planar board, are combined into one hybrid package. An air cooling distribution system is provided w... | 09/22/1981 |
| 4277816 | Electronic circuit module cooling An electronic assembly accomplishes module cooling and heat dissipation by directly impinging air flows each uniquely cooling a given module. The spent air is exhausted through channels defined between the modules in a manner such that the spent air has m... | 07/07/1981 |
| 4273185 | Device for holding a disc-shaped semiconductor element A holding device for disc-shaped semiconductor elements on a supporting wheel, particularly a rotating semiconductor device, is disclosed and includes two clamping members between which the semiconductor element is gripped by its end faces. At least one e... | 06/16/1981 |
| 4261005 | Miniature heat sink A one-piece stamped sheet-metal heat sink for dissipation of heat which accumulates about the plastic housing and metallic tab of a miniature semiconductor power device is formed as a shallow open-topped channel having short upstanding sides which flare l... | 04/07/1981 |
| 4246597 | Air cooled multi-chip module having a heat conductive piston spring loaded against the chips A multi-chip module is provided having one or more cylinders formed in the module cap, each centered over the middle chip of a group of chips. Cooling fins are attached to and extend from each of the cylinders. A heat conductive piston is located in each ... | 01/20/1981 |
| 4244098 | Method of assembling a dynamoelectric machine and an auxiliary cooling device A cooling shell arrangement is assembled about an outer periphery of a housing of a dynamoelectric machine. The cooling shell arrangement comprises at least two extruded sections of arcuate shaped cooling members having cooling fins and at least two locki... | 01/13/1981 |
| 4235285 | Self-fastened heat sinks Dissipation of heat from miniature solid-state devices and the like is achieved by a resilient heat-sink structure which opens to receive a tab or other heat-transfer body freely between two relatively-movable oppositely-disposed broad-area portions of th... | 11/25/1980 |
| 4222090 | Micromodular electronic package A micromodular electronic circuit package is disclosed herein constituting a discrete electronic component of sandwich construction having reduced physical density which, in one form, comprises an insulating panel supporting a pair of spaced-apart metal c... | 09/09/1980 |
| 4215361 | Winged self-fastened heat sinks for semiconductor devices Heat accumulating about the plastic housing and metallic tab of a miniature electronic semiconductor power device is dissipated by a surrounding one-piece sheet metal heat sink shaped as a closely-fitting channel portion closed at the bottom but open-slot... | 07/29/1980 |
| 4203488 | Self-fastened heat sinks Dissipation of heat from miniature solid-state devices and the like is achieved by a resilient heat-sink structure which opens to receive a substantially flat tab or other heat-transfer body freely between two relatively-movable oppositely-disposed broad-... | 05/20/1980 |
| 4193444 | Electrical mounting means for thermal conduction The present invention constitutes an electrical mounting and conduction means having a support element having a generally U-shaped interior surface, the base of the exterior of the support element being in thermal contact with a heat dissipating surface; ... | 03/18/1980 |
| 4193445 | Conduction cooled module An improved conduction cooled module of the type having at least one chip mounted on a substrate and having a housing surrounding the chips and sealed to the substrate. The housing having cylinders therein opposite the chips for containing pistons which a... | 03/18/1980 |
| 4190098 | Multiple component circuit board cooling device A device for cooling a multiplicity of solid state components which are attached to a printed circuit board comprises a formed profile member of high thermal conductivity material having a pair of longitudinally connected sides which form a geometrically ... | 02/26/1980 |
| 4184539 | Electronic card mount and heat transfer assembly for underwater vehicles A plurality of electronic circuit cards are edge mounted in heat transfer lation to a pair of spaced parallel card mounting plates extending from a bulkhead of an underwater instrumentation vehicle hull having a tubular cover section adapted to be moved i... | 01/22/1980 |
| 4144932 | Heat sink for rotating electronic circuitry A heat dissipating and mounting structure for an electrical circuit includes a disc which is mounted to a rotatable shaft. The disc extends outward from the shaft to present a front surface upon which the circuit is mounted and a rear surface upon which c... | 03/20/1979 |
| 4122508 | Modular printed circuit board assembly having cooling means incorporated therein A modular printed circuit board assembly has a plurality of printed circuit boards each of which is integrated with a separate heat sink to form a modular unit. Each such modular unit is removably supported in a housing on a separate pair of support track... | 10/24/1978 |
| 4095253 | Single in-line high power resin-packaged semiconductor device having an improved heat dissipator A single in-line, high power, resin-packaged semiconductor device having a plurality of external leads disposed in parallel to each other and projecting from one side surface of a resin-molded package, wherein a heat sink fin mounting plate is formed in u... | 06/13/1978 |
| 4093021 | Instrument and panel cooling apparatus In the disclosed aircraft instrument and panel cooling apparatus, each instrument is cooled uniformly and efficiently by air flowing through a plurality of small orifices which surround the large apertures in which the instruments are mounted. The orifice... | 06/06/1978 |
| 4073561 | Method for forming a heat sink and connector device and the product thereof A heat sink and connection device for use with electrical leads and wires. A piece of tubing, large compared with the electrical lead to which it is to be connected, is formed with a diametrical hole through both sides of the tube wall. The lead is passed... | 02/14/1978 |
| 4054901 | Index mounting unitary heat sink apparatus with apertured base Disclosed is a unitary heat sink apparatus in the form of a U-shaped body of thermally conductive material adapted for use in connection with semiconductor device packages having a thermally conductive transfer plate adjacent one major face of the device ... | 10/18/1977 |
| 4041524 | Heat dissipating device for transistor with outwardly extending heat conductive tab The device comprises a body portion formed of a pair of substantially parallelly situated planar members spaced to receive the tab therebetween such that the interior surface of each member is parallel to and in engagement with the exterior surface of the... | 08/09/1977 |
| 4027206 | Electronic cooling chassis Electronic apparatus employing components generating substantial amounts of heat to be dissipated, and particularly solid state components, is in the form of a subassembly that includes a heat sink comprised of a plate or block of metal having a high coef... | 05/31/1977 |
| 4012769 | Heat sink with parallel flat faces Disclosed is a unitary heat sink apparatus for dissipating thermal energy generated by semiconductor devices encapsulated in an encapsulation device of the JEDEC TO-202 or Motorola Case 152 device case style. The heat sink is a unitary sheet metal device ... | 03/15/1977 |
| 3993123 | Gas encapsulated cooling module A gas encapsulated cooling unit is provided for one or more heat generating components mounted on a substrate. A heat conductive cap is sealed to the substrate enclosing the heat generating components. The wall of the cap opposite the substrate contains e... | 11/23/1976 |
| 3992653 | Zero insertion force card guide An electronic module which provides for the insertion of printed circuit cards into the card receptacles of a heat exchanger with essentially zero insertion force. The printed circuit cards are of the type wherein individual electrical components are moun... | 11/16/1976 |
| 3961666 | Heat dispersion device for use in an electronic apparatus A heat dispersion device for use in an apparatus having at least one heat-generating electronic element, such as, a power transistor, includes a thermally conductive heat dispersion member having a portion on which the heat-generating electronic element i... | 06/08/1976 |
| 3955122 | Heat sink mounting for controlled rectifiers One layer of three heat sinks for conducting alternating current and a second layer of two heat sinks for conducting direct current sandwich twelve controlled rectifiers which are electrically arranged to provide a pair of gated rectifier bridge networks ... | 05/04/1976 |
| 3947868 | Air-cooled converter assembly, having heat sinks shaped as isosceles triangles An air cooled converter assembly employing disc thyristors in which the disc thyristors are clamped between conducting heat sinks, arranged in pairs side-by-side transversely to their common axis, with the disc thyristor thereby clamped essentially parall... | 03/30/1976 |
| 3940665 | Chassis device having vented base and radiation member for supporting heat sources A chassis device comprising a radiator member vertically mounted on a chassis base and having a U-shaped cross section, a printed circuit board extending parallel to the bridging portion of the radiator member and secured to the opposite edges thereof, th... | 02/24/1976 |
