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Microwave Oven With Removable Storage Cassette in Dashboard of Motor Vehicle
A microwave oven adapted for use within a motor vehicle dashboard area. The microwave oven has a removable storage cassette, and slidable platforms for securing and serving containers of beverages and foods.
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| Number | Title | Issue Date |
| 7362583 | Thermal management device for multiple heat producing devices A thermal management device for a circuit substrate having at least a first heat generating component and at least a second heat generating component, the thermal management device includes a first thermal spreader and a second thermal spreader. The second thermal s... | 04/22/2008 |
| 7360586 | Wrap around heat sink apparatus and method A mounting plate that is secured between a substrate and a component is used to mount a heat sink. The plate includes holes to accommodate the leads of the component and mounting flanges that partially surround the component and are used to mount the heat sink. In t... | 04/22/2008 |
| 7362584 | Heat relief socket A heat relief socket is provided where a contact carrier substrate is provided carrying a plurality of contacts, and is supported by a frame. The frame has an open area therethrough which can receive air flow to cool the bottom of a chip carried by the socket and th... | 04/22/2008 |
| 7359196 | Dual impeller push-pull axial fan heat sink A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 04/15/2008 |
| 7359197 | System for efficiently cooling a processor One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. ... | 04/15/2008 |
| 7359200 | Fastener with snap-on feature, heat dissipation assembly for central processing unit and method of using the same A fastener for mounting a heat dissipation module on a central processing unit, includes a shank having opposite upper and lower ends and a head at the upper end of the shank. The shank includes a first portion located between the upper and lower ends, and adapted t... | 04/15/2008 |
| 7359206 | Radio frequency isolation system and cover assembly for vacuum electron device A self-guiding cover assembly for a vacuum electron device (VED) enclosure (704, 1316) has a cover (1002, 1302), a pair of guide plates, and a pair of guide elements (1304, 1306). The cover has at least one electrical connector (1314) dis... | 04/15/2008 |
| 7357174 | Supporting seat for supporting weight of heat dissipating fins to avoid deformation of heat dissipating tubes extending through the heat dissipating fins A supporting seat includes a base adapted to be securely connected to the heat conductive plate, two arms extending obliquely from the base from two opposed sides of the base, two engagement plates each formed on a free end of a corresponding arm and adapted to enga... | 04/15/2008 |
| 7359195 | Heatsink Provided is a heatsink comprising: a plurality of sheet-shaped heat-dissipating plates stacked on one another, each heat dissipating plate including a heat-absorbing region that has a lower end contacting a heat source to absorb heat from the heat source and a heat-... | 04/15/2008 |
| 7357173 | Cooling device for a chip and method for its production The invention relates to a cooling device for a chip, in particular a processor, embodied with a number of projections or fins standing essentially normal on a base surface facing away from the chip and which may be fixed to the chip by the base surface on the side ... | 04/15/2008 |
| 7359192 | Cooling device for heat-generating electronic component A cooling device includes a heat sink (10), a fan (30), and a fan duct (50) covering the heat sink and fan therein. The heat sink includes a base (12) defining at least a through hole (18) at each of two opposite sides thereof. The... | 04/15/2008 |
| 7359199 | Portable electronic apparatus In a portable electronic device having two circuit boards having a heat generating electronic device, a frame arranged at a position pinched between the circuit boards, a first heat radiating plate brought into contact with the frame and having a higher thermal cond... | 04/15/2008 |
| 7355851 | Power adapter with fan assembly and control circuit A power converter with a fan assembly cools down a temperature of the power converter. The power converter with a fan assembly includes a housing, a plate, and a second plate. The housing includes a fan assembly (which is integral to the housing) to draw in air. The... | 04/08/2008 |
| 7355148 | Temperature exchanging element made by extrusion, and its applications The invention relates to a temperature exchanging element made by extrusion and able to receive a heating element and/or heat conducting element, and radiation fins. It is constituted of a single-piece base incorporating an external face equipped with means to recei... | 04/08/2008 |
| 7355857 | Heat sink gasket A receptacle assembly is provided having a gasket interposed between a heat sink and the receptacle, in order to provide EMI shielding and limit leakage from an opening in the receptacle that allows the heat sink to engage an electronic module inserted in the recept... | 04/08/2008 |
| 7355858 | Heat sink for surface-mounted semiconductor devices and mounting method A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and snap-action hooks. The snap-acti... | 04/08/2008 |
| 7355854 | Apparatus for improved grounding of flange mount field effect transistors to printed wiring boards An apparatus for improved grounding and heat transfer between flange mount field effect transistors and printed wiring boards is provided comprising a cut-out formed in the printed wiring board, extending between its top and bottom surfaces, defining an edge which i... | 04/08/2008 |
| 7355853 | Module structure and module comprising it A module is provided that has high reliability in the junction between a ceramic circuit board and a heat sink, undergoes small changes in shape and warp of a module structure comprising a ceramic circuit board and a metal heat sink event under a temperature history... | 04/08/2008 |
| 7352585 | Flip chip heat sink package and method An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first... | 04/01/2008 |
| 7352583 | Flexible lead for a pressfit diode bridge An improvement to a bridge rectifier assembly of the type used to convert alternating current produced by an motor vehicle alternator into direct current. The bridge rectifier assembly of this type comprises a heat sink, a plurality of pressfit diodes installed in t... | 04/01/2008 |
| 7352582 | Reinforcing structure, display device, and electronic apparatus To provide a display device with high reliability, which is capable of supporting a display panel well even when the display panel is enlarged, and capable of radiating the heat generated in the display panel well. A display device 100 of the present inventio... | 04/01/2008 |
| 7350561 | Heat sink with combined fins A heat sink (10) for removing heat from heat-generating devices includes a plurality of fins (12) interconnected together by a fastener (20) extending therethrough. Each fin comprises a main body (14) and a flange (16) bent from an... | 04/01/2008 |
| 7352586 | Auxiliary supporting structure of circuit board and assembling method for the same An auxiliary supporting structure of a circuit board is for supporting at least one part of the circuit board. The circuit board has a CPU socket for connected to a CPU, and a through hole through which a heat sink fixing element passes. The auxiliary supporting str... | 04/01/2008 |
| 7352577 | Liquid-cooled heat dissipation module A liquid-cooled heat dissipation module for circularly dissipating heat from a heat source. The liquid-cooled heat dissipation module includes a fan having a base; a pump disposed on the base; a heat sink coupled to the fan and having an opening to receive the pump;... | 04/01/2008 |
| 7352581 | Cooling device and electronic apparatus According to one embodiment, a cooling device includes: a heat transfer unit thermally connected to a mounted first heating element and a mounted second heating element whose mounted height is higher than that of the first heating element, the heat transfer unit inc... | 04/01/2008 |
| 7351032 | Heat dissipating fan with an airflow guiding structure A heat dissipating fan includes a cover plate having an air inlet and a base, an impeller mounted to the base and having a plurality of blades, and an air guiding member having an air passageway and an air outlet. A portion of an axial height of the respective blade... | 04/01/2008 |
| 7347354 | Metallic solder thermal interface material layer and application of the same A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert c... | 03/25/2008 |
| 7349218 | Locking device for a heat sink A locking device is for locking a heat sink to an electronic device. The locking device includes a retaining frame and a guiding member positioned on the retaining frame. The guiding member includes a seat having a base sitting on the retaining frame, a sleeve exten... | 03/25/2008 |
| 7349220 | Memory module assembly A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (50) thereon, a pair of heat-dissipating plates (20) attached on the printed circuit board, and a pair of clamps (30) clamping th... | 03/25/2008 |
| 7349210 | Grease cover for heat dissipating apparatus A grease cover (50) for protecting grease spread on a bottom surface of a heat sink (20) includes a base wall (51), a plurality of sidewalls (52a, 52b, 52c, 52d), a protecting space (53 | 03/25/2008 |
| 7347249 | Fixing device for a radiator A fixing device for a radiator provides a joining side projecting outward from a lateral side of each of the elastic strip members and has an engaging part at two inclining ends of the respective elastic strip member. The respective joining side is inserted into a l... | 03/25/2008 |
| 7349221 | Device for increased thermal conductivity between a printed wiring assembly and a chassis A floating guide device provides increased thermal conductivity between a printed wiring assembly and a heat sink chassis. The guide device includes an elongated thermally conductive rod and a wedgelock used in conjunction with the rod that can be attached to the ro... | 03/25/2008 |
| 7349217 | IC socket assembly The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The fixing member includes: a frame, mounted on a surface of the circuit b... | 03/25/2008 |
| 7349212 | Heat dissipation device A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at two sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink f... | 03/25/2008 |
| 7347251 | Heat sink for distributing a thermal load A heat sink for distributing a thermal load is disclosed that includes two or more base plates connected and oriented around a central axis of the heat sink, at least one base plate receiving the thermal load, each base plate having thermal transport paths, the ther... | 03/25/2008 |
| 7347252 | Centrifugal impeller An improved centrifugal impeller having between 20 and 26 rearwardly curved blades blades, a ratio of blade annulus width to wheel radius between 0.31 and 0.37, and an inlet blade angle in the range 32° to 36° and a discharge blade angle in the range 36° to 40°.... | 03/25/2008 |
| 7349219 | Memory module assembly including a clip for mounting a heat sink thereon A memory module assembly includes a printed circuit board (30) having a heat-generating electronic component (32) thereon, a heat sink (10) and a clip (20) for securing the heat sink onto the heat-generating electronic component. The heat... | 03/25/2008 |
| 7343963 | Hybrid heat sink performance enhancement using recirculating fluid A method and incorporated heat sink that is cooled both thorough air flow and liquid circulation is provided. The heat sink is disposed close to electronic components and used for their cooling. It comprises a finned structure positioned such that air can easily pas... | 03/18/2008 |
| 7343962 | Heat sink A heat sink for dissipating heat from an electronic component comprises a heat spreader and a plurality of first fins and second fins provided thereon. The first and second fins are parallel to each other and arranged in alternating order so as to define a plurality... | 03/18/2008 |
| 7345885 | Heat spreader with multiple stacked printed circuit boards A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein. ... | 03/18/2008 |
