Did You Know...
...that several people are credited with the invention of the flush toilet? Most people have heard of Thomas Crapper (1837-1910), the sanitary engineer who invented the valve-and-siphon arrangement that made the modern toilet possible. Another claimant to "the throne" was British inventor Alexander Cumming who patented a toilet in 1775. Then there's a nameless Minoan (a native of ancient Crete) who lived 4,000 years ago who supposedly was ahead of his time and created the first flush toilet!
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| Number | Title | Issue Date |
| 7290401 | Dynamic cooling of computing systems Systems and methods of operating a cooling system provide for determining one or more cooling requirements of a computing system and controlling one or more vent valves of the cooling system based on the cooling requirements. In one approach, the cooling requirement... | 11/06/2007 |
| 7292443 | Heat sink mounting assembly A heat sink mounting assembly includes a retention module having a bottom and a pair of posts extending from the bottom. A heat sink is located on the bottom of the retention module. A clip spans across the heat sink and includes a clamping member having first and s... | 11/06/2007 |
| 7290591 | Cooling mold with gas grooves A cooling mold (262) includes a cooling portion (2632), and defines a channel. The cooling portion has a number of intersecting grooves (2636). The channel communicates with at least one of the grooves. The channel and the grooves are configured... | 11/06/2007 |
| 7289324 | Heat dissipation device having power wires fixture A wire fixture (27) is for fastening power wires (246) of a heat-dissipating fan (24) to a supporting surface of a heat dissipation device (20). The heat dissipation device is for dissipating heat from a heat-generating electronic compone... | 10/30/2007 |
| 7289330 | Heat sink assembly having a fan mounting device A heat sink assembly (100) includes a heat sink (10) having a plurality of fins (14), a fan handle (24) buckled with the fins and a fan (30) mounted on the heat sink (10) via the fan handle. The fan handle includes a retaini... | 10/30/2007 |
| 7288840 | Structure for cooling a surface An apparatus for cooling a surface having a metal structure made of a material with high thermal conductivity, and designed to provide efficient cooling of the surface while minimizing mechanical stress between the metal structure and the surface. ... | 10/30/2007 |
| 7289329 | Integration of planar transformer and/or planar inductor with power switches in power converter A power converter integrates at least one planar transformer comprising a multi-layer transformer substrate and/or at least one planar inductor comprising a multi-layer inductor substrate with a number of power semiconductor switches physically and thermally coupled... | 10/30/2007 |
| 7289322 | Heat sink A heat sink includes a fin assembly (20) including a plurality of fin plates (22) and a fan (30) mounted on the fin assembly. Each fin plate includes a plurality of cutouts (226) defined on one edge thereof, and the cutouts of the fin pla... | 10/30/2007 |
| 7289331 | Interposable heat sink for adjacent memory modules A h9eat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first... | 10/30/2007 |
| 7287580 | Heat exchanger A heat exchanger having an active surface over which a fluid flows to affect an exchange of heat between the active surface and the fluid. In some embodiments, the active surface includes a logarithmic spiral wherein the radius of the logarithmic spiral measured at ... | 10/30/2007 |
| 7288839 | Apparatus and methods for cooling semiconductor integrated circuit package structures Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power densit... | 10/30/2007 |
| 7286361 | Heatsink Disclosed is a heatsink wherein a first bonding part for mounting the semiconductor component on a substrate and a second bonding part for mounting the heatsink on the substrate are soldered to the substrate by a common solder contact, so that the mounting the semic... | 10/23/2007 |
| 7284597 | Heat sink with combined parallel fins and the method for assembling the same A heat sink for removing heat from a heat-generating device includes a fin combination (10). The fin combination includes a plurality of fins interconnected together, each fin including a body (12), a flange (14) extending from the body and bent... | 10/23/2007 |
| 7284596 | Heatsink assembly and method of manufacturing the same A heat removal system includes a heatsink assembly having a base and a plurality of heat conducting folded fin members projecting from a first surface of the base and arranged to leave an open space on the first surface of the base. At least one thermally conductive... | 10/23/2007 |
| 7285445 | Direct cooling of LEDs A thermal management system is provided for semiconductor devices such as an LED array, wherein coolant directly cools the LED array. Preferably, the coolant may be selected, among other bases, based on its index of refraction relative to the index associated with t... | 10/23/2007 |
| 7286350 | Length-adjustable fan duct device A fluid guiding device (1) includes a ventilating pipe (10), a barrel (20) and a holding frame (30). The ventilating pipe includes two spring levers (154). A handling tab (156) and an engaging tab (158) extend from a ... | 10/23/2007 |
| 7285851 | Liquid immersion cooled multichip module In one embodiment, a liquid immersion cooled multichip module is provided which includes a substrate having chips mounted thereon and which is adapted to mount with a printed circuit board. A lid is adapted to secure to the printed circuit board so as to mount with ... | 10/23/2007 |
| 7286357 | Computer system with cooling device for CPU A computer system includes a casing, a motherboard, a CPU mounted on the motherboard and a cooling device. The casing includes a pair of parallel panels. Air inlets and air outlets are respectively defined in the parallel panels and oriented toward each other. The m... | 10/23/2007 |
| 7286358 | Surface mounted resistor with improved thermal resistance characteristics A surface mountable resistor chip assembly, containing an integral heat sink, convective cooling provision exhibits higher continuous-mode power ratings than prior art surface mount resistors having comparable printed circuit board footprints. The preferred embodime... | 10/23/2007 |
| 7286353 | Heat dissipating apparatus A heat dissipating apparatus includes a heat sink (20) having a base plate (22) for contacting an electronic component (10). A number of main fins (24) extend from the base plate. A cooling fan (30) is mounted on the heat sink. A c... | 10/23/2007 |
| 7286359 | Use of thermally conductive vias to extract heat from microelectronic chips and method of manufacturing A cooling device for a microcircuit provides a direct path of thermal extraction from a high heat producing area to a cooler area. A thermal insulation layer is formed on a body having at least one component thereon that generates the high heat producing area. At le... | 10/23/2007 |
| 7286360 | Heat radiating system and method for a mobile communication terminal A system and method for transferring heat from a terminal in a mobile communication system. The system comprises a circuit board mounted to a terminal body, in which a heat generating component is mounted, and a shield frame for shielding electromagnetic waves gener... | 10/23/2007 |
| 7286363 | Heat dissipation device A heat dissipation assembly includes a heat sink, a retention module and a clip for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating device. The retention module includes a bottom wall and a first si... | 10/23/2007 |
| 7286362 | Heat dissipating apparatus A heat dissipating apparatus includes a retention module (20) forming clipping portions (26) thereon, a heat sink (10) mounted to the retention module, and a clip (30) engaged with the retention module and the heat sink. The clip includes... | 10/23/2007 |
| 7286352 | Thermally expanding base of heatsink to receive fins Embodiments include apparatus, methods, and systems providing a heatsink for electronic heat generating components. In one embodiment, the heatsink includes a metal base having a plurality of grooves, and a plurality of graphite fins connected to the base. The fins ... | 10/23/2007 |
| 7283368 | Heat dissipating assembly A heat dissipating assembly includes a heat sink (10) having a chassis (12), a back plate (30) and a plurality of fasteners (40). Each fastener includes a screw cap (42), a spring (44) and a sleeve (46). The screw cap and th... | 10/16/2007 |
| 7281573 | Cooler A cooler includes a heat conducting member and a heat scattering member. The heat conducting portion is closely attached with a heat source. The heat scattering member has plural hollow cones respectively formed of sintered metallic particles with their size enlarge... | 10/16/2007 |
| 7283362 | Heat dissipation device having a locking device A heat dissipation device includes a retention module, a heat sink, a locking plate and a clip rotatably connecting with the retention module. The retention module includes an opening in a center thereof. The heat sink includes a heat conducting body and plurality o... | 10/16/2007 |
| 7283361 | Heat dissipation device A heat dissipation device includes a heat sink, a retention module and a clip having two clipping portions for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating electronic device. The base defines two... | 10/16/2007 |
| 7283364 | Thermal management apparatus The present disclosure relates to a thermal management apparatus used to manage temperature of components mounted to a circuit substrate, such as electronic or optical components. The apparatus includes a heat dissipation structure that includes at least one protrus... | 10/16/2007 |
| 7283365 | Jet impingement cooling apparatus and method A nozzle useful for enhancing localized cooling of electronic elements and the like is provided. The nozzle is mountable on a substantially planar face of a substrate. It is conformed to intercept a fluid flowing across said face and redirect it toward the substrate... | 10/16/2007 |
| 7281893 | Supporting frame with locating function A supporting frame with locating function mainly includes a supporting portion and a plurality of connecting portions. The supporting portion is provided at a central area with a plurality of hollow spaces, and is connected at an upper side to a fan and at a lower s... | 10/16/2007 |
| 7278471 | Multi-layered micro-channel heat sink The subject invention provides a heat sink for a liquid cooling system. The heat sink includes a spreader plate for contacting an electronic device and a body having a plurality of channels extending through the body and arranged in layers. Each layer includes a qua... | 10/09/2007 |
| 7280359 | Heat-radiating structure of electronic apparatus In a heat-radiating structure HRS1 in which heat generated in a heat-generating component built in a housing of an electronic apparatus is conducted to the outside, the central portion of a flexible graphite sheet that is folded and shaped so as to be elastic... | 10/09/2007 |
| 7279916 | Apparatus and test device for the application and measurement of prescribed, predicted and controlled contact pressure on wires The mechanical behavior of wires subjected to axial loading and experiencing bending deformation is used to ensure effective control of the contact pressure in mechanical and/or heat removing devices, and similar structures and systems. An apparatus for taking advan... | 10/09/2007 |
| 7278209 | Method for manufacturing heat sink for use in heat sink fan A method for manufacturing a heat sink for use in a heat sink fan is provided. A heat-sink base portion defining a central axis and a circumferential surface is formed. A plurality of heat-radiating fins is formed on the circumferential surface of the base portion. ... | 10/09/2007 |
| 7280361 | Clamping tool A clamping tool for securing a heat sink to a holding frame, which is disposed on top of a central processing unit (CPU), includes a support arm, a press handle, an elastic member, and an engaging arm. The support arm provides a horizontal arm member and an elastic ... | 10/09/2007 |
| 7280363 | Apparatus for controlling thermal interface between cold plate and integrated circuit chip The invention provides a heat sink device for receiving heat generated by an electrical chip. The heat sink device includes a cold plate having a bottom surface for receiving heat from the electrical chip and a top surface opposite of the bottom surface. The heat si... | 10/09/2007 |
| 7280365 | Multi-processor module with redundant power One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB having at least two processors. The second PCB is coupled to and disposed above the first PCB. A thermal dissipation device dissipates heat away from the proce... | 10/09/2007 |
| 7280360 | Socket adapted for compressive loading A ball grid array (BGA) socket is adapted to receive and electrically connect to an integrated circuit disposed between a circuit substrate and a heat sink. An attachment element is adapted to hold the Socket BGA to the circuit substrate with a compressive load isol... | 10/09/2007 |
