Quotables
"The idea that cavalry will be replaced by these iron coaches is absurd. It is little short of treasonous."
Aide-de-camp to Field Marshal Haig ; At a tank demonstration, 1916
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 6404638 | Small gaps cooling technology The present invention provides a thermal conduction module assembly kit comprising a base being substantially planar in shape and adapted to receive on a top surface a substrate adapted to receive at least one integrated circuit having top and bottom surf... | 06/11/2002 |
| 6401805 | Integrated venting EMI shield and heatsink component for electronic equipment enclosures An electromagnetic shielding and/or containing heatsink with venting capabilities, comprising a heatsink block, an aperture, and a thermal coupler, is disclosed. The heatsink comprises a thermally conductive material. The aperture is coupled to the heatsi... | 06/11/2002 |
| 6397944 | Heat dissipating apparatus and method for electronic components A method and apparatus dissipates heat generated by an electronic device. The apparatus includes a channel structure that is in thermal communication with heat generated by the electronic device. The apparatus further includes a pump array operative to ad... | 06/04/2002 |
| 6392887 | PLGA-BGA socket using elastomer connectors An electronic assembly that may include an elastomeric connector. The elastomeric connector may couple the solder ball of a BGA integrated circuit package to a substrate. The elastomeric connector provides an interconnect that may compensate for variation... | 05/21/2002 |
| 6378600 | Thermally conductive chuck with thermally separated sealing structures A chuck having two distinct portions mounts a substrate within a vacuum processing chamber. A first sealing stage confines a gas within a heat-transfer interface between one portion of the chuck and the substrate. A second sealing stage collects gas escap... | 04/30/2002 |
| 6377462 | Circuit board assembly with heat sinking A circuit assembly includes a printed circuit board which has a plurality of copper traces formed thereon. Heat generating electronic components are surface mounted on the board in contact with parts of the traces. A heat conducting copper plate is mounte... | 04/23/2002 |
| 6377459 | Chip cooling management A cooling assembly for cooling chips is disclosed. The assembly includes a heat sink, a plate member, and a heat pipe. The heat sink is attachable to a first chip. The plate member is attachable to a second chip. The heat pipe is arranged between the heat... | 04/23/2002 |
| 6377457 | Electronic assembly and cooling thereof An electronic assembly is provided. An electronic substrate of the assembly has a plurality of conductive lines to transmit signals, and a cooling opening therethrough. The cooling opening has an inlet to allow fluid into the electronic substrate, a secti... | 04/23/2002 |
| 6373705 | Electronic semiconductor module In order to improve heat dissipation and to reduce parasitic inductivity in an electronic semiconductor module, which has a carrier substrate having an electrically insulating layer, a metal layer in which printed conductors are formed via structuring and... | 04/16/2002 |
| 6373701 | Heat dissipation assembly A heat dissipation assembly (20) includes a heat sink (10) and a metal plate (30). The heat sink includes a chassis (14) and a plurality of fins (12). The chassis forms a pair of tabs (17) depending from each of two opposite sides of a bottom surface (15)... | 04/16/2002 |
| 6370024 | Heat sink clip A heat sink clip (30) includes a spring portion (31) and two arms (36) extending from respective opposite ends of the spring portion. The spring portion has a horizontal portion (35) which forms a tab (33) extending horizontally and then downwardly from a... | 04/09/2002 |
| 6362956 | Thermal management system An apparatus for removing heat from heat generating elements is disclosed. The apparatus is a thermal management system having a thermal distribution assembly in either one of or both of conductive and radiative communication with heat generating elements... | 03/26/2002 |
| 6362640 | Design of IC package test handler with temperature controller for minimized maintenance An IC package test handler is designed for minimized maintenance. The IC package test handler includes a test handler housing comprised of a thermal insulating material for carrying a chilled water jacket. A test handler base cartridge that is replaceable... | 03/26/2002 |
| 6353537 | Structure for mounting radiating plate A radiating-plate mounting structure for mounting a radiating plate on a semiconductor integrated circuit installed on a printed circuit board is arranged to have a pin disposed on the printed circuit board in the neighborhood of the semiconductor integra... | 03/05/2002 |
| 6349033 | Method and apparatus for heat dispersion from the bottom side of integrated circuit packages on printed circuit boards The present invention relates to a method and apparatus of heat dispersion from the bottom side of an integrated circuit package mounted on a printed circuit board ("PCB"). In operation, a heat slug is thermally coupled to the underside of an integrated c... | 02/19/2002 |
| 6347661 | Cooling/heating apparatus for semiconductor processing liquid In order to provide a cooling/heating apparatus for a semiconductor processing liquid being highly resistant to corrosive chemicals and free from elution of harmful impurities, a heat exchanging substrate 3 is formed by heat-depositing a fluorine-containe... | 02/19/2002 |
| 6347037 | Semiconductor device and method of forming the same A semiconductor device includes a board and a semiconductor chip which is connected to an upper surface of the board via face-down bonding. The semiconductor device further includes a frame-shape member which is connected to the upper surface of the board... | 02/12/2002 |
| 6344971 | Retainer for a retaining seat of a radiator A retainer for a retaining seat of a radiator serves to combine a CPU radiator to a PC circuit board. The retainer primarily includes two retaining seats and two pressing strips which are symmetrically installed at two sides of the retainer. One end of th... | 02/05/2002 |
| 6343012 | Heat dissipation device with threaded fan module A heat dissipation device for removing heat from an electronic device package includes a retaining clip having a central member and a first pair of legs depending downwardly therefrom. The retaining clip has a bore with female threading therein. Free ends... | 01/29/2002 |
| 6328096 | Workpiece chuck A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient ... | 12/11/2001 |
| 6317327 | Diode cooling arrangement A diode cooling arrangement includes a crystal having two end faces and two metal radiating fins respectively soldered to the end faces of the crystal, one radiating fin having two upright flanges at two opposite lateral sides adapted to hold the crystal ... | 11/13/2001 |
| 6313995 | Cooling system of a printed board A cooling system can cool electronic devices with assurance following the heights of the electronic devices mounted on a printed board. The cooling system is thin and light in weight and can easily inspect and maintain the electronic devices. A cooling pi... | 11/06/2001 |
| 6310773 | Heat sink system A heat dissipation system for an integrated circuit assembly uses a compressible support structure to support a cooling solution, or heat sink, that dissipates heat generated by an integrated circuit. The compressible support structure, in one embodiment,... | 10/30/2001 |
| 6304452 | Clip for securing heat sink to electronic device package A clip includes a pin (40) and a leaf spring (50). The pin includes a columnar body (44), an expanded head (42) formed at a top end of the body, and a cone-shaped plug (48) formed at a bottom end of the body opposite the head. A slot (488) is defined thro... | 10/16/2001 |
| 6288371 | Temperature controlled high power burn-in board heat sinks A heat sink is used for thermally controlling a chip on a burn-in board which is being tested in a burn-in oven. The heat sink includes a resiliently mounted block that will engage a chip under resilient pressure and which is housed in a separate cup that... | 09/11/2001 |
| 6288900 | Warpage compensating heat spreader A heat spreading cap is placed over a chip or integrated circuit. The cap is shaped or sized to provide a distinct heat spreading and/or stiffness characteristic that differs as it extends into different regions of the module. The areas of differing stiff... | 09/11/2001 |
| 6285549 | Power package lead frame A power package lead frame comprises a lead frame, a chip attached to the lead frame, and a mold encasing the chip and a portion of the lead frame. The lead frame comprises a paddle part, a radiation plate, and a leg part. The radiation plate comprises a ... | 09/04/2001 |
| 6285554 | Method and an arrangement for the electrical contact of components A method and an arrangement for connecting a component, such as a chip (6), on a substrate (7) to a conductive surface of a carrier. The conductive surface can be an earth plane (10) and the carrier can be a printed circuit board. The method and arrangeme... | 09/04/2001 |
| 6285552 | Rectifier of an alternating current generator for vehicle A heat sink of an alternating current generator for a vehicle has a heat sink body formed from aluminum die-cast. An insert member is provided on the heat sink body and a diode is provided on the insert member. The insert member (1) surrounds the side wal... | 09/04/2001 |
| 6282096 | Integration of heat conducting apparatus and chip carrier in IC package The present invention suggests a new scheme of integrating a heat conducting promotion apparatus (or heat sink) and a chip carrier (such as a substrate) of an IC package including a chip. It is characterized by at least a cavity which is in the chip carri... | 08/28/2001 |
| 6282095 | Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures A method and apparatus are disclosed for attenuating RF noise produced by electronic systems by providing low RF impedance shorting of heat dissipating structures, such as heat sinks, to PCB reference planes. The RF impedance shorting path uses existing p... | 08/28/2001 |
| 6282093 | LGA clamp mechanism A Land Grid Array (LGA) clamp mechanism is presented. The mechanism includes a spring having a number of beams that mate with cooperating posts from a backing plate. The backing plate fits on the bottom side of a printed circuit board, opposite the area w... | 08/28/2001 |
| 6275380 | Add-on heat sink and method A heat sink structure includes first and second add-on heat sinks mounted to a primary heat sink. The add-on heat sinks are thermally connected to the primary heat sink such that the effective heat transfer surface area for dissipating heat to the ambient... | 08/14/2001 |
| 6275381 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof The present invention relates generally to a new apparatus and method for introducing thermal paste into semiconductor packages. More particularly, the invention encompasses an apparatus and a method that uses at least one preform of thermal paste for the... | 08/14/2001 |
| 6260611 | Heat dissipation module A high watt number heat dissipation module having externally exposed fins is disclosed. The high heat produced by semiconductor operation is dissipated employing the present module, and the packaging rubber body is prevented from overflow. The present mod... | 07/17/2001 |
| 6261404 | Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device An apparatus for dissipating heat generated by an electronic device and a method for mounting the apparatus to an electronic device are disclosed. The apparatus includes a heat transfer body which is mounted in proximity to an electronic device. In additi... | 07/17/2001 |
| 6256202 | Integrated circuit intercoupling component with heat sink An intercoupling component (e.g., socket or adapter) is provided for increasing the dissipation of heat generated within an integrated circuit (IC) array positioned within the intercoupling component, while maintaining a relatively low profile. The interc... | 07/03/2001 |
| 6256203 | Free standing, three dimensional, multi-chip, carrier package with air flow baffle An efficient cooling mechanism for a multi-chip carrier can be provided while conserving board surface area. Flexible circuitized material is used to form multi-chip carriers with air baffle capability. The flex is folded or curved into the desired shape ... | 07/03/2001 |
| 6250374 | Apparatus and method for treating substrates An apparatus and method for cooling substrates is disclosed wherein the apparatus contains a cooling mechanism having a cooling plate, components for circulating a cooling fluid through the cooling plate, a positioning mechanism which positions the substr... | 06/26/2001 |
| 6249435 | Thermally efficient motor controller assembly An arrangement for connection between motor controller electronic components and silicon controlled rectifiers (SCR) contained within the controller circuit is presented with line and load straps being arranged on the bottom surface of the motor controlle... | 06/19/2001 |
