Bizarre Patents
Combination Beverage Container and Spittoon
A combination beverage container and spittoon includes a bottom portion including outer wall and a first inner wall defining a spittoon space.
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| Number | Title | Issue Date |
| 4709302 | Alignment apparatus for electronic device package Disclosed is apparatus for mounting electronic device packages and heat sinks on printed circuit boards with the pin connectors of the electronic device package held in alignment with preformed locations on the printed circuit boards. The alignment appara... | 11/24/1987 |
| 4707726 | Heat sink mounting arrangement for a semiconductor An arrangement for mounting a packaged semiconductor with a heat sink includes the heat sink having a channel formed therein with a pair of opposed side walls and utilizes one or more spring beams acting against one side wall of the channel to urge the se... | 11/17/1987 |
| 4697427 | Forced flow evaporator for unusual gravity conditions Low efficiency heat transfer in evaporators subject to unusual gravitational conditions is avoided through the use of a spiral evaporator conduit 12 receiving at an inlet 14 a vaporizable coolant at least partly in the liquid phase. Flow of the coolant th... | 10/06/1987 |
| 4693303 | Liquid cooling module with springy contact elements and an aperture plate slidable thereover A liquid cooling module comprises a substrate on which heat generating components to be cooled are mounted, a thermally conductive member secured to the substrate enclosing the heat generating components and a liquid cooling member having a chamber in whi... | 09/15/1987 |
| 4693541 | Electrical ornamentation system A connector is disclosed which permits an electrically illuminated ornament or the like to be readily connected to a string of conventional light sockets. A first connection is provided which preferably is in the form of a conventional socket for receivin... | 09/15/1987 |
| 4685987 | Method of preparing interfacings of heat sinks with electrical devices A relatively thin broad-area dielectric interfacing composed of dual filled layers of compliant silicone rubber in sandwiching relation to a porous glass-cloth carrier, one of the layers being pre-vulcanized and the other being subsequently cured and bond... | 08/11/1987 |
| 4683489 | Common housing for two semi-conductor bodies A common housing for two semi-conductor bodies is provided, comprising a front and back section for two spatially separate semi-conductor bodies attached in the housing interior but preferably connected in electrically conductive fashion to one another, w... | 07/28/1987 |
| 4675718 | Diode-containing connector A diode-containing connector which is improved in its overcurrent resistant characteristics with its increased heat capacity and its improved heat radiating property around a diode therein. The connector comprises terminals mounted in a juxtaposed relatio... | 06/23/1987 |
| 4675720 | Enclosed thyristor valve An enclosed thyristor valve of the type dividable into first and second portions comprises a tank, a thyristor valve assembly including a plurality of thyristor elements encased in the tank, a plurality of light guides extending through the tank for trans... | 06/23/1987 |
| 4645333 | Image forming apparatus An image forming apparatus comprises an image formation unit and a rack unit accommodating printed circuit boards. A fan unit for cooling the printed circuit boards is provided along one side of the bottom of the housing of the apparatus. A cross-flow fan... | 02/24/1987 |
| 4631635 | Vibration isolated cold plate assembly A vibration isolated cold plate assembly having a cold plate cover and a base interconnected together by means of a pair of elongated, rectangular-shaped elements made of elastomeric material. The elongated elements form therebetween a channel through whi... | 12/23/1986 |
| 4628991 | Wafer scale integrated circuit testing chuck A testing chuck for providing a thermally controlled mounting for wafer scale integrated circuits includes a body having a flat upper surface, upon which the integrated circuit is mounted, cooled or heated by a fluid flowing through a number of channels f... | 12/16/1986 |
| 4624302 | Apparatus for preheating printed circuit boards A heating device is disclosed wherein a printed circuit board is uniformly preheated before discrete electronic components are soldered onto the boards. The soldering process includes a reflow stage where the boards are subject to rapid temperature change... | 11/25/1986 |
| 4624303 | Heat sink mounting and method of making A heat sink mounting for a semi-conductor device includes a base member having a base body defining a generally cylindrical recess and a downwardly extending stem portion. The base body further defines an annular groove extending around the side surface o... | 11/25/1986 |
| 4610299 | Spring-biased heat sink A heat sink for a well logging instrument aids in dissipating heat from electronic components. The heat sink is of rigid, heat conductive metal. The heat sink has an outer surface that is arcuate for mating with the inner surface of the instrument housing... | 09/09/1986 |
| 4605058 | Heat dissipating retainer for electronic package A heat dissipating retainer for a flat, rectangular solid state package of electronic components is made from a single piece of pliable, springy electrically conductive sheet material bent to form a generally W-shaped structure. This structure has an inne... | 08/12/1986 |
| 4588028 | Heat sink and method of manufacture A heat sink is described that includes a base portion, and having a pair of heat radiating portions attached to the base portion. The heat radiating portions are each of sufficient width so that when bent along a line at roughly their midpoint, the unatta... | 05/13/1986 |
| 4583149 | Device for heat dissipation of printed circuit plates Printed circuit plates (12) are held at their edges in a housing (10) and carry on one side electrical components (16). For heat dissipation of the printed circuit plates (12) these plates carry a good heat conducting layer (20). The heat conducting layer... | 04/15/1986 |
| 4576224 | Diamond heatsink assemblies A diamond heatsink for semiconductor devices comprises a stud into which the diamond is pressed. The stud is held by friction in the end of a hollow split cylindrical holder. The holder is clamped in a base or wall member by a locknut which is screwed int... | 03/18/1986 |
| 4549602 | Rack assembly for plug-in modules A rack assembly for mounting one or more plug-in type electronic/electrical modules in an aircraft or the like. The assembly provides mechanical isolation to the modules by way of at least two resilient strips positioned on opposite sides of the shelf on ... | 10/29/1985 |
| 4537246 | Vertical heat sink A heat sink for generating heat dissipated by an electronic component mounted thereon includes a vertical heat conductive member, and a resilient clip having first and second legs which are resiliently biased towards each other such that when the clip is ... | 08/27/1985 |
| 4535834 | Method and apparatus for controlling thermal transfer in a cyclic vacuum processing system Apparatus for providing thermal transfer between a semiconductor wafer and a heat sink or source in a vacuum processing chamber includes a platen against which the wafer is sealed to define a thermal transfer region therebetween. The platen includes a pas... | 08/20/1985 |
| 4520425 | Control apparatus with improved structure for cooling circuit elements A control apparatus such as an inverter includes a hollow body having generally a rectangular cross-section, composed of sides of sheet metal with upper and lower open ends shielded by cast hollow frames, each having a similar cross-section. Electrical ci... | 05/28/1985 |
| 4508163 | Heat sinks for integrated circuit modules In dissipating heat from miniature electronic devices, circuit modules, or the like, and particularly from dual-in-line package (DIP) type units having leads depending from opposite sides of a thin molded rectangular-parallelpiped body, an elongated sheet... | 04/02/1985 |
| 4466049 | Modular circuit board guide A plurality of like modules having an open sided C-frame construction are provided with slot-forming guides for receiving a plurality of circuit boards which are inserted from the open side. The circuit boards, when fully received in the guide slot, are e... | 08/14/1984 |
| 4442450 | Cooling element for solder bonded semiconductor devices An improved electronic package having a support substrate, at least one electronic device mounted on the substrate, a cover mounted on the substrate disposed over said device and having a surface in spaced proximity to the device, the improvement being: a... | 04/10/1984 |
| 4400858 | Heat sink/retainer clip for a downhole electronics package of a measurements-while-drilling telemetry system A heat sink/retainer clip (54) capable of resiliently holding objects, such as printed circuit boards, in tubular members, such as telemetering tools. The heat sink/retainer clip comprises two portions (56, 60) which extend across the tube from opposite s... | 08/30/1983 |
| 4384610 | Simple thermal joint A thermally conductive mechanical joint is provided between two object surfaces across which it is desired to conduct heat. The joint includes metallic material of a predetermined melting point below the normal operating temperature of the joint. The meta... | 05/24/1983 |
| 4361749 | Uniformly cooled plasma etching electrode A planar electrode (17) having a plurality of concentric channels (34-34) therein through which coolant fluid passes to cool the electrode during a plasma etching process. The coolant is directed through at least two of the adjacent channels in opposite d... | 11/30/1982 |
| 4345267 | Active device substrate connector having a heat sink The present invention is to a heat sink device designed to conduct heat away from an active device substrate housed in a connector of the type having a hinged cover with spring elements thereon. More particularly the preferred embodiment includes a base m... | 08/17/1982 |
| 4279292 | Charge coupled device temperature gradient and moisture regulator A temperature and moisture regulator for such devices as integrated circuits and the like is disclosed as comprising an insulated mount for the device whose temperature and moisture is to be regulated, a first thermoelectric cooler in effective contact wi... | 07/21/1981 |
| 4259685 | Clamp for securing an encased power frame to a heat sink A semiconductor device, comprising a lead frame connected to an IC chip in a resinous block and a metallic strip projecting unilaterally from that block along a heat sink, is fastened to that heat sink by a screw traversing aligned holes in the projecting... | 03/31/1981 |
| 4253515 | Integrated circuit temperature gradient and moisture regulator An improved temperature gradient and moisture regulator for electrically ered apparatus and the like is disclosed as comprising an insulated mount for supporting the apparatus whose temperature gradient and moisture is to be controlled. A thermoelectric ... | 03/03/1981 |
| 4226281 | Thermal conduction module A matrix of small diameter holes are located in the module housing adjacent each of the integrated circuit chips to be cooled. A pin or rod is located in each of the holes and extends therefrom into contact with the exposed surface of the chip. A spring m... | 10/07/1980 |
| 4167771 | Thermal interface adapter for a conduction cooling module A thermal interface adapter is provided which is located in the interface between the housing and the heat sink of a conduction cooling module of the type which provides a conduction heat transfer path for removing heat from electronic components. The the... | 09/11/1979 |
| 4151547 | Arrangement for heat transfer between a heat source and a heat sink An arrangement for improving the transfer of heat from a heat source to a heat sink. The improvement is provided by the use of a malleable dimpled wafer which is deformed between the heat source and heat sink so as to improve the direct contacting of the ... | 04/24/1979 |
| 4104677 | Arrangement for adjustably urging a semi-conductive element against a heat sink A flat surface of a planar power semiconductive element, such as a thyristor or diode, is adjustably urged downwardly against a heat sink in electrical and thermal contact therewith by means of a spring-loaded eccentric element. The spring extends transve... | 08/01/1978 |
| 4069498 | Studded heat exchanger for integrated circuit package Heat is removed from the silicon devices in an integrated circuit package by means of a stud which is slidably mounted in a cap enclosing the integrated circuit device. A low melt solder is used to join the stud to the cap and the same solder is also depo... | 01/17/1978 |
| 4057825 | Semiconductor device with composite metal heat-radiating plate onto which semiconductor element is soldered A semiconductor device has a composite metal heat-radiating plate consisting of, for example, two copper layers for serving as a thermally and electrically conducting medium and an iron layer for giving mechanical strength, interposed between the copper l... | 11/08/1977 |
