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| Number | Title | Issue Date |
| 7228098 | Fusing assembly having a temperature equalizing device A fusing assembly includes (a) a first member having a first edge, a second edge and an end-to-end axis; (b) a second member having a fusing surface forming a fusing nip with the first member, and the fusing nip being located between the first edge and the second ed... | 06/05/2007 |
| 7226352 | Cover structure with vent A cover structure with a vent is provided which includes a cooling fan, and a cover having a vent portion provided with a plurality of air-through holes through which air forced by the cooling fan escapes. The vent portion is formed spaced away from the cooling fan ... | 06/05/2007 |
| 7224587 | Heat sink and chip sandwich system A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial or... | 05/29/2007 |
| 7224583 | Shielding box without any dedicated cooling duct A shielding box includes a first wiring board and a second wiring board maintaining a distance relative to the first wiring board and facing thereto. A ventilating hole is formed in the second wiring board and having side surfaces facing each other. A pair of flat c... | 05/29/2007 |
| 7222423 | Method of manufacturing a finned heat sink A method of manufacturing a finned heat sink included obtaining a fin core, wherein the fin core is constructed of a conductive structural graphite-epoxy material. A fin cover is secured to the fin core using one of heat and pressure to define a heat sink fin, where... | 05/29/2007 |
| 7219721 | Heat sink having high efficiency cooling capacity and semiconductor device comprising it A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of th... | 05/22/2007 |
| 7220365 | Devices using a medium having a high heat transfer rate Disclosed is a heat transfer medium having high heat transfer rate, being useful in even wider fields, simple in structure, easy to made, environmentally sound, and capable of rapidly conducting heat and preserving heat in a highly efficient manner. Further disclose... | 05/22/2007 |
| 7222058 | Method of modeling and sizing a heat exchanger A method of modeling a heat exchanger is disclosed and comprises assigning input temperatures, assumed output temperatures, and a set of flow rates, inputting the parameters into a set of equations arranged to calculate a heat transfer coefficient, inputting paramet... | 05/22/2007 |
| 7219713 | Heterogeneous thermal interface for cooling The present invention is a thermal interface for coupling a heat source to a heat sink. One embodiment of the invention comprises a mesh and a liquid, e.g., a thermally conductive liquid, disposed in the mesh. The mesh and the thermally conductive liquid are adapted... | 05/22/2007 |
| 7219719 | Fin for a plate heat exchanger, methods for the manufacture of such a fin, and a heat exchanger comprising such a fin A fin produced from thick sheet-metal and having a pattern reproduced in a general direction in accordance with a geometric pitch such that the ratio of the minimum thickness of the sheet-metal to the geometric pitch is greater than 0.2. The fin is obtained either b... | 05/22/2007 |
| 7221570 | Heat dissipating device for an integrated circuit chip An electronic assembly comprises a support board, an integrated circuit chip interconnected and coupled to the support board, and a thermal-gap-filler pad placed over the integrated circuit chip and in contact with an external device to dissipate heat generated by t... | 05/22/2007 |
| 7220782 | Methods to reduce the sensitivity of endothelially-compromised vascular smooth muscle The present invention discloses materials and methods useful to treat sensitivity of endothelially-compromised vascular smooth muscle. In one embodiment, CLC3 blockers, particularly compounds of the Formula I are used to treat sensitivity. ... | 05/22/2007 |
| 7218000 | Liquid solder thermal interface material contained within a cold-formed barrier and methods of making same In a process of making a container barrier upon a heat spreader, the heat spreader is augmented with a cold-formed o-ring, and thereafter, it is bonded to a die. A liquid solder is filled into the space created by the o-ring. The thermal interface material can also ... | 05/15/2007 |
| 7218524 | Locking device for heat dissipating device A locking device for mounting a heat dissipating device to a CPU mounted on a printed circuit board, includes a back plate mounted below the circuit board and a retainer. The back plate includes a plurality of posts extending upwardly through the circuit board and e... | 05/15/2007 |
| 7218520 | Retainer for heat sink A retainer includes a retention module surrounding a heat sink and two clip members for cooperating with the retention module to retain the heat sink. Each clip member includes a strap resting on the heat sink and a pair of legs located at opposite ends of the strap... | 05/15/2007 |
| 7215548 | Heat dissipating device having a fin also functioning as a fan duct A heat dissipating device for cooling a number of electronic devices, includes a heat sink assembly (10) and a fan (20) mounted to a side of the heat sink assembly. The heat sink assembly includes a heat spreader (12), a plurality of fins (14... | 05/08/2007 |
| 7215550 | Heat sink fastener A heat sink fastener includes a main body, a piercing body and an operating member. The main body includes a pressing part adapted for pressing a heat sink toward a heat-generating component, an engaging part and a latching leg, the engaging part and the latching le... | 05/08/2007 |
| 7215545 | Liquid cooled diamond bearing heat sink A liquid cooled heat sink for cooling integrated and power modules. The heat sink is formed of a Diamond, Silicon Carbide composite and is provided with heat transfer facilitating fins and an enclosure for routing the cooling liquid into heat transfer contact with t... | 05/08/2007 |
| 7215544 | Apparatus for enhancing heat transfer efficiency of endothermic/exothermic article An apparatus for enhancing heat transfer efficiency of an endothermic/exothermic article includes a heat sink disposed on the endothermic/exothermic article to enhance heat transmission, a plurality of fins formed on the heat sink to enhance heat exchange, and a por... | 05/08/2007 |
| 7213636 | Cooling assembly with impingement cooled heat sink The subject invention provides a cooling assembly for removing heat from an electronic device. The cooling assembly includes a heat sink having a base plate and a plurality of fins extending upwardly from the base plate to a top extremity. A nozzle directs a flow of... | 05/08/2007 |
| 7210227 | Decreasing thermal contact resistance at a material interface A heat sink assembly in which the interface material is chemically bonded to both the heat source material and the heat sink material. The chemical bonding can lower the contact resistance that would otherwise exist using conventional adhesives to attach the heat si... | 05/01/2007 |
| 7209348 | Heat dissipating structure for an electronic device and heat dissipating device A heat dissipating member has an inner wall, outer wall, and partition walls. The inner wall directly or indirectly receives heat transfer from the heat source. The outer wall opposes the inner wall at a distance. The partition walls connect the inner wall and the o... | 04/24/2007 |
| 7204303 | Flat tube cold plate assembly A flat tube cold plate assembly has a channel plate having an opening therethrough defining a flow path. A plurality of flat tubes is retained within the opening in the channel plate along the flow path. A plurality of fins extends within the interior of the flat tu... | 04/17/2007 |
| 7200934 | Electronic assemblies with high capacity heat sinks and methods of manufacture An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan a... | 04/10/2007 |
| 7201012 | Remedies to prevent cracking in a liquid system A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are desig... | 04/10/2007 |
| 7201214 | Remedies to prevent cracking in a liquid system A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are desig... | 04/10/2007 |
| 7203064 | Heat exchanger with cooling channels having varying geometry A device may include an integrated circuit chip and channels to carry a coolant. The channels may be proximate to an upper surface of the integrated circuit chip, and the channels may extend along a length of the integrated circuit chip. A density of the channels ma... | 04/10/2007 |
| 7203066 | Heat sink assembly incorporating spring clip A heat sink assembly includes a heat sink (20) and a pair of clips (10) attached on opposite sides of the heat sink for securing the heat sink to an electronic component (40). The heat sink includes a base (22) and a plurality of fins ( | 04/10/2007 |
| 7197804 | Method of making copper and carbon nanotube thermal conductor A thermal conductor is made of copper and carbon nanotubes powders that are compressed together and then cold rolled into sheets for aligning the carbon nanotubes for providing a composite matrix having a low coefficient of thermal expansion, high thermal conductivi... | 04/03/2007 |
| 7198094 | Finned device for removing heat from an electronic component A device for removing heat from an electronic component, comprising a heat sink that can be coupled to the electronic component and conduct heat therefrom. A finned appurtenance coupled to the heat sink can transfer the heat into a fluid medium. The fins are oriente... | 04/03/2007 |
| 7196904 | IC package with an implanted heat-dissipation fin An IC package with an implanted heat-dissipation fin is introduced. The IC package provides a plastic package to seal an IC chip. One end of the heat-dissipation fin is implanted inside the plastic package, and another end is left outsides for directly heat-exchangi... | 03/27/2007 |
| 7196905 | Heat radiating apparatus of electronic component A heat radiating apparatus includes a radiator adhering to an electronic component mounted on a circuit board via an elastic member provided on the circuit board so that the electronic component is cooled. The radiator includes a plurality of projection parts, the e... | 03/27/2007 |
| 7196411 | Heat dissipation for chip-on-chip IC packages Disclosed herein are IC package devices and related methods of manufacturing. In one embodiment, an package device includes first and second package substrates, and a first IC chip having at least one coupling structure formed on its active region for electrically c... | 03/27/2007 |
| 7191822 | Aluminum extruded fin set with noise reduction functionality An aluminum extruded fin set includes a substrate and a plurality of dissipation fins mounted upright on it. There are gaps between heat dissipation fins. Each dissipation fin is divided into three child dissipation fins by two slanted cutouts. The child dissipation... | 03/20/2007 |
| 7188667 | Liquid cooling structure for electronic device A structure for cooling an electronic device. The structure includes a first layer disposed over the electronic device for providing a heat path from the electronic device and a bottom layer including a fin structure and a lower surface opposite the fin structure, w... | 03/13/2007 |
| 7188661 | Process for joining members of a heat transfer assembly and assembly formed thereby A method and assembly that makes use of an adhesive to form a joint structure between two members, such as two heat transfer components. A first member has a slot in a surface thereof, while the second member has an edge received in the slot of the first member. One... | 03/13/2007 |
| 7188662 | Apparatus and method of efficient fluid delivery for cooling a heat producing device A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the ... | 03/13/2007 |
| 7190587 | Fanless high-efficiency cooling device using ion wind Disclosed herein is a fanless high-efficiency cooling device that is applicable to electronic products having heat sources, such as plasma display panel (PDP) televisions, liquid crystal display (LCD) televisions, and liquid crystal display (LCD) monitors. The fanle... | 03/13/2007 |
| 7188418 | Method of making split fin heat sink A heat sink for dissipating heat from an electronic component includes a core and a plurality of fins extending outwardly from the core. The fins may be at least partially curved. Each fin may split into a plurality of tines that extend away from the core. ... | 03/13/2007 |
| 7190586 | Heat sink retention assembly and related methods Heat sink retention assemblies and related methods are described. In one embodiment, a system comprises a base, a handle rotatably mounted on the base, and heat sink retention structure joined with the handle and moveable by the handle between an opened and a closed... | 03/13/2007 |
