Did You Know...
...that Thomas Edison's patent application on his phonograph was approved by the Patent Office in just seven weeks? In contrast, it took Gordon Gould, the inventor of the laser, 30 years to obtain his patent -- finally awarded in 1988!
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| Number | Title | Issue Date |
| 7156161 | Lightweight thermal heat transfer apparatus A lightweight thermal heat transfer apparatus, including a core section and a laminate composite section. The core section is substantially similar to a diamond shape. The laminate composite section has a plurality of thermally conductive fibers, which are disposed ... | 01/02/2007 |
| 7156159 | Multi-level microchannel heat exchangers An apparatus and method of circulating a heat-absorbing material within a heat exchanger. The apparatus comprises a manifold layer coupled to an interface layer. The manifold layer comprises an inlet manifold and an outlet manifold. The interface layer comprises a p... | 01/02/2007 |
| 7158380 | Heatsink for digital video recorder A heat sink assembly for cooling a DVR enabled set-top box. A heat sink is coupled to a chassis of the set-top box as well as to a storage device within the chassis. Heat is transferred from the storage device to the exterior of the chassis to be vented to the exter... | 01/02/2007 |
| 7155091 | Cooled high power laser lens array An array of cylindrical end-caps with separate or integral lenses is stacked with its members in close contact, forming inter-cylinder gaps between every subset of three adjacent cylindrical lenses. Conductive fibers are disposed in the inter-cylinder gaps. Heat tha... | 12/26/2006 |
| 7152666 | Heat sink A heat sink includes a body (10) having two pairs of sections intercrossed at a central portion thereof to form a cross profile when viewed from a top of the body. Each section includes a top surface (12), a bottom surface (14), a vertical surfa... | 12/26/2006 |
| 7150914 | Heat spreader for emissive display device A heat spreader for an emissive display device, such as a plasma display panel or a light emitting diode, comprising at least one sheet of compressed particles of exfoliated graphite having a surface area greater than the surface area of that part of a discharge cel... | 12/19/2006 |
| 7151669 | Configurable heat sink with matrix clipping system A heat sink apparatus for use with electronic components comprises a base frame, a clipping system and a plurality of supporting members. The base frame and the clipping system and the supporting members are of unitary construction. The base frame is configured to h... | 12/19/2006 |
| 7150313 | Heat dissipation device A heat dissipation device is described. The heat dissipation device is suitable for electrical equipment, and particularly for a notebook computer. The heat dissipation device has a cooling fan and a plurality of heat dissipation fins. The heat dissipation fins are ... | 12/19/2006 |
| 7147051 | Cooling element The basis taken is a cooling element (1) made of a metal or of a metal alloy having at least one cooling rib (4) which is connected to a metal housing (11) for an operating means. The intention is to provide a cooling element (1) which ha... | 12/12/2006 |
| 7147041 | Lightweight heat sink A heat sink disposable on a heat transfer surface of a heat-generating source such as an electronic component. The heat sink includes a base portion and a body portion. The base portion has a first surface disposable on the heat transfer surface, and a second surfac... | 12/12/2006 |
| 7147071 | Thermal management systems and methods A thermal management system for a vehicle includes a heat exchanger having a thermal energy storage material provided therein, a first coolant loop thermally coupled to an electrochemical storage device located within the first coolant loop and to the heat exchanger... | 12/12/2006 |
| 7147367 | Thermal interface material with low melting alloy A thermal interface composition undergoes a viscoelastic change at microprocessor operating temperatures to transfer heat generated by a heat source, such as a microprocessor to a heat sink. The composition includes a low melting alloy dispersed in a matrix. The mat... | 12/12/2006 |
| 7144624 | Dendritic fiber material A thermal interface includes nanofibrils. The nanofibrils may be attached to a flat base or membrane, or may be attached to the tip portions of larger diameter fibers. The nanofibrils have a diameter of less than about 1 micron, and may advantageously be formed from... | 12/05/2006 |
| 7144762 | Semiconductor device with pins and method of assembling the semiconductor device A semiconductor device includes a substrate having a semiconductor element mounted thereon, and a heat sink. A plurality of pins are inserted in holes in the heat sink and holes in the substrate to secure the heat sink to the substrate. The pin has an enlarged porti... | 12/05/2006 |
| 7143564 | Reinforced fiber panel and method of forming same The present invention is directed to a reinforced panel that includes a face sheet having an interior side and an exterior side, a plurality of integral and intersecting ribs having distal ends and projecting from the interior side of the face sheet to form contiguo... | 12/05/2006 |
| 7141310 | Metal matrix composite structure and method Compound preforms are provided having a first region, including a porous ceramic and a second region including a porous or solid ceramic in which the two regions differ in composition. The compound preform is infiltrated with a liquid metal which is then solidified ... | 11/28/2006 |
| 7142422 | Heat dissipation device A heat dissipation device includes a mounting plate (21) for mounting the heat dissipation device to a circuit board (3) on which a CPU (4) and a plurality of capacitors (31) are mounted, a heat sink (20), a core (25), and a... | 11/28/2006 |
| 7142428 | Locking heatsink apparatus A heatsink is provided for cooling power components on a printed circuit board. The heatsink includes a slot so that it is placed over the power device to be cooled. An activating member may be inserted from the opposite side of the printed circuit board and fastene... | 11/28/2006 |
| 7142427 | Bottom side heat sink attachment for console A system of mounting a heat sink to a processor in a console is provided. The processor is mounted on a first side of a PCB and the heat sink is mounted to the first side of the PCB so as to be in contact with the processor. A plurality of studs are mounted to the h... | 11/28/2006 |
| 7142423 | Power adapter with fan assembly A power converter with a fan assembly cools down a temperature of the power converter. The power converter with a fan assembly includes a housing, a plate, and a second plate. The housing includes a fan assembly (which is integral to the housing) to draw in air. The... | 11/28/2006 |
| 7139174 | Techniques for attaching a heat sink assembly to a circuit board component A circuit board module has a circuit board, a component mounted to the circuit board, and a heat sink assembly. The heat sink assembly includes a base member having a first edge and a second edge. The base member is configured to operate as a thermal conduit between... | 11/21/2006 |
| 7137444 | Heat-transfer interface device between a source of heat and a heat-receiving object What is proposed is a heat-transfer interface device for use in a range of up 320° C. working temperatures for transfer of heat from a source of heat to a heat-receiving object under severe conditions. The device comprises an elastomeric material filled with an ele... | 11/21/2006 |
| 7136287 | Clip for mounting heat sink to circuit board A clip (10) includes a body (12) including spaced first and second end portions, a first locking part (20) extending from the first end portion for attaching to a heat sink (80), and a second locking part (30) extending from the se... | 11/14/2006 |
| 7131487 | Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers An apparatus for cooling heat producing devices is disclosed. In one embodiment, the apparatus includes a heat absorber attached to a first end of a base. Both the base and the heat absorber may be formed of a thermally conductive material, and a width of the heat a... | 11/07/2006 |
| 7131485 | Fan holder A fan holder, for attaching a fan to a heat sink, includes a base, fasteners, and clamping arms. The fasteners extend from the base. Each of the fasteners defines an arc-shaped locking portion engaging with the fan. The clamping arms extend from the base opposite to... | 11/07/2006 |
| 7131288 | Heat exchanger In a heat exchanger (10) for transferring heat from a first fluid to a second fluid, which heat exchanger (10) comprises one or more flow passages (12) for a first fluid, the outer wall (26) of these passages is in heat-transferring conta... | 11/07/2006 |
| 7132161 | Fiber adhesive material A fiber velvet comprising nano-size fibers or nanofibrils attached to micro-size fibers is disclosed. Methods of manufacturing the velvet as well as various uses of the velvet are also described. For example, the fiber velvet can be used as a thermal interface or as... | 11/07/2006 |
| 7131199 | Mechanical highly compliant thermal interface pad A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the pad. Each plate assembly includes one or more spring members configur... | 11/07/2006 |
| 7133285 | Electronics connector with heat sink A heat sink includes a body and a heat transmitting member coupled thereto. The body and member are arranged such they each contact a different section of an electronic component, e.g., a PCMCIA card. The heat sink can be integrated into an electronic component conn... | 11/07/2006 |
| 7128140 | Heat sinks A heat sink (100) includes a cooling block (105) having a plurality of fins (110) extending through the block to provide a series of coolant channels (112) extending between the fins, the channels having in the interior of the block a ven... | 10/31/2006 |
| 7128132 | Staggered fin array A staggered fin array has a plurality of dissipation fins disposed upright on a substrate. Each dissipation fin has at least one staggered structure at one side or on opposite sides thereof. The staggered structure has two stair structures. Each stair structure has ... | 10/31/2006 |
| 7128604 | High power coaxial interconnect A blindmate interconnect coaxial connector includes a center conductor, a thermally-conductive dielectric surrounding the center conductor, and an outer tubular conductor surrounding the dielectric. The dielectric transfers heat from the center conductor to the oute... | 10/31/2006 |
| 7130189 | Method and apparatus for cooling a portable computer A portable computer includes a housing containing a circuit component, and a temperature adjusting arrangement which has a thermally conductive section with a side facing approximately along an axis and thermally coupled to the component. A fluid supply section dire... | 10/31/2006 |
| 7128131 | Heat sink for electronic devices and heat dissipating method A heat sink according to the present invention is configured to comprise: a plurality of heat dissipating fins having at least bottom portions which form a heat receiving surface thermally connected to a heat generating electronic ... | 10/31/2006 |
| 7129510 | Optical sensors An optical sensor comprises at least one bundle comprising a plurality of optical fibers and a plurality of separate fluid-tight longitudinally extending ducts; and fluid connectors for introducing fluids selectively into at least some of said ducts. Test cells are ... | 10/31/2006 |
| 7124806 | Heat sink for enhanced heat dissipation A heat sink assembly includes a block formed of a thermally conductive material. For example, the thermally conductive material includes thermally conductive polymer. A heat conduit (e.g., a heat pipe) extends through a substantial portion of the block. In one examp... | 10/24/2006 |
| 7124807 | Heat dissipation device having thermally conductive cover board A heat dissipation device includes a casing forming a receptacle for receiving and retaining a fan module and a finned structure that includes spaced fins to define channels through air flows for primary exchange of heat with the heat dissipation device. The heat di... | 10/24/2006 |
| 7126824 | Heat dissipation device assembly incorporating retention member A heat dissipation device assembly includes a heat sink (20) placed on an electronic component (52) which is mounted on a printed circuit board (PCB) (50) and including a pair of shoulders (23) on opposite sides thereof, a pressing part (... | 10/24/2006 |
| 7126825 | Combined chip/heat-dissipating metal plate and method for manufacturing the same A combined chip/heat-dissipating metal plate includes a chip and a heat-dissipating metal plate bonded to a side of the chip, wherein the heat-dissipating metal plate is in a stretched state. The heat-dissipating metal plate is stretched before bonding the chip. Pre... | 10/24/2006 |
| 7126819 | Chassis air guide thermal cooling solution A chassis air guide thermal cooling solution including a fan to which protruding edges are wedged at wedge grooves of a locating assembly to locate the fan therein, locating notches of a flexible ring are positioned in the locating assembly, an accommodating ring is... | 10/24/2006 |
