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A self defense weapon formed as a memo pad and which is easily held by a person's fingers, therefore making it possible to provide protection from a mugger and also to quickly and easily write a record or a message without failure of missing or forgetting significant information under a stressful situation.
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| Number | Title | Issue Date |
| 8087456 | Method for manufacturing heat sink having heat-dissipating fins and structure of the same A method for manufacturing a heat sink having heat-dissipating fins and a structure of the same are provided. The method includes the steps of: providing a substrate comprising a center portion and a plurality of extending arms, a gap being provided between each two... | 01/03/2012 |
| 8079411 | Heat absorbing device usable to cool hot beverages A heat absorbing device usable to cool hot beverages includes a support rim for supporting the device on a brim of a container and a heat absorbing element extending away from the support rim in a first direction. The heat absorbing element includes a thermally cond... | 12/20/2011 |
| 7984754 | Cooling element for heat dissipation in electronic components A cooling element for electronic or electromechanical components includes a metal element defining a receiving space and a receiving groove associated with the receiving space. The receiving space has an inner wall and is configured to receive an electronic or elect... | 07/26/2011 |
| 7980297 | Heat sink having protective device for thermal interface material spread thereon A protective device (10) for protecting thermal interface material (30) spread on a central surface (512) of a bottom of a base (51) of a heat sink (50). The device includes a case (12) and a tab (18) extending from a... | 07/19/2011 |
| 7967062 | Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal inte... | 06/28/2011 |
| 7886813 | Thermal interface material with carbon nanotubes and particles A thermal interface material is provided using composite particles. Advantages include increased thermal conductivity and improved mechanical properties such as lower viscosity. In selected embodiments free particles such as metallic particles or carbon nanotubes, e... | 02/15/2011 |
| 7784531 | Nanoengineered thermal materials based on carbon nanotube array composites A method for providing for thermal conduction using an array of carbon nanotubes (CNTs). An array of vertically oriented CNTs is grown on a substrate having high thermal conductivity, and interstitial regions between adjacent CNTs in the array are partly or wholly f... | 08/31/2010 |
| 7748439 | Heat extractor for magnetic reader-writer A heat extractor to transfer heat generated by the coil of a magnetic read head to a substrate, when there is at least one thermally insulating layer between the coil and the substrate, is disclosed, together with a method for its manufacture. ... | 07/06/2010 |
| 7748440 | Patterned structure for a thermal interface The present invention provides a thermal interface with a first and a second face that are in contact to each other by a thermal conducting material. A first face includes grooves that are at least partly filled with the thermal conducting material, wherein at least... | 07/06/2010 |
| 7654311 | Thermal management of systems having localized regions of elevated heat flux A thermal management system (300) includes a first heat transfer body (330) for providing a opposing heat flux to at least one localized region of elevated heat flux residing in adjacency to a region of lesser flux, such as on a surface (315a... | 02/02/2010 |
| 7588074 | In the rate of energy transfer across boundaries A heat exchanger comprises at least one first fluid passage contiguous with at least one second fluid passage. The first fluid passage is separated from the second fluid passage by a common boundary, the boundary having a first surface and a second surface. The firs... | 09/15/2009 |
| 7527090 | Heat dissipating device with preselected designed interface for thermal interface materials Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for ad... | 05/05/2009 |
| 7513298 | Cooling element for eliminating electromagnetic noise The present invention is to provide a cooling element for eliminating electromagnetic noise, which is formed by bending a plate into a symmetric structure symmetrically comprising a contact part being in connect with an electronic component to absorb heat and noise ... | 04/07/2009 |
| 7493943 | Heat collector A heat collector (10, 20) includes a heat absorption surface (12, 22), an opposite heat focus surface (11, 21) and one or more surrounding sides (13, 23). A matrix (24) of the heat collector is a thermally conductive material. Ther... | 02/24/2009 |
| 7487825 | Heat dissipation device A heat dissipation device includes a heat sink (10) and a first heat pipe (20) enclosing a bottom edge of the heat sink. The heat sink includes a base (12) defining a first passage (120) extending therethrough. The first heat pipe include... | 02/10/2009 |
| 7484556 | Heat dissipating member A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member... | 02/03/2009 |
| 7481267 | Anisotropic thermal and electrical applications of composites of ceramics and carbon nanotubes Ceramic materials are converted to materials with anisotropic thermal properties, electrical properties, or both, by forming the ceramics into composites with carbon nanotubes dispersed therein and uniaxially compressing the composites in a direction in which a lowe... | 01/27/2009 |
| 7461690 | Optimally shaped spreader plate for electronics cooling assembly A spreader plate for an electronic component cooling assembly has a flat lower surface and a substantially arcuate upper surface of larger surface area than the lower surface which is generally convex and arcuate in cross section, and which decreases in thickness, a... | 12/09/2008 |
| 7443677 | Heat dissipation device A heat dissipation device comprises a first heat sink (10) for thermally contacting with an electronic device, a second heat sink (20) mounted on the first heat sink, heat pipes (40) connecting with both the first and second heat sinks. The heat... | 10/28/2008 |
| 7443679 | Heat dissipating device having a fin also functioning as a fan holder A heat dissipating device for cooling a heat-generating electronic device, includes a heat sink assembly (10) and a fan (20) mounted to a side of the heat sink assembly. The heat sink assembly includes a heat spreader (12), a plurality of fins (... | 10/28/2008 |
| 7443682 | Computer system A computer system includes a chassis (10), a securing panel (30), a motherboard (20), and a heat sink (40). The chassis includes a plate (12) having at least one positioning post (14) extending upwardly therefrom. The securi... | 10/28/2008 |
| 7443685 | Conductive heat transfer for electrical devices from the solder side and component side of a circuit card assembly An apparatus for conductive heat transfer for electrical devices from the solder side of a circuit card assembly can significantly reduce the component temperature, thereby maintaining the electrical device below its thermal limit. The apparatus comprises a thermall... | 10/28/2008 |
| 7441593 | Protective cover for heat-conductive material of heat sink A protective cover for protecting heat-conductive material of a heat sink includes a first plate with an opening to enclose the heat-conductive material and a second plate foldable to the first plate. Such that the heat-conductive material can be precisely protected... | 10/28/2008 |
| 7443669 | Heat dissipating device for data storage device A heat dissipating device for a data storage device includes a bracket configured for receiving the data storage device, a heat sink received in the bracket configured for dissipating heat from the data storage device, and a fastener. The bracket has two sidewalls. ... | 10/28/2008 |
| 7442903 | Heat sink for electronic device A heat sink for the electronic device is disclosed. The heat sink comprises a hub, a plurality of first supporting elements and a frame. A fan is axially connected to the hub. The first supporting elements are positioned along the periphery of the hub and protrude o... | 10/28/2008 |
| 7443680 | Heat dissipation apparatus for heat producing device A heat dissipating apparatus for dissipating heat generated by heat producing device, includes a base, a fin set and an axial fan. The base is secured on the heat producing device. The fin set comprises a plurality of fins arranged on the base; the fins are spaced a... | 10/28/2008 |
| 7440282 | Heat sink electronic package having compliant pedestal An electronic package is provided for dissipating heat away from electronic devices. The package includes a substrate and electronic devices mounted on the substrate. The package also has a thermally conductive heat sink assembled over the electronic device. The hea... | 10/21/2008 |
| 7440284 | Holding device for a heat sink A holding device for a heat sink being attached to a circuit board includes a back plate and a frame member. The back plate provides a plurality of fixing posts with a free end of the respective fixing post having a neck recess piecing the circuit board and each of ... | 10/21/2008 |
| 7440276 | Cooling-fan-free system module A cooling-fan-free system module includes a housing unit having a front and a rear case together defining a receiving space therebetween, and the rear case being highly thermal-conductive; a circuit module received in the receiving space of the housing unit and incl... | 10/21/2008 |
| 7438844 | Thermal interface material and method for manufacturing same A thermal interface material includes a macromolecular material having two opposite Surfaces, and a plurality of carbon nanotubes each having two opposite ends embedded in the macromolecular material. The two opposite ends of the carbon nanotubes extend out of the t... | 10/21/2008 |
| 7440280 | Heat exchange enhancement A heat exchange structure includes a plurality of elongated air ducts. The heat exchange structure has an exterior heat exchange surface and interior heat exchange surfaces, the interior surfaces being in the elongated air ducts. The heat exchange structure includes... | 10/21/2008 |
| 7440283 | Thermal isolation devices and methods for heat sensitive downhole components A device for isolating a heat sensitive component includes a heat sink positioned adjacent to the heat sensitive component. The heat sink has a stepped thermal response to an applied heat. The heat sink may include two or more thermally decoupled masses. Thermal dec... | 10/21/2008 |
| 7436672 | Semiconductor device and method of manufacture thereof A transfer mold type power module (“TPM”) is provided with a projection at each of the four corners on its front main surface. The TPM is also provided a first screw hole at its center. A shielding plate is provided with a second crew hole in a position that cor... | 10/14/2008 |
| 7436664 | Electronic appliance In an electronic appliance, a base is thermally fused by a heat generating component. On the base, a heat dissipating fin group including heat dissipating fins each extending in a Y direction is arranged in spaced relation in an X direction. An exhaust fan and a par... | 10/14/2008 |
| 7436673 | Heat sink fixing assembly A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the e... | 10/14/2008 |
| 7436671 | Retention module for a heat sink A retention module (10) for securing a heat sink (20) to a printed circuit board (30) includes a pair of carriage arms (12) separated by a space and a connecting wall (14) interconnecting opposite rear free ends of the carriage arm... | 10/14/2008 |
| 7436669 | 3D multi-layer heat conduction diffusion plate A 3D multi-layer heat conduction diffusion plate comprises at least one super conduction diffusion plate which is capable of quickly conducting heat energy, has a short cooling time, and can dissipate heat to a surrounding environment. A soft and bendable material c... | 10/14/2008 |
| 7433191 | Thermal contact arrangement A thermal contact arrangement. The thermal contact arrangement may mitigate or reduce migration over time of a thermal interface material positioned between a chip and a heat sink. The thermal contact arrangement may include a first zone formed on a first area of th... | 10/07/2008 |
| 7431071 | Fluid circuit heat transfer device for plural heat sources A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources. The evaporator can be an integral vessel made of thermally conductive ... | 10/07/2008 |
| 7431072 | Heat sink with increased cooling capacity and semiconductor device comprising the heat sink A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of th... | 10/07/2008 |
