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| Number | Title | Issue Date |
| 6705389 | Reconfigurable system and method for cooling heat generating objects A method and system are disclosed for cooling a heat generating object. A coolant is passed through a heat exchanger so that heated air passing through a first portion of the heat exchanger is cooled. A fan unit is selectively positioned relative to the heat exchang... | 03/16/2004 |
| 6707669 | Heat dissipation apparatus A heat dissipation apparatus for a computer system having a heat source. The heat dissipation apparatus includes an outlet, a temperature gradient maintaining device and an unpowered fan. The outlet is disposed on one side of the computer system. A thermal convectio... | 03/16/2004 |
| 6702000 | Heat sink apparatus, blower for use therein and electronic equipment using the same apparatus A blower is provided for effectively cooling heat generating parts in a casing of a personal computer and so on, with a heat sink apparatus using the blower and an electronic equipment using the heat sink apparatus. The blower comprises a fan and an outer... | 03/09/2004 |
| 6698499 | Cooling device and method A cooling device includes a heat sink assembly that may also form a housing surrounding a chamber. The housing may be constructed of a plurality of cooling vanes which have elongated openings therebetween allowing air to pass between and cool the vanes. T... | 03/02/2004 |
| 6700781 | Heat-dissipating module for removing heat generated from heat-generating device A heat-dissipating module includes a lower housing, a first magnet portion, a second magnet portion and a circuit board. The lower housing is made of a highly thermal conductive material. The upper housing has an opening in the center thereof, wherein whe... | 03/02/2004 |
| 6691770 | Cooling apparatus A heat sink comprises a core member comprising at least one core member first surface. The core member first surface is adapted to contact or be located adjacent at least a portion of the heat source. At least one outer peripheral surface is located on th... | 02/17/2004 |
| 6690577 | Air guide An adjustable air guide includes a first hollow element located adjacent to an aperture in a wall of an enclosure to allow air to pass freely there through. At least a first rigid adjustable rigid hollow pipe, a first hollow elbow, a second rigid adjustab... | 02/10/2004 |
| 6688379 | Heat dissipation device with high efficiency The heat dissipation device includes a frame and an impeller. The frame has an inlet and an outlet, in which the inlet has a noncircular shape. The inlet can be provided with a blocking board so as to be noncircular. The blocking board suppresses airflow ... | 02/10/2004 |
| 6687123 | Electronic system having electronic apparatus with built-in heat generating component and cooling apparatus to cool the electronic apparatus A cooling apparatus includes a cooling module having an electrically-driven cooling device. The cooling module is adapted to couple with a portable electronic apparatus having a heat generating component and a first connector to supply power. A second con... | 02/03/2004 |
| 6681840 | Heat sink with enhanced heat spreading and compliant interface for better heat transfer Heat dissipation systems and structures which are employed in the cooling of electronic devices and/or semiconductor integrated-circuit chips which are installed in computer and/or communications systems. Moreover, disclosed is a method for implementing t... | 01/27/2004 |
| 6681842 | Cooling apparatus A heat sink comprises a core member comprising at least one first surface adapted to contact at least a portion of the heat source. An one outer peripheral surface is located on the core member. At least one cooling fin device comprising an inner peripher... | 01/27/2004 |
| 6682319 | Motor fan unit attachment structure and radiator assembly fitted with a motor fan unit By inserting an insertion section provided on a lower end of a motor fan unit into a wedge shaped hole provided in a lower part of a radiator, a motor fan unit is attached to a side of the radiator to the vehicle rear. A vehicle front perpendicular surfac... | 01/27/2004 |
| 6678158 | Heat sink assembly with fixing device A heat sink assembly includes a fixing device (10), a fin member (40), and a fan (50). The fixing device is integrally formed by extruding aluminum. The fixing device includes a base (12), two side plates (16) extending upwardly from opposite sides of the... | 01/13/2004 |
| 6672374 | Heat sink coupling device A heat sink coupling device, specifically a heat sink coupling device utilized to cool and reduce the temperature of a central processing unit in a computer, comprised of a coupling base, the top surface of which provides for the selectable installation o... | 01/06/2004 |
| 6668910 | Heat sink with multiple surface enhancements A heat sink for cooling electrical or electronic devices comprises a base plate having a top surface and a bottom surface for attaching to the electronic device. At least two vertical plates are affixed to and extend substantially perpendicularly from the... | 12/30/2003 |
| 6671172 | Electronic assemblies with high capacity curved fin heat sinks An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air f... | 12/30/2003 |
| 6667884 | Heat dissipating assembly A heat dissipating assembly includes a CPU (35) mounted on a motherboard (30), a fan (20), two clips (60), a heat sink (10), two fasteners (50), a back plate (40) and two posts (70). The heat sink includes a base (12) and a plurality of fins (14). Two ear... | 12/23/2003 |
| 6659169 | Cooler for electronic devices An apparatus and method for a centrifugal pump (1) for pumping sensitive biological fluids which includes (i) an integral impeller and rotor (21) which is entirely supported and rotated magnetically by electromagnets (52, 54), (ii) a pump housing (12, 14)... | 12/09/2003 |
| 6658857 | Portable thermoelectric cooling and heating appliance device and method of using A portable thermoelectric cooling and heating appliance device and associated method of using the device are disclosed. The device comprises: a generally rectangular box, a hinge, a generally rectangular lid, a locking means, and a power cord. The box has... | 12/09/2003 |
| 6657862 | Radial folded fin heat sinks and methods of making and using same Non-prismatic radial folded fin heat sinks include fin arrays comprised of folded fins joined to a thermally conductive central core. The fin arrays can have either a constant or variable bend radius. The non-prismatic radial folded fins can be made by st... | 12/02/2003 |
| 6657860 | Heat dissipating device and computer A heat sink, cooling member, semi-conductor substrate cooling system, computer and method for providing sufficient cooling performance through a heat sink is provided. In part, there is provided a heat sink having a radiating portion for diffusing the hea... | 12/02/2003 |
| 6657858 | Housing for data storage devices or for accommodating such devices The invention is related to the housing of motorized driven data storage device(s) 20 or accommodating such device(s), comprising one or more drive assembly(s) 103, comprising one or more data storage media(s) and one or more drive motor(s) Together with ... | 12/02/2003 |
| 6654243 | Heat dissipation of low flow resistance in a notebook computer The present invention provides a heat dissipation apparatus for a notebook computer with a low flow resistance design. The notebook computer has a CPU, a heat dissipation apparatus, an air inlet, and an air outlet. The heat dissipation apparatus includes ... | 11/25/2003 |
| 6651734 | Multi-element heat dissipating module A heat dissipating module comprises a large heat dissipating element having a base and a first fin set on an upper side of the base; a lateral side of the base having a plurality of holes; a plurality of small heat dissipating elements; each small heat di... | 11/25/2003 |
| 6654245 | Cooler for electronic unit and electronic unit A CPU cooler is provided for effectively cooling, for example, a CPU chip mounted in a notebook-sized personal computer. An aluminum die casting is equipped with a right portion for covering a CPU package, and a left portion which is coplanar with the rig... | 11/25/2003 |
| 6654247 | Computer heat dissipating structure A computer heat dissipating structure of the invention is mounted over a computer main board inside a computer principal unit to dissipate the heat irradiated by at least a principal heat source and a secondary heat source. The computer heat dissipating s... | 11/25/2003 |
| 6654246 | Heat sink assembly with fixing members A heat sink assembly includes a fan (10), two fixing members (20), a heat sink (30), and a plurality of screws (40, 50). The fan is generally parallelepiped, and defines four mounting holes (102) in corners thereof. Each fixing member has a first plate (2... | 11/25/2003 |
| 6648065 | Heat-dissipating module A heat-dissipating module includes a heat sink and a fan device. The fan device may be disposed on the heat sink, or inserted into the heat sink to reduce the height. The fan device includes a first rotor blade and a second rotor blade. The first rotor bl... | 11/18/2003 |
| 6650540 | Cooling unit having a heat-receiving section and a cooling fan, and electronic apparatus incorporating the cooling unit A cooling unit having a heat-receiving section, a heat sink and a cooling fan. The heat-receiving section opposes a printed wiring board across a heat generating component mounted on the board. The section receives heat from the heat generating component.... | 11/18/2003 |
| 6650538 | Fin heat sink and airflow tube assembly employing annular airflows, and methods of fabrication thereof A cooling apparatus and method of fabrication are provided for cooling one or more heat generating components. The cooling apparatus includes a heat sink structure and an airflow tube assembly. In one embodiment, the heat sink structure has a first surfac... | 11/18/2003 |
| 6650541 | Fan-securing device for use with a heat transfer device A fan-securing device secures a fan to a heat transfer device that allows for the rapid removal of the fan without disturbing the remainder of the heat transfer device. The fan-securing device includes a base, a fastener for securing the body base to the ... | 11/18/2003 |
| 6643131 | Wind guide device for CPU cooler The present invention is to provide a wind guide device for a cooling fan mounted on a CPU of a computer comprising a first shroud and a second shroud. A first opening at one side of the first shroud having the fan mounted thereon is coupled to a vent ope... | 11/04/2003 |
| 6643129 | Cooling unit including fan and plurality of air paths and electronic apparatus including the cooling unit A cooling unit having a fan and a heat sink thermally connected to a heat generating component. The heat sink includes a receptacle in which the fan is contained, a plurality of air paths which are arranged to surround an outer peripheral portion of the f... | 11/04/2003 |
| 6640883 | Computer heat sink A computer heat sink, it especially suits heat sinking of various chip sets or processors which may generate high temperature during running, and has the effect of better efficiency of heat sinking and inexpensiveness of production. It includes many heat ... | 11/04/2003 |
| 6637501 | Heat dissipation device The present heat dissipation device is provided with a fan frame and a blade structure. The fan frame includes an air inlet, an air outlet, and a curved portion. The air inlet has a non-circular indentation in the vicinity of the curved portion correspond... | 10/28/2003 |
| 6637502 | Heat sink with converging device A cooling system has a heat sink having a plurality of fins. A fan is positioned near the heat sink to blow air between the fins. A flow converging device is positioned between the fins and the fan, to cause air from the fan to converge on a predetermined... | 10/28/2003 |
| 6633484 | Heat-dissipating devices, systems, and methods with small footprint An enhanced heat dissipation system and a method to extract heat from an integrated circuit device include a thermally conductive core having upper and lower outer surface areas. The system further includes a first conductive ring having a first array of ... | 10/14/2003 |
| 6631756 | High performance passive cooling device with ducting A passive cooling device for removing waste heat from a component is disclosed. The passive cooling device includes a heat mass and a stem extending outward therefrom and including a plurality of fins formed in the stem. The stem includes a plurality of s... | 10/14/2003 |
| 6625021 | Heat sink with heat pipes and fan A heat sink provides efficient heat transfer from a heat-producing semiconductor device. Heat pipes project from a spreader plate in contact with the device and distribute heat to multiple cooling fins. The fins are arranged for maximum contact with the a... | 09/23/2003 |
| 6622783 | Self-fixturing fan shroud A self-fixturing fan shroud (12) for use with a heat exchanger assembly (13), the heat exchanger assembly (13) includes an upper horizontal surface (16), a lower, upwardly opening, horizontal channel (18), and at least one core (14 or 15) extending betwee... | 09/23/2003 |
