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| Number | Title | Issue Date |
| 7231963 | Heat dissipation device with interlocking fin plates A heat dissipation device includes a plurality of fin plates (1) and a pair of heat pipes (30). Each fin plate includes a first plate (10) and a second plate (20). The first plate forms a first fastener (15) at an edge thereof and ... | 06/19/2007 |
| 7233492 | Cooling systems and methods for same The described embodiments relate to devices and cooling systems for same. One exemplary device includes a housing and at least one fan unit configured to move air through the housing. The device also includes a fluid channel comprising an impeller for moving fluid c... | 06/19/2007 |
| 7231961 | Low-profile thermosyphon-based cooling system for computers and other electronic devices This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to eva... | 06/19/2007 |
| 7228889 | Heat dissipation device A heat dissipation device includes a seat, a fin set arranged on the seat, a fan, a fan mounting device having the fan mounted thereto, and a cover covering the fin set. The fan has a portion thereof located above the fin set. An opening is defined in fan mounting d... | 06/12/2007 |
| 7230832 | Cooled electronic assembly and method for cooling a printed circuit board A cooled electronic assembly includes an integrated-circuit device carrier (such as a printed circuit board), a device (such as a flip chip), a liquid pump, a molding material, a heat exchanger, and a cover. The device and the liquid pump are electrically connected ... | 06/12/2007 |
| 7229104 | Shrinkage-free sealing structure of heat pipe A shrinkage-free sealing structure of a heat pipe. The sealing structure is in the form of a double-layered structure formed by transversely pressing a first side of an open end of the heat pipe towards a second side of the open end and transversely pressing the sec... | 06/12/2007 |
| 7227752 | Heat dissipation device A heat dissipation device includes a base, at least one heat pipe having an evaporating section and a condensing section, at least one reinforcing member without phase-change therein, and a plurality of fins. The evaporating section of the heat pipe contacts the bas... | 06/05/2007 |
| 7227749 | Thermal bus load control management for electronic systems An electronic apparatus comprising a housing having a plurality of electronic components and two or more separate heat transfer systems each thermally communicating with different one or more of said electronic components is characterized by at least one central hea... | 06/05/2007 |
| 7227753 | Method and apparatus for cooling heat-generating structure An apparatus includes a heat receiving portion which receives heat within a footprint from a heat generating structure, and a cooling arrangement which causes flow of a coolant that absorbs heat at the heat receiving portion, the cooling arrangement being disposed i... | 06/05/2007 |
| 7225861 | Bubble cycling heat exchanger A bubble cycling heat exchanger includes a closed fluid loop in contact with a heat absorbing source through a heat conducting block. The loop has a bubble generator. An expanding area for generating bubbles is installed at the loop. The loop is also formed with a r... | 06/05/2007 |
| 7222660 | Cabinet with an environmentally-sealed air-to-air heat exchanger A cabinet which utilizes an air-to-air heat exchanger to remove heat generated from within the cabinet prevents water and dust from entering the air-to-air heat exchanger by forcing cooler external air up along a first side wall, through the air-to-air heat exchange... | 05/29/2007 |
| 7222661 | Cooling module A cooling module includes a thermal conductive member. An endoergic chamber, a radiative chamber and a circulation pump chamber are defined along the thermal conductive member. The thermal conductive member contacts a heat generating object outside the endoergic cha... | 05/29/2007 |
| 7224059 | Method and apparatus for thermo-electric cooling Embodiments of the present invention provide a method, apparatus and system for absorbing heat from an active side of a die by a plurality of cold conductive elements embedded in said die, and releasing said absorbed heat by a plurality of hot conductive elements em... | 05/29/2007 |
| 7224585 | Liquid-cooled heat sink assembly A liquid-cooled heat sink assembly for cooling down an electronic component includes a main body (20) defining a central chamber (21) therein and having a number of fins (22) on an outside thereof, liquid coolant received in the central chamber,... | 05/29/2007 |
| 7219714 | Multiple component field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components A field-replaceable active pumped liquid heat sink module includes a front portion and a back portion, each including a liquid pump, a radiator, an optional receiver, and a cold plate heat exchanger, all of which are connected together in a liquid pump loop through ... | 05/22/2007 |
| 7219715 | Cooling systems incorporating heat transfer meshes Apparatus for cooling of an electrical element package, comprising in combination structure including a hollow body, defining a cavity containing cooling fluid, the structure defining an opening or passage whereby direct contact of the cooling fluid with the package... | 05/22/2007 |
| 7219504 | Heat dissipation system with an air compressing mechanism A heat dissipation system, including an air compressor mechanism disposed in a body shell, which has an inlet and enlarged outlet. An air is directed to the air compressor mechanism, and compressed. Upon exhaling the body shell, a compressed air will rapidly expand ... | 05/22/2007 |
| 7218519 | Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels Embodiments of the present invention include an apparatus, method, and system for a thermal management arrangement having a low heat flux channel flow coupled to high heat flux channels. ... | 05/15/2007 |
| 7218996 | Method for thermally managing a room In a method for thermally managing a room with at least one air moving device having a temperature actuator and an airflow rate actuator, a temperature of airflow at a first location in the room is received and compared with a first predetermined temperature range a... | 05/15/2007 |
| 7218518 | Heat dissipation device with heat pipes A heat dissipation device with heat pipes is described. The heat dissipation device has at least one L-shaped heat pipe, a plurality of heat fins, and a heat sink base. One end of the L-shaped heat pipe is coupled to one heat pipe fixing trench of the heat sink base... | 05/15/2007 |
| 7216987 | Optical modulator holder optical device and projector An optical modulator holder 4402 has a middle frame 4409 for supporting a liquid crystal panel 441, a pair of frame members 4405 and 4406 for sandwiching the middle frame 4409 supporting the liquid crystal panel 441, ... | 05/15/2007 |
| 7216695 | Method of operating a thermal management system A spray cooling system for extreme environments for providing a desired enclosed environment for electronic devices regardless of external environmental conditions. The spray cooling system for extreme environments includes an enclosure that isolates the electronic ... | 05/15/2007 |
| 7218517 | Cooling apparatus for vertically stacked printed circuit boards An apparatus, system and method for cooling vertically stacked printed circuit boards (PCBs). In one embodiment, a first PCB is disposed within a substantially enclosed lower chamber inside a PCB containment housing. A second PCB is disposed above the first PCB with... | 05/15/2007 |
| 7218000 | Liquid solder thermal interface material contained within a cold-formed barrier and methods of making same In a process of making a container barrier upon a heat spreader, the heat spreader is augmented with a cold-formed o-ring, and thereafter, it is bonded to a die. A liquid solder is filled into the space created by the o-ring. The thermal interface material can also ... | 05/15/2007 |
| 7213636 | Cooling assembly with impingement cooled heat sink The subject invention provides a cooling assembly for removing heat from an electronic device. The cooling assembly includes a heat sink having a base plate and a plurality of fins extending upwardly from the base plate to a top extremity. A nozzle directs a flow of... | 05/08/2007 |
| 7215548 | Heat dissipating device having a fin also functioning as a fan duct A heat dissipating device for cooling a number of electronic devices, includes a heat sink assembly (10) and a fan (20) mounted to a side of the heat sink assembly. The heat sink assembly includes a heat spreader (12), a plurality of fins (14... | 05/08/2007 |
| 7215019 | Semiconductor chip assembly with pillar press-fit into ground plane A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, and a ground plane. The pillar is press-fit into an opening in the ground plane, and the ground plane is electri... | 05/08/2007 |
| 7215546 | Pump, electronic apparatus, and cooling system The present invention provides a cooling pump, an electronic apparatus, and a cooling system in which positioning between a heat generating unit and a cooling pump can be achieved easily. The cooling pump according to the invention includes: a rotor having a disk-sh... | 05/08/2007 |
| 7215552 | Airflow redistribution device In general, in one aspect, the disclosure describes an apparatus to redistribute airflow throw slots of a chassis that houses boards. The apparatus includes at least one restriction region to limit airflow therethrough. The apparatus further includes an open region ... | 05/08/2007 |
| 7215547 | Integrated cooling system for electronic devices The present invention provides a method for producing an electronic assembly and an electronic assembly with an integrated cooling system for dissipating heat. The electronic assembly comprises a base; and at least one electrical component attached to the base. The ... | 05/08/2007 |
| 7214885 | Liquid dispensing system having a modular cord set A liquid dispensing system equipped with a modular cord set for powering an electrically-operated dispensing module of the system. The cord set includes a plug removably inserted into receptacle extending through a manifold of the system. The manifold heats and supp... | 05/08/2007 |
| 7210832 | Illumination apparatus of light emitting diodes and method of heat dissipation thereof An illumination apparatus of light emitting diodes and method of heat dissipation thereof are provided. The present illumination apparatus is associated with a loop heat pipe (LHP) device. The LHP device includes a condenser communicating with an evaporator. The ill... | 05/01/2007 |
| 7212403 | Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection An apparatus and method of cooling a plurality of electronic components in a housing using one or more fans cooperating with baffles or ducts for directing a stream of air sequentially to the components or heat exchangers for the components. Direction of the air str... | 05/01/2007 |
| 7212406 | Cooling of electrical components with split-flow closed-end devices A cooling system (11) is provided for electrical components (10, 90) in which passageways (21) are inserted in non-magnetic cores of the electrical components, and in which the passageways (21) provide both inflow and outflow of a cooling... | 05/01/2007 |
| 7212404 | Integrated heat sink device An integrated heat sink device, which is utilized to dissipate the heat generated by heat-generating elements with different angles of radiation surface (for instance, CPU and display chip are with radiation surfaces at 180° and 90°), is provided. The integrated h... | 05/01/2007 |
| 7209357 | Universal modular power supply carrier A universal modular power supply carrier mounts different sized power supplies within a substantially rectangular body designed for thermal and electromagnetic emissions control. The power supplies are preferably secured within the carrier body. Input connectors may... | 04/24/2007 |
| 7204615 | LED light with active cooling An LED light assembly includes a housing, an LED disposed in the housing, a heat dissipating structure and a fluid current generator. The LED is in thermal communication with the heat dissipating structure and includes a flow path surface. The fluid current generato... | 04/17/2007 |
| 7206207 | Heat dissipation device assembly A heat dissipation device assembly includes a heat dissipation device (10) and a retaining device (20). The heat dissipation device includes a heat sink and a heat receiver (11) provided below the heat sink. The heat receiver includes an upper s... | 04/17/2007 |
| 7204299 | Cooling assembly with sucessively contracting and expanding coolant flow A fluid heat exchanger assembly having an upper wall and a lower wall extending between the inlet and the outlet for establishing a direction of flow to cool an electronic device. A plurality of projections extend linearly transversely across the direction of flow t... | 04/17/2007 |
| 7201012 | Remedies to prevent cracking in a liquid system A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are desig... | 04/10/2007 |
